Global Standards for the Microelectronics Industry
Standards & Documents Search
Displaying 1 - 3 of 3 documents.
Title | Document # |
Date![]() |
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Registration - Small Scale, Plastic, Ultra, Extra, and Super Thin, Fine Pitch, Dual Small Outline, No Lead Package. (U, X1, X2)F-PSON. |
MO-287-A | Sep 2007 |
Item 11.11-777 Free download. Registration or login required. |
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Registration - High Profile Plastic Thermally Enhanced Enlarged Pitched Dual Flat No Lead Package. HE-PDFP-N. Item 11.11-638. |
MO-245-A | Sep 2003 |
Free download. Registration or login required. |
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Registration - Thermally Enhanced Low Profile Plastic Dual, Flat No Lead Package. L-PDFP-N. Item 11.10-412 |
MO-232-A | Aug 2001 |
Free download. Registration or login required. |