Global Standards for the Microelectronics Industry
Standards & Documents Search
Title | Document # |
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TEST PROCEDURES FOR VERIFICATION OF MAXIMUM RATINGS OF POWER TRANSISTORS:Status: ReaffirmedSeptember 1981, April 1999 |
JEP65 | Dec 1967 |
This publication describes tests which are intended to represent the verification of maximum ratings for data sheets; they are not tests for performance or quality level. This material is to be used in conjunction with formats developed for device registration and defining data. Committee(s): JC-25 Free download. Registration or login required. |
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STANDARD LIST OF VALUES TO BE USED IN POWER TRANSISTOR DEVICE REGISTRATION AND MINIMUM DIFFERENCES FOR DISCRETENESS OF REGISTRATIONS - SUPERSEDED BY EIA-419-A, February 1996.Status: Rescinded |
JEP74 | Jan 1969 |
Committee(s): JC-25 |
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LIFE TEST METHODS FOR PHOTOCONDUCTIVE CELLS: |
JEP79 | Sep 1969 |
This publication is for photoconductive cells sensitive primarily in the visible and near infrared region. Free download. Registration or login required. |
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RELATIVE SPECTRAL RESPONSE CURVES FOR SEMICONDUCTOR INFRARED DETECTORS: |
JEP78 | Oct 1969 |
The intent of this publication is to facilitate the specification of infrared detector diodes, particularly in conjunction with the preparation of data for JEDEC type registration. Committee(s): JC-COUN Free download. Registration or login required. |
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PREFERRED LEAD CONFIGURATION FOR FIELD-EFFECT TRANSISTORS:Status: ReaffirmedSeptember 1981, April 1999 |
JEP69-B | Nov 1973 |
This publication indicates preferred pinouts for FETs in various package designs. Committee(s): JC-25 Free download. Registration or login required. |
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THERMAL RESISTANCE AND THERMAL IMPEDANCE TEST METHODS FOR STUD AND BASE-MOUNTED RECTIFIER DIODES AND THYRISTORSStatus: Rescinded |
JEP88 | Jan 1974 |
Committee(s): JC-22.1 |
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MICROELECTRONIC DEVICE TYPE ASSIGNMENTSStatus: RescindedJun-92 |
JEP93 | Jan 1975 |
Committee(s): JCJEDC |
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RECOMMENDED PRACTICE FOR DUAL DIMENSIONINGStatus: Rescinded |
JEP86-A | Jan 1976 |
Committee(s): JC-11 |
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GUIDELINES FOR NONDESTRUCTIVE PULL TESTING OF WIRE BONDS ON HYBRID DEVICESStatus: Rescinded |
JEP96 | Jan 1977 |
Committee(s): JC-13.5 |
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GLOSSARY OF MICROELECTRONIC TERMS, DEFINITIONS, AND SYMBOLS: ELEVATED TO JESD99, June 1985.Status: Rescinded |
JEP99 | Jul 1977 |
Committee(s): JC-10 Free download. Registration or login required. |
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STANDARD FOR 64K x 1 DYNAMIC RAM - SUPERSEDED BY JESD21-C.Status: RescindedApr-85 |
JEP102 | Jan 1978 |
Committee(s): JC-42 |
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TERMS, DEFINTIONS, AND LETTER SYMBOLS FOR MICROCOMPUTERS AND MEMORY INTEGRATED CIRCUITS: ELEVATED TO JESD100, August 1993.Status: Rescinded |
JEP100 | Sep 1979 |
Committee(s): JC-10 Free download. Registration or login required. |
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JEDEC GUIDELINE FOR THE CHARACTERIZATION OF HYBRID POLYMERIC MATERIALS - SUPERSEDED BY JESD72, June 2001Status: Rescinded |
JEP105 | Apr 1983 |
Committee(s): JC-13.5 Free download. Registration or login required. |
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THERMAL RESISTANCE FOR TEST METHODS FOR SIGNAL DIODES - SUPERSEDED BY EIA-531, July 1986. See JESD531, April 2002.Status: Rescinded |
JEP90 | Sep 1983 |
Committee(s): JC-22.4 Free download. Registration or login required. |
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LETTER SYMBOLS USED WITH INFRARED DEVICES - INCORPORATED INTO JESD77-A.Status: Rescinded |
JEP75 | Aug 1984 |
Committee(s): JC-10 Free download. Registration or login required. |
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TEST METHOD FOR QUALIFICATION AND ACCEPTANCE OF PARTICLE GETTERS FOR USE IN HYBRID MICROELECTRONIC APPLICATIONS - SUPERSEDED BY JESD72, June 2001Status: Rescinded |
JEP107 | Apr 1985 |
Committee(s): JC-13.5 Free download. Registration or login required. |
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TEST PROCEDURES FOR CUSTOM MONOLITHIC MICROCIRCUITS - SUPERSEDED BY MIL-PRF-38535C.Status: RescindedJun-96 |
JEP111 | Jan 1986 |
SOLID STATE PRODUCTS REGISTRATION LIST(ORDER FROM TYPE ADMINISTRATION OFFICE)Status: ReaffirmedNovember 2002 |
JEP64 | Jan 1986 |
This publication includes addenda from 1976 to August 1986. The purpose of this list is to determine release numbers (file numbers) for JEDEC Type Designations. (See page 6 for more information.) Committee(s): JCJEDC |
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TEST METHOD FOR QUALIFICATION AND ACCEPTANCE OF CIRCUIT SUPPORT FILMS FOR USE IN MICROELECTRONIC APPLICATIONS - SUPERSEDED BY JESD72, June 2001Status: Rescinded |
JEP112 | Jun 1987 |
Committee(s): JC-13 Free download. Registration or login required. |
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GUIDELINES FOR THE MEASUREMENT OF THERMAL RESISTANCE OF GaAs FETS: |
JEP110 | Jul 1988 |
This publication is intended for power GaAs FET applications requiring high reliability. An accurate measurement of thermal resistance is extremely important to provide the user with knowledge of the FETs operating temperature so that more accurate life estimates can be made. FET failure mechanisms and failure rates have, in general, an exponential dependence on temperature (which is why temperature-accelerated testing is successful). Because of the exponential relationship of failure rate with temperature, the thermal resistance should be referenced to the hottest part of the FET. Committee(s): JC-14.7 Free download. Registration or login required. |