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Title	Document #	Date
NAND Flash Interface Interoperability	JESD230G	Oct 2024
This standard was jointly developed by JEDEC and the Open NAND Flash Interface Workgroup, hereafter referred to as ONFI. This standard defines a standard NAND flash device interface interoperability standard that provides means for system be designed that can support Asynchronous SDR, Synchronous DDR and Toggle DDR NAND flash devices that are interoperable between JEDEC and ONFI member implementations. A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-42, JC-42.4 Free download. Registration or login required.
MCP and Discrete e•MMC, e•2MMC, and UFS Release Number: 33	MCP3.12.1-1	Jun 2024
Item 142.12 This section provides electrical interface items related to Multi-Chip Packages (MCP) and Stacked-Chip Scale Packages (SCSP) of mixed memory technologies including Flash (NOR and NAND), SRAM, PSRAM, LPDRAM, USF, etc. These items include die-on-die stacking within a single encapsulated package, package-on-package or module-in-package technologies, etc. The Section also contains Silicon Pad Sequence information for the various memory technologies to aid in the design and electrical optimization of the memory sub-system or complete memory stacked solution. A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-64.2 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required.
184 Pin Unbuffered DDR SDRAM DIMM	MODULE4.5.10	May 2021
Release No.31 This revision contains terminology updates only. A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-42, JC-42.3 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required.
240-Pin PC3-6400/PC3-8500/PC3-10600/PC3-12800/PC3-14900/PC3-17000 DDR3 SDRAM Unbuffered DIMM Design Specification	MODULE4.20.19	May 2021
Release No. 31. Item 2131.03, 2078.04, 2131.06 This revision contains terminology updates only. A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-45, JC-45.2, JC-45.3 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required.
240-Pin PC2-5300/PC2-6400 DDR2 SDRAM Unbuffered DIMM Design Specification	MODULE4.20.13	May 2021
Release 31. Item 2167.05 This revision contains terminology updates only. A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-45, JC-45.2, JC-45.3 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required.

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