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COPLANARITY TEST FOR SURFACE-MOUNT SEMICONDUCTOR DEVICES

Status: Reaffirmed February 2023 		JESD22-B108B Sep 2010

The purpose of this test is to measure the deviation of the terminals (leads or solder balls) from coplanarity at room temperature for surface-mount semiconductor devices. This test method is applicable for inspection and device characterization. If package warpage or coplanarity is to be characterized at reflow soldering temperatures, then JESD22-B112 should be used.

Committee(s): JC-14, JC-14.1

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