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Title	Document #	Date
High Speed DDR SRAM in 165 BGA	SRAM3.7.10	Feb 2008
Release No. 17. Item 1755 Committee(s): JC-42, JC-42.2 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required.
Registration - Tape Ball Grid Array. XBGA-B/TBGA. Item 11.4-665.	MO-149-F	Oct 2003
Committee(s): JC-11.11, JC-11.4 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Square Ceramic Ball Grid Array (BGA) Family. 1.00, 1.27, and 1.50 mm pitch. CBGA. Item 11.10-432	MO-156-C	Apr 2005
Committee(s): JC-11, JC-11.10 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Low Profile, Fine Pitch BGA Family, 0.80 mm Pitch (Rectangular). LFR-XBGA. Item 11.11-752.	MO-205-G	Jul 2006
Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Die Size Ball Grid Array, Fine Pitch, Thin/Very Thin/Extremely Thin Profile. X-DSBGA. Item 11.4-631.	MO-211-C	Jun 2004
Committee(s): JC-11.4 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Extremely Thin, Two Row Cavity Down, 0.50 mm Pitch BGA Family. The addition of -2, max matrix, variations to XFBGA. Item 11.11-604.	MO-221-C	Jun 2001
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
BALL GRID ARRAY PINOUTS STANDARDIZED FOR 16-BIT LOGIC FUNCTIONS:	JESD75-2	Jul 2001
This standard provides a pinout standard for 16-bit wide logic devices offered in a 56-ball areagrid array package to provide for uniformity, multiplicity of sources, elimination of confusion,ease of device specification, and ease of use. Committee(s): JC-40 Free download. Registration or login required.
BALL GRID ARRAY PINOUTS STANDARDIZED FOR 8-BIT LOGIC FUNCTIONS:	JESD75-3	Jul 2001
This standard provides a pinout standard for 8-bit logic devices offered in a 20-ball area gridarray package to provide for uniformity, multiplicity of sources, elimination of confusion, ease of device specification, and ease of use. Committee(s): JC-40 Free download. Registration or login required.
Registration - Mixed Pitch (0.80 & 1.00 mm), Rectangular Die Size, Fine Dual Pitch Ball Grid Array (DSBGA) family. TFR-XBGA-N. Item 11.4-611	MO-233-C	Feb 2003
Includes editorial correction of the ball array identification lettering (replace S with T). Item 11.1-652(E). Committee(s): JC-11, JC-11.4 JEP95 Registrations Main Page Free download. Registration or login required.
BALL GRID ARRAY PINOUTS STANDARDIZED FOR 16, 18, AND 20-BIT LOGIC FUNCTIONS USING A 54 BALL PACKAGE:	JESD75-1	Oct 2001
This standard establishes a 54 Ball Grid Array pinout for 16, 18 and 20-bit standard logic devices that are currently being produced in 48 and 56 Pin SSOP and TSSOP packages. The 54 Ball Grid Array Package is organized as a 6 x 9 array with balls on a .8mm x .8mm grid pitch. Committee(s): JC-40 Free download. Registration or login required.
BALL GRID ARRAY PINOUT FOR 1-, 2-, AND 3-BIT LOGIC FUNCTIONS:	JESD75-4	Mar 2004
This standard defines device pinout for 1-, 2- and 3-bit wide logic functions. This pinout specifically applies to the conversion of Dual-Inline-Packaged (DIP) 1-, 2- and 3-bit logic devices to DSBGA-packaged 1-, 2- and 3-bit logic devices. Committee(s): JC-40 Free download. Registration or login required.
Standard Practices and Procedures - Reflow Flatness Requirements for Ball Grid Array Packages. Item 11.2-783	SPP-024A	Mar 2009
This document states the procedures for using component land side flatness during simulated reflow as an alternative to coplanarity in certain limited cases for BGA components. Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Rectangular Ceramic Ball Grid Array (BGA) Family. CBGA. Item 11.10-433.	MO-157-C	Apr 2005
Committee(s): JC-11.10, JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Thin, Very-Thin, Very-Very-Thin Profile, Fine Pitch Ball Grid Array Family, 0.40mm pitch (Square). (T,V,W)F-XBGA.	MO-298-A	Jun 2009
Item 11.11-816 Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Very Thin Profile, Fine Pitch, Square Bump Grid Array Family. VF-XBGA.	MO-294-A	Nov 2008
Item 11.11-804 Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Very Thin, Fine-Pitch, Rectangular, Ball Grid Array Family, 0.50/0.65/0.80 mm pitch. VFR-XBGA.	MO-285-A	Aug 2007
Item 11.11-760 and 11.11-760(E) Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Thin, Fine-Pitch, Rectangular Dual Pitch Ball Grid Array Family, 0.80 mm x 1.00 mm pitch. TFR-XBGA.	MO-284-A	May 2007
Item 11.11-755 Patents(): Micron: 6,048,753. Tessera: 5,950,304; 6,133,627 Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Thin Profile, Interstitial Fine Pitch Ball Grid Array Family, Square. TFI-PBGA.	MO-295-A	Jan 2009
Item 11.11-795 Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Ultra Thin and Very, Very Thin Profile, Fine Pitch Ball Grid Array (BGA) Family - SQUARE. (U,W)F-XBGA.	MO-280-A	Sep 2006
Item 11-759 Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Rectangular Die-Size, Stacked Ball Grid Array Family, Dual Pitch. AFR-PDSB.	MO-264-A	Nov 2005
Item 11.4-731 Committee(s): JC-11, JC-11.4 JEP95 Registrations Main Page Free download. Registration or login required.

Standards & Documents Search

High Speed DDR SRAM in 165 BGA

Registration - Tape Ball Grid Array. XBGA-B/TBGA. Item 11.4-665.

Registration - Square Ceramic Ball Grid Array (BGA) Family. 1.00, 1.27, and 1.50 mm pitch. CBGA. Item 11.10-432

Registration - Low Profile, Fine Pitch BGA Family, 0.80 mm Pitch (Rectangular). LFR-XBGA. Item 11.11-752.

Registration - Die Size Ball Grid Array, Fine Pitch, Thin/Very Thin/Extremely Thin Profile. X-DSBGA. Item 11.4-631.

Registration - Extremely Thin, Two Row Cavity Down, 0.50 mm Pitch BGA Family. The addition of -2, max matrix, variations to XFBGA. Item 11.11-604.

BALL GRID ARRAY PINOUTS STANDARDIZED FOR 16-BIT LOGIC FUNCTIONS:

BALL GRID ARRAY PINOUTS STANDARDIZED FOR 8-BIT LOGIC FUNCTIONS:

Registration - Mixed Pitch (0.80 & 1.00 mm), Rectangular Die Size, Fine Dual Pitch Ball Grid Array (DSBGA) family. TFR-XBGA-N. Item 11.4-611

BALL GRID ARRAY PINOUTS STANDARDIZED FOR 16, 18, AND 20-BIT LOGIC FUNCTIONS USING A 54 BALL PACKAGE:

BALL GRID ARRAY PINOUT FOR 1-, 2-, AND 3-BIT LOGIC FUNCTIONS:

Standard Practices and Procedures - Reflow Flatness Requirements for Ball Grid Array Packages. Item 11.2-783

Registration - Rectangular Ceramic Ball Grid Array (BGA) Family. CBGA. Item 11.10-433.

Registration - Thin, Very-Thin, Very-Very-Thin Profile, Fine Pitch Ball Grid Array Family, 0.40mm pitch (Square). (T,V,W)F-XBGA.

Registration - Very Thin Profile, Fine Pitch, Square Bump Grid Array Family. VF-XBGA.

Registration - Very Thin, Fine-Pitch, Rectangular, Ball Grid Array Family, 0.50/0.65/0.80 mm pitch. VFR-XBGA.

Registration - Thin, Fine-Pitch, Rectangular Dual Pitch Ball Grid Array Family, 0.80 mm x 1.00 mm pitch. TFR-XBGA.

Registration - Thin Profile, Interstitial Fine Pitch Ball Grid Array Family, Square. TFI-PBGA.

Registration - Ultra Thin and Very, Very Thin Profile, Fine Pitch Ball Grid Array (BGA) Family - SQUARE. (U,W)F-XBGA.

Registration - Rectangular Die-Size, Stacked Ball Grid Array Family, Dual Pitch. AFR-PDSB.

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