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This document and the associated series of documents are intended to promote the continued development of modeling methods, while providing a coherent framework for their use by defining a common vocabulary to discuss modeling, creating requirements for what information should be included in a thermal modeling report, and specifying modeling procedures, where appropriate, and validation methods. This document provides an overview of the methodology necessary for performing meaningful thermal simulations for packages containing semiconductor devices. The actual methodology components are contained in separate detailed documents.

Committee(s): JC-15, JC-15.1

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