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STANDARD MANUFACTURERS IDENTIFICATION CODE

 JEP106BK Sep 2024

The manufacturers identification code is defined by one or more 8 bit fields, each consisting of 7 data bits plus 1 odd parity bit. The manufacturers identification code is assigned, maintained and updated by the JEDEC Office. The intent of this identification code is that it may be used whenever a digital field is required, e.g., hardware, software, documentation, etc. To make a request for an ID Code please go to https://www.jedec.org/standards-documents/id-codes-order-form

Committee(s): JC-42, JC-42.3

Free download. Registration or required.

Foundry Process Qualification Guidelines – Technology Qualification Vehicle Testing (Wafer Fabrication Manufacturing Sites)

 JEP001-3B Sep 2024

The publication provides methodologies for measurements to qualify a new semiconductor wafer process.

Committee(s): JC-14, JC-14.2

Free download. Registration or required.

PART MODEL SCHEMAS

 JEP30-10v6-0-0 Aug 2024

This download includes all files under the parent schema JEP30-10v6-0-0 (Committees: JC-11, JC-11.2) including:

  • JEP30-A101v2-0-3 (Assembly Process),
    • Committees: JC-11, JC-11.2, JC-14
  • JEP30-E101v4-0-0 (Electrical),
    • Committees: JC-11, JC-11.2, JC-16
  • JEP30-P101v6-0-0 (Package),
    • Committees: JC-11, JC-11.2
  • JEP30-S101v1-0-3 (Supply Chain),
    • Committees: JC-11, JC-11.2, JC-14
  • JEP30-T101v2-0-3 (Thermal)
    • Committees: JC-11, JC-11.2, JC-15
  • JEP30-D10v4-0-1 (Types Dictionary)
    • Committees: JC-11, JC-11.2

This will enable the user to validate the schemas. For more information visit the main JEP30 webpage.

Committee(s): JC-11, JC-11.2, JC-14, JC-15, JC-16

Free download. Registration or required.

Part Model Guidelines for Electronic-Device Packages – XML Requirements

 JEP30E Aug 2024

This standard establishes the requirements for exchanging part data between part manufacturers and their customers for electrical and electronic products. This standard applies to all forms of electronic parts. It covers several sub-sections such as electrical, physical, thermal, assembly process classification data along with materials and substances that may be present in the supplied product or sub-products. This Guideline specifically focuses on the parental structure, under which several sub-section listed above, can be contained and linked together within the Part Model parent structure.

For more information visit the main JEP30 webpage.

Committee(s): JC-11, JC-11.2

Free download. Registration or required.

Part Model Assembly Process Classification Guidelines for Electronic-Device Packages – XML Requirements

 JEP30-A100B Aug 2024

This standard establishes the requirements for exchanging part data between part manufacturers and their customers for electrical and electronic products. This standard applies to all forms of electronic parts. It forms part of the Part Model XML Schema, which covers the parental structure for the electrical, physical, thermal, assembly process classification data along with materials and substances that may be present in the supplied product or subproducts.  This Guideline specifically focuses on the “Assembly Process Classification” subsection of the Part Model.

For more information visit the main JEP30 webpage.

Committee(s): JC-11, JC-11.2, JC-14.4

Free download. Registration or required.

Part Model Electrical Guidelines for Electronic-Device Packages – XML Requirements

 JEP30-E100E Aug 2024

This standard establishes the requirements for exchanging part data between part manufacturers and their customers for electrical and electronic products. This standard applies to all forms of electronic parts. It forms part of the Part Model XML Schema, which covers the parental structure for the electrical, physical, Electrical, assembly process classification data along with materials and substances that may be present in the supplied product or subproducts. This Guideline specifically focuses on the “Electrical” sub-section of the Part Model.

For more information visit the main JEP30 webpage.

Committee(s): JC-11, JC-11.2, JC-16

Free download. Registration or required.

Guidelines for Reverse Recovery Time and Charge Measurement of SiC MOSFET Version 1.0

 JEP201 Aug 2024

This guideline is intended to overcome the limitations of prior standards and provide a test circuit and method that provides both reliable and repeatable results.

Committee(s): JC-70, JC-70.2

Free download. Registration or required.

Part Model Supply Chain Guidelines for Electronic-Device Packages – XML Requirements

 JEP30-S100A Aug 2024

This standard establishes the requirements for exchanging part data between part manufacturers and their customers for electrical and electronic products. This standard applies to all forms of electronic parts. It forms part of the Part Model XML Schema, which covers the parental structure for the electrical, physical, supply chain, assembly process classification data along with materials and substances that may be present in the supplied product or sub-products. This Guideline specifically focuses on the SupplyChain sub-section of the Part Model.

For more information visit the main JEP30 webpage.

Committee(s): JC-11, JC-11.2, JC-14.4

Free download. Registration or required.

Part Model Thermal Guidelines for Electronic-Device Packages – XML Requirements

 JEP30-T100B Aug 2024

This standard establishes the requirements for exchanging part data between part manufacturers and their customers for electrical and electronic products. This standard applies to all forms of electronic parts. It forms part of the Part Model XML Schema, which covers the parental structure for the electrical, physical, thermal, assembly process classification data along with materials and substances that may be present in the supplied product or sub-products. This Guideline specifically focuses on the "Thermal" subsection of the Part Model.

For more information visit the main JEP30 webpage.

Committee(s): JC-11, JC-11.2, JC-15

Free download. Registration or required.

Part Model Package Guidelines for Electronic-Device Packages – XML Requirements

 JEP30-P100E Aug 2024

This standard establishes the requirements for exchanging part data between part manufacturers and their customers for electrical and electronic products. This standard applies to all forms of electronic parts. It forms part of the Part Model XML Schema, which covers the parental structure for the electrical, physical, thermal, assembly process classification data along with materials and substances that may be present in the supplied product or sub-products. This Guideline specifically focuses on the "Package" subsection of the Part Model.

For more information visit the main JEP30 webpage.

Committee(s): JC-11, JC-11.2

Free download. Registration or required.

Test Methods for Switching Energy Loss Associated with Output Capacitance Hysteresis in Semiconductor Power Devices Volume 1

 JEP200 Jun 2024

This document provides guidelines for test methods and circuits to be used for measuring switching energy loss due to output capacitance hysteresis in semiconductor power devices.

Committee(s): JC-70, JC-70.1, JC-70.2

Free download. Registration or required.

Guidelines for Visual Inspection and Control of Flip Chip Type Packages (FCxGA)

 JEP170A Jun 2024

This document provides guidelines for visual inspection and control that ensures quality and reliability of flip chip packaged devices.

Committee(s): JC-14, JC-14.1

Free download. Registration or required.

Procedure for Reliability Characterization of Metal-Insulator-Metal Capacitors

 JEP199 Apr 2024

This document defines the standards for achieving Reliability certification and qualification of on-chip MIM Capacitors and MIS Trench Capacitors.

Committee(s): JC-14, JC-14.2

Free download. Registration or required.

Guideline for Characterizing Solder Bump Electromigration Under Constant Current and Temperature Stress

 JEP154A Mar 2024

This publication describes a method to test the electromigration susceptibility of solder bumps, including other types of bumps, such as solder capped copper pillars, used in flip-chip packages.

Committee(s): JC-14, JC-14.1

Free download. Registration or required.

Stress-Test-Driven Qualification of and Failure Mechanisms Associated with Assembled Solid State Surface-Mount Devices

 JEP150A Dec 2023

This publication contains frequently recommended and accepted JEDEC reliability stress tests applied to surface-mount solid state devices.

Committee(s): JC-14, JC-14.3

Free download. Registration or required.

Guideline for Reverse Bias Reliability Evaluation Procedures for Gallium Nitride Power Conversion Devices

 JEP198 Nov 2023

This publication presents guidelines for evaluating the Time Dependent Breakdown (TDB) reliability of GaN power switches.

Committee(s): JC-70, JC-70.1

Free download. Registration or required.

ECXML Guidelines for Electronic Thermal System Level Models – XML Requirements Schema

 JEP181_Schema_R2p0 Nov 2023

In conjunction with JEP181A, for user support this file is the entire “XML Requirements Schema”.

Committee(s): JC-15

Free download. Registration or required.

A Case for Lowering Component-level CDM ESD Specifications and Requirements Part II: Die-to-Die Interfaces

 JEP196 Nov 2023

This white paper presents an industry-wide survey on the relevance of industry-aligned D2D CDM targets and the currently used targets for D2D interfaces.

Committee(s): JC-14, JC-14.3

Free download. Registration or required.

Guideline for Evaluating Bipolar Degradation of Silicon Carbide Power Devices

 JEP197 Nov 2023

This publication provides guidance to SiC product suppliers and related power electronic industries in their evaluation of bipolar degradation mechanism in SiC power devices.

Committee(s): JC-70, JC-70.2

Free download. Registration or required.

ECXML Guidelines for Electronic Thermal System Level Models – XML Requirements

 JEP181A Nov 2023

This publication establishes the requirements for the exchange of electronic thermal system level simulation models between supplier and end user in a single neutral file format.

Committee(s): JC-15

Free download. Registration or required.

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