Global Standards for the Microelectronics Industry
Standards & Documents Search
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Title | Document # | Date |
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Registration - Punch-Singulated, Fine Pitch, Square, Very Thin, Leadframe-Based Quad No-Lead Staggered Dual-Row (With Optional Thermal Enhancements) QFN Package Family. HVF-PQFN. |
MO-267-B | Feb 2006 |
Item 11.11-745 Patents(): Amkor, ASAT, National Semiconductor: See Outline Free download. Registration or login required. |