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Displaying 1 - 5 of 8 documents. Show 5 results per page.

Title	Document #	Date
CLASSIFICATION OF NON-IC ELECTRONIC COMPONENTS FOR ASSEMBLY PROCESSES	J-STD-075A	May 2018
This is a Joint Standard between ECIA, IPC, and JEDEC. The purpose of this standard is to establish an agreed set of worst case solder process limits (SnPb and Pb-free) which can safely be used for assembling non-semiconductor electronic components on common substrates, e.g., FR4, ceramic, polyimide, etc., along with documenting unique commodity specific exceptions. The documented process conditions are used to evaluate a non-semiconductor component’s PSL and MSL. THIS DOCUMENT IS NOT AVAILABLE FOR FREE DOWNLOAD. However, this document is available to the JEDEC formulating Committee members, in the Members Area. The lead organization is ECIA. Committee(s): JC-14
CUSTOMER NOTIFICATION STANDARD FOR PRODUCT/PROCESS CHANGES BY ELECTRONIC PRODUCT SUPPLIERS	J-STD-046	Jul 2016
This standard is applicable to suppliers of, and affected customers for, electronic products and their constituent components. This standard establishes the requirements for timely customer notification of changes to electronic products and associated processes. This document replaces JESD46. Committee(s): JC-14.4 Free download. Registration or login required.
JOINT IPC/JEDEC Standard for Acoustic Microscopy for Non-Hermetic Encapsulated Electronic Devices	J-STD-035A	Dec 2022
This method provides users with an acoustic microscopy process flow for detecting anomalies (delaminations, cracks, mold compound voids, etc.) nondestructively in encapsulated electronic devices while achieving reproducibility. Committee(s): JC-14, JC-14.1 Free download. Registration or login required.
JOINT IPC/JEDEC STANDARD FOR HANDLING, PACKING, SHIPPING, AND USE OF MOISTURE/REFLOW SENSITIVE SURFACE-MOUNT DEVICES	J-STD-033D	Apr 2018
The purpose of this document is to provide manufacturers and users with standardized methods for handling, packing, shipping, and use of moisture/reflow and process sensitive devices that have been classified to the levels defined in J-STD-020 or J-STD-075. These methods are provided to avoid damage from moisture absorption and exposure to solder reflow temperatures that can result in yield and reliability degradation. By using these procedures, safe and damage-free reflow can be achieved. The dry-packing process defined herein provides a minimum shelf life of 12 months from the seal date. Committee(s): JC-14, JC-14.1 Free download. Registration or login required.
JOINT IPC/JEDEC Standard Moisture/Reflow Sensitivity Classification for Non-hermetic Surface Mount Devices (SMDs)	J-STD-020F	Dec 2022
The purpose of this standard is to identify the classification level of non-hermetic SMDs that are sensitive to moisture-induced stress so that they can be properly packaged, stored, and handled to avoid damage during assembly solder reflow attachment and/or repair operations. Committee(s): JC-14, JC-14.1 Free download. Registration or login required.

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