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Displaying 1 - 3 of 3 documents.

Title	Document #	Date
Standard - SMT DDR3 DIMM Socket Coplanarity Measurement Gauge. Item 11.14-124.	GS-009A	Jan 2009
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Standard Practices and Procedures - Reflow Flatness Requirements for Ball Grid Array Packages. Item 11.2-783	SPP-024A	Mar 2009
This document states the procedures for using component land side flatness during simulated reflow as an alternative to coplanarity in certain limited cases for BGA components. Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
COPLANARITY TEST FOR SURFACE-MOUNT SEMICONDUCTOR DEVICES Status: Reaffirmed February 2023	JESD22-B108B	Sep 2010
The purpose of this test is to measure the deviation of the terminals (leads or solder balls) from coplanarity at room temperature for surface-mount semiconductor devices. This test method is applicable for inspection and device characterization. If package warpage or coplanarity is to be characterized at reflow soldering temperatures, then JESD22-B112 should be used. Committee(s): JC-14, JC-14.1 Free download. Registration or login required.

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