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Title	Document #	Date
Standard Practices and Procedures - Reflow Flatness Requirements for Ball Grid Array Packages. Item 11.2-783	SPP-024A	Mar 2009
This document states the procedures for using component land side flatness during simulated reflow as an alternative to coplanarity in certain limited cases for BGA components. Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Standard - Ball Grid Array Family, Square, 1.27 mm, and 1.50 mm Pitch. S-PBGA/PBGA.	MS-034G	Jan 2017
Item No. 11.11-933 (S) Item No. 11.11-723(S), Elevated MO-151 to Standard and included and increased Ax dimensions to allow for thicker packages. Patents(): National Semiconductor: 4688152; 4778641; 4868349. Citizen Watch Company: 4822550; 4935581. Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Very Thin, Fine-Pitch, Stackable Ball Grid, 0.50 mm Ball Pitch Array Family. VF-XBGA. Status: SupersededAugust 2016 MO-266 variations: AA, AB, AC, AD, AE, and AF are now in MO-325 MO-266 variations: BA, BB, BC, BD, BE, and BF are now in MO-324 MO-266 variation: CA is now in MO-326	MO-266C	Jan 2009
Item 11.11-807 Patents(): Micron: 6,048,758. Tessera: 5,950,304; 6,133,627. Committee(s): JC-11.11 JEP95 Registrations Main Page
Registration - Very Thin, Fine-Pitch, Square Ball Grid Array Family, 0.50/0.65 mm pitch. VF-XBGA.	MO-225-C	Aug 2007
Item 11.11-761 and 11.11-761(E). Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Very Thin, Fine-Pitch, Rectangular, Ball Grid Array Family, 0.50/0.65/0.80 mm pitch. VFR-XBGA.	MO-285-A	Aug 2007
Item 11.11-760 and 11.11-760(E) Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Very Thin Profile, Fine Pitch, Square Bump Grid Array Family. VF-XBGA.	MO-294-A	Nov 2008
Item 11.11-804 Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Very Thin Profile, Fine Pitch, Bump Grid Array Family, 0.50 & 0.65 mm Pitch, Rectangular. VFR-XBGA.	MO-222-B.01	Dec 2010
Item 11.11-803, 11.11-842E Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Upper PoP Package, Square, Fine Pitch, Ball Grid Array (BGA), 0.65 and 0.50 mm and 0.40 mm Pitch. POP-XFBGA. Status: Rescinded March 2018	MO-273C	Mar 2011
The information contained in MO-273, has been moved to 3 different MO's as follows: The 0.40 mm pitch has been moved to MO-317. The 0.50 mm pitch has been moved to MO-321. The 0.65 mm pitch has been moved to MO-322. Item 11.11-941(E) Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page
Registration - Ultra Thin and Very, Very Thin Profile, Fine Pitch Ball Grid Array (BGA) Family - SQUARE. (U,W)F-XBGA.	MO-280-A	Sep 2006
Item 11-759 Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Thin, Very-Thin, Very-Very-Thin Profile, Fine Pitch Ball Grid Array Family, 0.40mm pitch (Square). (T,V,W)F-XBGA.	MO-298-A	Jun 2009
Item 11.11-816 Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Thin, Fine-Pitch, Rectangular Dual Pitch Ball Grid Array Family, 0.80 mm x 1.00 mm pitch. TFR-XBGA.	MO-284-A	May 2007
Item 11.11-755 Patents(): Micron: 6,048,753. Tessera: 5,950,304; 6,133,627 Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Thin, Fine Pitch Ball Grid Array Family, 0.5 mm Pitch. TF(R)-XBGA.	MO-195-D	May 2006
Item 11.11-704 Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Thin Profile, Interstitial Fine Pitch Ball Grid Array Family, Square. TFI-PBGA.	MO-295-A	Jan 2009
Item 11.11-795 Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Thick and Very Thick, Fine-Pitch, Retangular Ball Grid Array Family, 0.80 mm Pitch. B1FR-XBGA, BFR-XBGA.	MO-261-A	Jun 2005
Item 11.11-718 Patents(): Micron: 6,048,753. Tessera: 5,950,304; 6,133,627. Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Tape Ball Grid Array. XBGA-B/TBGA. Item 11.4-665.	MO-149-F	Oct 2003
Committee(s): JC-11.11, JC-11.4 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Square Ceramic Ball Grid Array (BGA) Family. 1.00, 1.27, and 1.50 mm pitch. CBGA. Item 11.10-432	MO-156-C	Apr 2005
Committee(s): JC-11, JC-11.10 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Square and Rectangular Die-Size, Ball Grid Array Family. (L, T, V, W) F (R)- xDSB.	MO-207N	Jun 2013
Item 11.4-846 Committee(s): JC-11, JC-11.4 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Rectangular Die-Size, Stacked Ball Grid Array Family, Dual Pitch. AFR-PDSB.	MO-264-A	Nov 2005
Item 11.4-731 Committee(s): JC-11, JC-11.4 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Rectangular Ceramic Ball Grid Array (BGA) Family. CBGA. Item 11.10-433.	MO-157-C	Apr 2005
Committee(s): JC-11.10, JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic Bottom Grid Array, 0.80 MM Pitch, Rectangular Family Package	MO-210Q	Jan 2021
Designator: PBGA-B#[#]_I0p... Item: 11.11-988, Access STP Files for MO-210Q Cross Reference: DG4.5 Patents(): May apply: Micron: 6,048,753. Tessera: 5,950,304; and 6,133,627 Committee(s): JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.

Standards & Documents Search

Standard Practices and Procedures - Reflow Flatness Requirements for Ball Grid Array Packages. Item 11.2-783

Standard - Ball Grid Array Family, Square, 1.27 mm, and 1.50 mm Pitch. S-PBGA/PBGA.

Registration - Very Thin, Fine-Pitch, Stackable Ball Grid, 0.50 mm Ball Pitch Array Family. VF-XBGA.

Registration - Very Thin, Fine-Pitch, Square Ball Grid Array Family, 0.50/0.65 mm pitch. VF-XBGA.

Registration - Very Thin, Fine-Pitch, Rectangular, Ball Grid Array Family, 0.50/0.65/0.80 mm pitch. VFR-XBGA.

Registration - Very Thin Profile, Fine Pitch, Square Bump Grid Array Family. VF-XBGA.

Registration - Very Thin Profile, Fine Pitch, Bump Grid Array Family, 0.50 & 0.65 mm Pitch, Rectangular. VFR-XBGA.

Registration - Upper PoP Package, Square, Fine Pitch, Ball Grid Array (BGA), 0.65 and 0.50 mm and 0.40 mm Pitch. POP-XFBGA.

Registration - Ultra Thin and Very, Very Thin Profile, Fine Pitch Ball Grid Array (BGA) Family - SQUARE. (U,W)F-XBGA.

Registration - Thin, Very-Thin, Very-Very-Thin Profile, Fine Pitch Ball Grid Array Family, 0.40mm pitch (Square). (T,V,W)F-XBGA.

Registration - Thin, Fine-Pitch, Rectangular Dual Pitch Ball Grid Array Family, 0.80 mm x 1.00 mm pitch. TFR-XBGA.

Registration - Thin, Fine Pitch Ball Grid Array Family, 0.5 mm Pitch. TF(R)-XBGA.

Registration - Thin Profile, Interstitial Fine Pitch Ball Grid Array Family, Square. TFI-PBGA.

Registration - Thick and Very Thick, Fine-Pitch, Retangular Ball Grid Array Family, 0.80 mm Pitch. B1FR-XBGA, BFR-XBGA.

Registration - Tape Ball Grid Array. XBGA-B/TBGA. Item 11.4-665.

Registration - Square Ceramic Ball Grid Array (BGA) Family. 1.00, 1.27, and 1.50 mm pitch. CBGA. Item 11.10-432

Registration - Square and Rectangular Die-Size, Ball Grid Array Family. (L, T, V, W) F (R)- xDSB.

Registration - Rectangular Die-Size, Stacked Ball Grid Array Family, Dual Pitch. AFR-PDSB.

Registration - Rectangular Ceramic Ball Grid Array (BGA) Family. CBGA. Item 11.10-433.

Registration - Plastic Bottom Grid Array, 0.80 MM Pitch, Rectangular Family Package

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