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Displaying 1 - 6 of 6 documents. Show 5 results per page.

Title	Document #	Date
Registration - Ceramic Quad Flatpack Package (CQFP) Tray for Handling and Shipping. Item 11.5-259.	CO-011-B	Mar 1990
Committee(s): JC-11, JC-11.5 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Ceramic Quad Flatpack Family (CQFP), 0.50 mm Lead Pitch with Ceramic Nonconductive Tie Bar. Item 11.10-317.	MO-134-A	May 1992
Patents(): National Semiconductor: 4,796,080 Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Square Ceramic Ball Grid Array (BGA) Family. 1.00, 1.27, and 1.50 mm pitch. CBGA. Item 11.10-432	MO-156-C	Apr 2005
Committee(s): JC-11, JC-11.10 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Rectangular Ceramic Ball Grid Array (BGA) Family. CBGA. Item 11.10-433.	MO-157-C	Apr 2005
Committee(s): JC-11.10, JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Multichip Module (MCM) Ceramic Quad Flatpack Family. S-CQFP.	MO-148-A	Jun 1993
Item 11.10-334 Committee(s): JC-11.10, JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - 16 Lead Flange-Mounted Ceramic Power Package (Type 1). R-CDFM-T16.	MO-138-A	Jun 1993
Item 11.10-310 Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.

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