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STANDARD MANUFACTURER'S IDENTIFICATION CODE

 JEP106BL Feb 2025

The manufacturers identification code is defined by one or more 8 bit fields, each consisting of 7 data bits plus 1 odd parity bit. The manufacturers identification code is assigned, maintained and updated by the JEDEC Office. The intent of this identification code is that it may be used whenever a digital field is required, e.g., hardware, software, documentation, etc. To make a request for an ID Code please go to https://www.jedec.org/standards-documents/id-codes-order-form

Committee(s): JC-42, JC-42.3

Free download. Registration or required.

Part Model Guidelines for Electronic-Device Packages – XML Requirements

 JEP30F Feb 2025

This standard establishes the requirements for exchanging part data between part manufacturers and their customers for electrical and electronic products. This standard applies to all forms of electronic parts. It covers several sub-sections such as electrical, physical, thermal, assembly process classification data along with materials and substances that may be present in the supplied product or sub-products. This Guideline specifically focuses on the parental structure, under which several sub-section listed above, can be contained and linked together within the Part Model parent structure.

For more information visit the main JEP30 webpage.

Committee(s): JC-11, JC-11.2

Free download. Registration or required.

PART MODEL SCHEMAS

 JEP30-10v8-0-0 Feb 2025

This download includes all files under the parent schema JEP30-10v8-0-0 (Committees: JC-11, JC-11.2) including:

  • JEP30-A101v2-0-4 (Assembly Process),
    • Committees: JC-11, JC-11.2, JC-14
  • JEP30-E101v5-0-0 (Electrical),
    • Committees: JC-11, JC-11.2, JC-16
  • JEP30-P101v8-0-0 (Package),
    • Committees: JC-11, JC-11.2
  • JEP30-S101v1-1-1 (Supply Chain),
    • Committees: JC-11, JC-11.2, JC-14
  • JEP30-T101v2-0-4 (Thermal)
    • Committees: JC-11, JC-11.2, JC-15
  • JEP30-K101v1-0-0 (Design Rule Kits)
     
  • JEP30-M101v1-0-0 (ECAD Models Guidelines)
     
  • JEP30-D10v5-0-0 (Types Dictionary)
    • Committees: JC-11, JC-11.2

This will enable the user to validate the schemas. For more information visit the main JEP30 webpage.

Committee(s): JC-11, JC-11.2, JC-14, JC-15, JC-16

Free download. Registration or required.

Part Model Thermal Guidelines for Electronic-Device Packages – XML Requirements

 JEP30-T100B.01 Feb 2025

This standard establishes the requirements for exchanging part data between part manufacturers and their customers for electrical and electronic products. This standard applies to all forms of electronic parts. It forms part of the Part Model XML Schema, which covers the parental structure for the electrical, physical, thermal, assembly process classification data along with materials and substances that may be present in the supplied product or sub-products. This Guideline specifically focuses on the "Thermal" subsection of the Part Model.

For more information visit the main JEP30 webpage.

Committee(s): JC-11, JC-11.2, JC-15

Free download. Registration or required.

Part Model Package Guidelines for Electronic-Device Packages – XML Requirements

 JEP30-P100G Feb 2025

This standard establishes the requirements for exchanging part data between part manufacturers and their customers for electrical and electronic products. This standard applies to all forms of electronic parts. It forms part of the Part Model XML Schema, which covers the parental structure for the electrical, physical, thermal, assembly process classification data along with materials and substances that may be present in the supplied product or sub-products. This Guideline specifically focuses on the "Package" subsection of the Part Model.

For more information visit the main JEP30 webpage.

Committee(s): JC-11, JC-11.2

Free download. Registration or required.

Part Model Supply Chain Guidelines for Electronic-Device Packages – XML Requirements

 JEP30-S100A.02 Feb 2025

This standard establishes the requirements for exchanging part data between part manufacturers and their customers for electrical and electronic products. This standard applies to all forms of electronic parts. It forms part of the Part Model XML Schema, which covers the parental structure for the electrical, physical, supply chain, assembly process classification data along with materials and substances that may be present in the supplied product or sub-products. This Guideline specifically focuses on the SupplyChain sub-section of the Part Model.

For more information visit the main JEP30 webpage.

Committee(s): JC-11, JC-11.2, JC-14.4

Free download. Registration or required.

Part Model Assembly Process Classification Guidelines for Electronic-Device Packages – XML Requirements

 JEP30-A100B.01 Feb 2025

This standard establishes the requirements for exchanging part data between part manufacturers and their customers for electrical and electronic products. This standard applies to all forms of electronic parts. It forms part of the Part Model XML Schema, which covers the parental structure for the electrical, physical, thermal, assembly process classification data along with materials and substances that may be present in the supplied product or subproducts.  This Guideline specifically focuses on the “Assembly Process Classification” subsection of the Part Model.

For more information visit the main JEP30 webpage.

Committee(s): JC-11, JC-11.2, JC-14.4

Free download. Registration or required.

PartModel Generated ECAD - Models Guidelines for Electronic-Device Packages – XML Requirements

 JEP30-M100 Feb 2025

This standard establishes the requirements for exchanging part data between part manufacturers and their customers for electrical and electronic products. This standard applies to all forms of electronic parts. It covers several sub-sections such as electrical, physical, thermal, assembly process classification data along with materials and substances that may be present in the supplied product or sub-products. This Guideline specifically focuses on the “generated ECAD model” subsection of the Part Model.

For more information visit the main JEP30 webpage.

Committee(s): JC-11, JC-11.2

Free download. Registration or required.

Part Model Electrical Guidelines for Electronic-Device Packages – XML Requirements

 JEP30-E100G Feb 2025

This standard establishes the requirements for exchanging part data between part manufacturers and their customers for electrical and electronic products. This standard applies to all forms of electronic parts. It forms part of the Part Model XML Schema, which covers the parental structure for the electrical, physical, Electrical, assembly process classification data along with materials and substances that may be present in the supplied product or subproducts. This Guideline specifically focuses on the “Electrical” sub-section of the Part Model.

For more information visit the main JEP30 webpage.

Committee(s): JC-11, JC-11.2, JC-16

Free download. Registration or required.

PartModel Design Rule Kits Guidelines for Electronic-Device Packages – XML Requirements

 JEP30-K100 Feb 2025

This standard establishes the requirements for exchanging part data between part manufacturers and their customers for electrical and electronic products. This standard applies to all forms of electronic parts. It covers several sub-sections such as electrical, physical, thermal, assembly process classification data along with materials and substances that may be present in the supplied product or sub-products. This Guideline specifically focuses on the “Design Kit” subsection of the Part Model.

For more information visit the main JEP30 webpage.

Committee(s): JC-11, JC-11.2

Free download. Registration or required.

Guidelines for Representing Threshold Voltage of SiC MOSFETs in Datasheets, Version 1.0

Release Number: Version 1.0 		JEP202 Jan 2025

This publication provides guidelines for representation of threshold voltage and transfer characteristic of SiC MOS device in datasheets.

Committee(s): JC-70, JC-70.2

Free download. Registration or required.

Foundry Process Qualification Guidelines – Technology Qualification Vehicle Testing (Wafer Fabrication Manufacturing Sites)

 JEP001-3B Sep 2024

The publication provides methodologies for measurements to qualify a new semiconductor wafer process.

Committee(s): JC-14, JC-14.2

Free download. Registration or required.

Guidelines for Reverse Recovery Time and Charge Measurement of SiC MOSFET Version 1.0

 JEP201 Aug 2024

This guideline is intended to overcome the limitations of prior standards and provide a test circuit and method that provides both reliable and repeatable results.

Committee(s): JC-70, JC-70.2

Free download. Registration or required.

Test Methods for Switching Energy Loss Associated with Output Capacitance Hysteresis in Semiconductor Power Devices Volume 1

 JEP200 Jun 2024

This document provides guidelines for test methods and circuits to be used for measuring switching energy loss due to output capacitance hysteresis in semiconductor power devices.

Committee(s): JC-70, JC-70.1, JC-70.2

Free download. Registration or required.

Guidelines for Visual Inspection and Control of Flip Chip Type Packages (FCxGA)

 JEP170A Jun 2024

This document provides guidelines for visual inspection and control that ensures quality and reliability of flip chip packaged devices.

Committee(s): JC-14, JC-14.1

Free download. Registration or required.

Procedure for Reliability Characterization of Metal-Insulator-Metal Capacitors

 JEP199 Apr 2024

This document defines the standards for achieving Reliability certification and qualification of on-chip MIM Capacitors and MIS Trench Capacitors.

Committee(s): JC-14, JC-14.2

Free download. Registration or required.

Guideline for Characterizing Solder Bump Electromigration Under Constant Current and Temperature Stress

 JEP154A Mar 2024

This publication describes a method to test the electromigration susceptibility of solder bumps, including other types of bumps, such as solder capped copper pillars, used in flip-chip packages.

Committee(s): JC-14, JC-14.1

Free download. Registration or required.

Stress-Test-Driven Qualification of and Failure Mechanisms Associated with Assembled Solid State Surface-Mount Devices

 JEP150A Dec 2023

This publication contains frequently recommended and accepted JEDEC reliability stress tests applied to surface-mount solid state devices.

Committee(s): JC-14, JC-14.3

Free download. Registration or required.

Guideline for Reverse Bias Reliability Evaluation Procedures for Gallium Nitride Power Conversion Devices

 JEP198 Nov 2023

This publication presents guidelines for evaluating the Time Dependent Breakdown (TDB) reliability of GaN power switches.

Committee(s): JC-70, JC-70.1

Free download. Registration or required.

ECXML Guidelines for Electronic Thermal System Level Models – XML Requirements Schema

 JEP181_Schema_R2p0 Nov 2023

In conjunction with JEP181A, for user support this file is the entire “XML Requirements Schema”.

Committee(s): JC-15

Free download. Registration or required.

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