Global Standards for the Microelectronics Industry
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Displaying 1 - 5 of 7 documents. Show 5 results per page.
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Document # | Date |
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Registration - DDR1/DDR2/DDR3, 144 Pin, 16b/32b Small Outline Dual Inline Memory Module (SODIMM), 0.8 mm Pitch, Socket Outline. |
SO-008B | Oct 2012 |
Item 11.14-141 Free download. Registration or login required. |
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Registration - DDR and DDR2 Micro DIMM Mezzanine, 214 pin, 0.4 mm Lead Centers. |
MO-260-C | Dec 2006 |
Item 11.14-101 Free download. Registration or login required. |
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Registration - Connector Outline for DDR and DDR2 Micro DIMM Mezzanine, 214 pin, 0.4 mm Lead Centers. Item 11.14-076. |
SO-004A | May 2005 |
Free download. Registration or login required. |
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DIMM Design Files |
DIMM Homepage | Dec 2003 |
These reference files are registered as industry accepted examples for use by manufacturers. Please be sure to read the license agreement prior to downloading files. Design Files (Gerber Files) have been developed in accordance with the JEDEC Manual of Operation and Procedure. |
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DEFINITION OF THE SSTU32864 1.8 V CONFIGURABLE REGISTERED BUFFER FOR DDR2 RDIMM APPLICATIONS: |
JESD82-7A | Oct 2004 |
This standard defines standard specifications of dc interface parameters, switching parameters, and test loading for definition of the SSTU32864 configurable registered buffer for DDR2 RDIMM applications. The purpose is to provide a standard for the SSTU32864 logic device, for uniformity, multiplicity of sources, elimination of confusion, ease of device specification, and ease of use. Free download. Registration or login required. |