Global Standards for the Microelectronics Industry
Standards & Documents Search
Title | Document # | Date |
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Registration - Plastic Dual Small Outline, Flat, 2 Terminal Package. PDSO-F2. |
DO-221B | Aug 2018 |
Item 11.10-455. Free download. Registration or login required. |
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Registration - Plastic Very Very Thin, Ultra Thin and Extremely Thin, Fine Pitch Dual, Small Outline, Non-leaded Package Family. (W, U, X)F-PSON. |
MO-252D | Mar 2010 |
Item 11.11-830. Free download. Registration or login required. |
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Registration - Small Scale, Plastic, Ultra, Extra, and Super Thin, Fine Pitch, Dual Small Outline, No Lead Package. (U, X1, X2)F-PSON. |
MO-287-A | Sep 2007 |
Item 11.11-777 Free download. Registration or login required. |
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Registration - Thermally Enhanced Low Profile Plastic Dual, Flat No Lead Package. L-PDFP-N. Item 11.10-412 |
MO-232-A | Aug 2001 |
Free download. Registration or login required. |
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Registration - Thermally Enhanced Plastic Very Thin Dual Row Fine Pitch Quad Flat No Lead Package. HP-VFQFP-N. Item 11.11-680 |
MO-239-B | Nov 2002 |
Free download. Registration or login required. |