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Title	Document #	Date
Mobile Platform Memory Module Thermal Sensor Component Specification	MODULE4.7	May 2022
Release No. 16. This replaces Release 15 and includes the following editorial changes: 1) Replaced master/slave with controller/target 2) Checked for presence of other sensitive words 3) Added Tables and Figures in Table of Contents (Release 15, Item 1640.07) Committee(s): JC-42.4 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required.
Four Byte Modules and Cards Table of Contents	MODULE4.4.TOC	Jun 1997
Release No. 9 Committee(s): JC-42, JC-42.3 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required.
Dual Inline Memory Modules (DIMMs) Table of Contents	MODULE4.20.TOC	Dec 2014
Release No. 24 Committee(s): JC-42.2, JC-42.3 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required.
DDR3 Unbuffered MicroDIMM Design Specification, 214-Pin PC3-12800. Item 2031.04	MODULE4.20.17	Mar 2007
Release No. 17 Committee(s): JC-45, JC-45.3 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required.
DDR3 240-Pin Connector S-Parameters Specification This document was originally published in Section 4.20.19 of JESD21C, it is now placed in its own section, Section 4.8, in 21C. A cross-reference to Section 4.8 has been placed in Section 4.20.19.	MODULE4.8	Jun 2011
Release No. 21 Item 2170 Committee(s): JC-45.5 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required.

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