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Title Document # Date

TEMPERATURE, BIAS, AND OPERATING LIFE

 JESD22-A108G Nov 2022

This test is used to determine the effects of bias conditions and temperature on solid state devices over time. It simulates the devices’ operating condition in an accelerated way, and is primarily for device qualification and reliability monitoring. A form of high temperature bias life using a short duration, popularly known as burn-in, may be used to screen for infant mortality related failures. The detailed use and application of burn-in is outside the scope of this document.

Committee(s): JC-14, JC-14.1

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Wire Bond Pull Test Methods

 JESD22-B120.01 Sep 2024

This test method provides a means for determining the strength and failure mode of a wire bonded to, and the corresponding interconnects on, a die or package bonding surface and may be performed on pre-encapsulation or post-encapsulation devices. 

Committee(s): JC-14, JC-14.1

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