Global Standards for the Microelectronics Industry
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TWO-RESISTOR COMPACT THERMAL MODEL GUIDELINE
This document specifies the definition and construction of a two-resistor compact thermal model (CTM) from the JEDEC junction-to-case and junction-to-board thermal metrics. The guidance provided in this document only applies to thermal metrics defined in JEDEC standards JESD51-8 and JESD51-12. The scope of this document is limited to single-die packages that can be effectively represented by a single junction temperature.
DELPHI COMPACT THERMAL MODEL GUIDELINE
This guideline specifies the definition and lists acceptable approaches for constructing a compact thermal model (CTM) based on the DELPHI methodology. The purpose of this document is twofold. First, it aims to provide clear guidance to those seeking to create DELPHI compact models of packages. Second, it aims to provide users with an understanding of the methodology by which they are created and validated, and the issues associated with their use.