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Title Document # Date

Registration - New family of Thermally Enhanced Plastic Very Thin and Very Very Thin Pitch Bumped Quad Flat No Lead Packages. HP-VFQFP-NB, HP-WFQFP-NB. Item 11.11-679.

 MO-250-A Nov 2003

Committee(s): JC-11, JC-11.11

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Registration - Thermally Enhanced Plastic Very Thin and Very Very Thin Fine Pitch Bumped Quad Flat No Lead Package. HP-VFQFP-NB & HP-WFQFP-NB.

 MO-243-A Jul 2003

Item 11.11-661

Patents(): Amkor, ASAT, National Semiconductor: See Outline

Committee(s): JC-11, JC-11.11

JEP95 Registrations Main Page

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