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Title	Document #	Date
Guideline for Characterizing Solder Bump Electromigration Under Constant Current and Temperature Stress	JEP154A	Mar 2024
This publication describes a method to test the electromigration susceptibility of solder bumps, including other types of bumps, such as solder capped copper pillars, used in flip-chip packages. Committee(s): JC-14, JC-14.1 Free download. Registration or login required.

Title

Document #

Date

Guideline for Characterizing Solder Bump Electromigration Under Constant Current and Temperature Stress

JEP154A

Mar 2024

This publication describes a method to test the electromigration susceptibility of solder bumps, including other types of bumps, such as solder capped copper pillars, used in flip-chip packages.

Committee(s): JC-14, JC-14.1

Free download. Registration or login required.

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Guideline for Characterizing Solder Bump Electromigration Under Constant Current and Temperature Stress

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