Global Standards for the Microelectronics Industry
Standards & Documents Search
| Title | Document # |
Date |
|---|---|---|
BALL GRID ARRAY PINOUTS STANDARDIZED FOR 16-BIT LOGIC FUNCTIONS: |
JESD75-2 | Jul 2001 |
This standard provides a pinout standard for 16-bit wide logic devices offered in a 56-ball areagrid array package to provide for uniformity, multiplicity of sources, elimination of confusion,ease of device specification, and ease of use. Committee(s): JC-40 Free download. Registration or login required. |
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BALL GRID ARRAY PINOUTS STANDARDIZED FOR 8-BIT LOGIC FUNCTIONS: |
JESD75-3 | Jul 2001 |
This standard provides a pinout standard for 8-bit logic devices offered in a 20-ball area gridarray package to provide for uniformity, multiplicity of sources, elimination of confusion, ease of device specification, and ease of use. Committee(s): JC-40 Free download. Registration or login required. |
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BALL GRID ARRAY PINOUTS STANDARDIZED FOR 16, 18, AND 20-BIT LOGIC FUNCTIONS USING A 54 BALL PACKAGE: |
JESD75-1 | Oct 2001 |
This standard establishes a 54 Ball Grid Array pinout for 16, 18 and 20-bit standard logic devices that are currently being produced in 48 and 56 Pin SSOP and TSSOP packages. The 54 Ball Grid Array Package is organized as a 6 x 9 array with balls on a .8mm x .8mm grid pitch. Committee(s): JC-40 Free download. Registration or login required. |
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BALL GRID ARRAY PINOUT FOR 1-, 2-, AND 3-BIT LOGIC FUNCTIONS: |
JESD75-4 | Mar 2004 |
This standard defines device pinout for 1-, 2- and 3-bit wide logic functions. This pinout specifically applies to the conversion of Dual-Inline-Packaged (DIP) 1-, 2- and 3-bit logic devices to DSBGA-packaged 1-, 2- and 3-bit logic devices. Committee(s): JC-40 Free download. Registration or login required. |
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Registration - Die Size Ball Grid Array, Fine Pitch, Thin/Very Thin/Extremely Thin Profile. X-DSBGA. Item 11.4-631. |
MO-211-C | Jun 2004 |
Committee(s): JC-11.4 Free download. Registration or login required. |
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Registration - Rectangular Ceramic Ball Grid Array (BGA) Family. CBGA. Item 11.10-433. |
MO-157-C | Apr 2005 |
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Free download. Registration or login required. |
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Registration - Square Ceramic Ball Grid Array (BGA) Family. 1.00, 1.27, and 1.50 mm pitch. CBGA. Item 11.10-432 |
MO-156-C | Apr 2005 |
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Free download. Registration or login required. |
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Registration - Thick and Very Thick, Fine-Pitch, Retangular Ball Grid Array Family, 0.80 mm Pitch. B1FR-XBGA, BFR-XBGA. |
MO-261-A | Jun 2005 |
Item 11.11-718 Patents(): Micron: 6,048,753. Tessera: 5,950,304; 6,133,627. Free download. Registration or login required. |
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Registration - Rectangular Die-Size, Stacked Ball Grid Array Family, Dual Pitch. AFR-PDSB. |
MO-264-A | Nov 2005 |
Item 11.4-731 Free download. Registration or login required. |
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Registration - Ultra Thin and Very, Very Thin Profile, Fine Pitch Ball Grid Array (BGA) Family - SQUARE. (U,W)F-XBGA. |
MO-280-A | Sep 2006 |
Item 11-759 Committee(s): JC-11 Free download. Registration or login required. |
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