Global Standards for the Microelectronics Industry
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Title | Document # | Date |
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GUIDELINES FOR REPORTING AND USING ELECTRONIC PACKAGE THERMAL INFORMATION |
JESD51-12.01 | Nov 2012 |
This document provides guidelines for both reporting and using electronic package thermal information generated using JEDEC JESD51 standards. By addressing these two areas, this document can be used as the common basis for discussion between electronic package thermal information suppliers and users. Free download. Registration or login required. |