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Displaying 1 - 2 of 2 documents.

Title	Document #	Date
CYCLED TEMPERATURE HUMIDITY-BIAS WITH SURFACE CONDENSATION LIFE TEST	JESD22-A100E	Nov 2020
The Cycled Temperature-humidity-bias Life Test is performed for the purpose of evaluating the reliability of nonhermetic packaged solid state devices in humid environments. It employs conditions of temperature cycling, humidity, and bias that accelerate the penetration of moisture through the external protective material (encapsulant or seal) or along the interface between the external protective material and the metallic conductors that pass through it. The Cycled Temperature-Humidity-Bias Life Test is typically performed on cavity packages (e.g., MQUADs, lidded ceramic pin grid arrays, etc.) as an alternative to JESD22-A101 or JESD22-A110. Committee(s): JC-14, JC-14.1 Free download. Registration or login required.
STEADY-STATE TEMPERATURE-HUMIDITY BIAS LIFE TEST	JESD22-A101D.01	Jan 2021
This standard establishes a defined method and conditions for performing a temperature-humidity life test with bias applied. The test is used to evaluate the reliability of nonhermetic packaged solid state devices in humid environments. It employs high temperature and humidity conditions to accelerate the penetration of moisture through external protective material or along interfaces between the external protective coating and conductors or other features that pass through it. This revision enhances the ability to perform this test on a device which cannot be biased to achieve very low power dissipation. Committee(s): JC-14, JC-14.1 Free download. Registration or login required.