Global Standards for the Microelectronics Industry
Standards & Documents Search
Title | Document # | Date |
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Registration - Plastic Bottom Grid Array, 0.80 MM Pitch, Rectangular Family Package |
MO-210R | Mar 2023 |
Designator: PBGA-B#[#]_I0p...
Item: 11.11-988, Access STP Files for MO-210R Cross Reference: DG4.5 https://www.jedec.org/filebrowser/download/1625 Patents(): May apply: Micron: 6,048,753. Tessera: 5,950,304; and 6,133,627 Committee(s): JC-11.11 Free download. Registration or login required. |
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Registration - Rectangular Ceramic Ball Grid Array (BGA) Family. CBGA. Item 11.10-433. |
MO-157-C | Apr 2005 |
Free download. Registration or login required. |
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Registration - Rectangular Die-Size, Stacked Ball Grid Array Family, 0.80 mm Pitch. AF1R-PDSB. |
MO-242-C | Sep 2008 |
Item 11.4-800 Patents(): Micron and Staktek have stated that certain U.S. patents and patent applications may apply to configurations of this outline. These patents and applications are listed on sheet 9 of the outline. Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Rectangular Die-Size, Stacked Ball Grid Array Family, Dual Pitch. AFR-PDSB. |
MO-264-A | Nov 2005 |
Item 11.4-731 Free download. Registration or login required. |
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Registration - Square Ceramic Ball Grid Array (BGA) Family. 1.00, 1.27, and 1.50 mm pitch. CBGA. Item 11.10-432 |
MO-156-C | Apr 2005 |
Free download. Registration or login required. |