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Displaying 1 - 5 of 17 documents. Show 5 | 10 results per page.

Title	Document #	Date
Registration - Plastic Dual Small Outline, Flat, 2 Terminal Package. PDSO-F2.	DO-221B	Aug 2018
Item 11.10-455. Committee(s): JC-11, JC-11.10 JEP95 Registrations Main Page Free download. Registration or login required.
Design Requirements - Small Scale Plastic Quad and Dual Inline, Square and Rectangular, No-Lead Packages (With Optional Thermal Enhancements). Small Scale (QFN/SON).	DG-4.20F	Sep 2016
Item 11.2-820(S) Committee(s): JC-11, JC-11.2 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - 240 Pin DDR3 DIMM (Dual Inline Memory Module) Family with 1.00 mm pitch. DIM	MO-269J	Apr 2014
Item 11.14-163 Committee(s): JC-11, JC-11.14 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Thermally Enhanced, 8 Lead, 1.27 & 0.65 mm Pitch, Thin, Very Very thin, and Ultra Thin Plastic Dual Flat, No Lead Package. H(T, W, U)-PSON.	MO-240C	Aug 2012
Item 11.11-860 Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - 244 Pin DDR2/DDR3 Mini Dual-In-Line Memory Module (DIMM) Family, 0.60 mm Lead Centers.	MO-244D	Jul 2012
Item No. 14-136 Patents(): Hitachi: 5,227,664 Committee(s): JC-11, JC-11.14 JEP95 Registrations Main Page Free download. Registration or login required.

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