Global Standards for the Microelectronics Industry
Standards & Documents Search
Title | Document # |
Date![]() |
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Registration - Extremely Thin, Two Row Cavity Down, 0.50 mm Pitch BGA Family. The addition of -2, max matrix, variations to XFBGA. Item 11.11-604. |
MO-221-C | Jun 2001 |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Mixed Pitch (0.80 & 1.00 mm), Rectangular Die Size, Fine Dual Pitch Ball Grid Array (DSBGA) family. TFR-XBGA-N. Item 11.4-611 |
MO-233-C | Feb 2003 |
Includes editorial correction of the ball array identification lettering (replace S with T). Item 11.1-652(E). Free download. Registration or login required. |
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Registration - Low Profile Square Ball Grid Array Family. S-LBGA-B/LBGA. |
MO-192-F | Jul 2003 |
Item 11.11-659 Patents(): National Semiconductor, Citizen Watch Company: See Outline Free download. Registration or login required. |
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Registration - Tape Ball Grid Array. XBGA-B/TBGA. Item 11.4-665. |
MO-149-F | Oct 2003 |
Committee(s): JC-11.11, JC-11.4 Free download. Registration or login required. |
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Registration - Die Size Ball Grid Array, Fine Pitch, Thin/Very Thin/Extremely Thin Profile. X-DSBGA. Item 11.4-631. |
MO-211-C | Jun 2004 |
Committee(s): JC-11.4 Free download. Registration or login required. |
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Registration - Rectangular Ceramic Ball Grid Array (BGA) Family. CBGA. Item 11.10-433. |
MO-157-C | Apr 2005 |
Free download. Registration or login required. |
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Registration - Square Ceramic Ball Grid Array (BGA) Family. 1.00, 1.27, and 1.50 mm pitch. CBGA. Item 11.10-432 |
MO-156-C | Apr 2005 |
Free download. Registration or login required. |
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Registration - Thick and Very Thick, Fine-Pitch, Retangular Ball Grid Array Family, 0.80 mm Pitch. B1FR-XBGA, BFR-XBGA. |
MO-261-A | Jun 2005 |
Item 11.11-718 Patents(): Micron: 6,048,753. Tessera: 5,950,304; 6,133,627. Free download. Registration or login required. |
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Registration - Rectangular Die-Size, Stacked Ball Grid Array Family, Dual Pitch. AFR-PDSB. |
MO-264-A | Nov 2005 |
Item 11.4-731 Free download. Registration or login required. |
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Registration - Thin, Fine Pitch Ball Grid Array Family, 0.5 mm Pitch. TF(R)-XBGA. |
MO-195-D | May 2006 |
Item 11.11-704 Free download. Registration or login required. |
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Registration - Low Profile, Fine Pitch BGA Family, 0.80 mm Pitch (Rectangular). LFR-XBGA. Item 11.11-752. |
MO-205-G | Jul 2006 |
Free download. Registration or login required. |
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Registration - Ultra Thin and Very, Very Thin Profile, Fine Pitch Ball Grid Array (BGA) Family - SQUARE. (U,W)F-XBGA. |
MO-280-A | Sep 2006 |
Item 11-759 Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Thin, Fine-Pitch, Rectangular Dual Pitch Ball Grid Array Family, 0.80 mm x 1.00 mm pitch. TFR-XBGA. |
MO-284-A | May 2007 |
Item 11.11-755 Patents(): Micron: 6,048,753. Tessera: 5,950,304; 6,133,627 Free download. Registration or login required. |
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Registration - Very Thin, Fine-Pitch, Rectangular, Ball Grid Array Family, 0.50/0.65/0.80 mm pitch. VFR-XBGA. |
MO-285-A | Aug 2007 |
Item 11.11-760 and 11.11-760(E) Free download. Registration or login required. |
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Registration - Very Thin, Fine-Pitch, Square Ball Grid Array Family, 0.50/0.65 mm pitch. VF-XBGA. |
MO-225-C | Aug 2007 |
Item 11.11-761 and 11.11-761(E). Free download. Registration or login required. |
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Design Requirements - Ball Grid Array (BGA)Package Measuring and Methodology. |
DG-4.17C | Jul 2008 |
Item 11.2-791(S) Free download. Registration or login required. |
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Registration - Very Thin Profile, Fine Pitch, Square Bump Grid Array Family. VF-XBGA. |
MO-294-A | Nov 2008 |
Item 11.11-804 Free download. Registration or login required. |
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Registration - Thin Profile, Interstitial Fine Pitch Ball Grid Array Family, Square. TFI-PBGA. |
MO-295-A | Jan 2009 |
Item 11.11-795 Free download. Registration or login required. |
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Registration - Very Thin, Fine-Pitch, Stackable Ball Grid, 0.50 mm Ball Pitch Array Family. VF-XBGA.Status: SupersededAugust 2016 MO-266 variations: AA, AB, AC, AD, AE, and AF are now in MO-325 MO-266 variations: BA, BB, BC, BD, BE, and BF are now in MO-324 MO-266 variation: CA is now in MO-326 |
MO-266C | Jan 2009 |
Item 11.11-807 Patents(): Micron: 6,048,758. Tessera: 5,950,304; 6,133,627. Committee(s): JC-11.11 |
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Standard Practices and Procedures - Reflow Flatness Requirements for Ball Grid Array Packages. Item 11.2-783 |
SPP-024A | Mar 2009 |
This document states the procedures for using component land side flatness during simulated reflow as an alternative to coplanarity in certain limited cases for BGA components. Free download. Registration or login required. |