Global Standards for the Microelectronics Industry
Standards & Documents Search
Title |
Document # | Date |
|---|---|---|
TEST PROCEDURES FOR VERIFICATION OF MAXIMUM RATINGS OF POWER TRANSISTORS:Status: ReaffirmedSeptember 1981, April 1999 |
JEP65 | Dec 1967 |
This publication describes tests which are intended to represent the verification of maximum ratings for data sheets; they are not tests for performance or quality level. This material is to be used in conjunction with formats developed for device registration and defining data. Committee(s): JC-25 Free download. Registration or login required. |
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THERMAL RESISTANCE AND THERMAL IMPEDANCE TEST METHODS FOR STUD AND BASE-MOUNTED RECTIFIER DIODES AND THYRISTORSStatus: Rescinded |
JEP88 | Jan 1974 |
Committee(s): JC-22.1 |
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THERMAL RESISTANCE FOR TEST METHODS FOR SIGNAL DIODES - SUPERSEDED BY EIA-531, July 1986. See JESD531, April 2002.Status: Rescinded |
JEP90 | Sep 1983 |
Committee(s): JC-22.4 Free download. Registration or login required. |
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THERMAL TEST CHIP GUIDELINE (WIRE BOND TYPE CHIP)- SUPERSEDED BY JESD51-4, September 1997.Status: ElevatedSeptember 1997 |
JEP129 | Feb 1997 |
Committee(s): JC-15.1 Free download. Registration or login required. |
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UNDERSTANDING ELECTRICAL OVERSTRESS - EOSStatus: Reaffirmed May 2022 |
JEP174 | Sep 2016 |
This purpose of this white paper will be to introduce a new perspective about EOS to the electronics industry. As failures exhibiting EOS damage are commonly experienced in the industry, and these severe overstress events are a factor in the damage of many products, the intent of the white paper is to clarify what EOS really is and how it can be mitigated once it is properly comprehended. Committee(s): JC-14.3 Free download. Registration or login required. |
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USER GUIDELINES FOR IR THERMAL IMAGING DETERMINATION OF DIE TEMPERATURE: |
JEP138 | Sep 1999 |
The purpose of these user guidelines is to provide background and an example for the use of an infrared (IR) microscope to determine die temperature of electronic devices for calculations such as thermal resistance. Committee(s): JC-25 Free download. Registration or login required. |
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