Global Standards for the Microelectronics Industry
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Title |
Document # | Date |
|---|---|---|
Guideline for Characterizing Solder Bump Electromigration Under Constant Current and Temperature Stress |
JEP154A | Mar 2024 |
This publication describes a method to test the electromigration susceptibility of solder bumps, including other types of bumps, such as solder capped copper pillars, used in flip-chip packages. A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Free download. Registration or login required. |
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