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Title	Document #	Date
PartModel Generated ECAD - Models Guidelines for Electronic-Device Packages – XML Requirements	JEP30-M100	Feb 2025
This standard establishes the requirements for exchanging part data between part manufacturers and their customers for electrical and electronic products. This standard applies to all forms of electronic parts. It covers several sub-sections such as electrical, physical, thermal, assembly process classification data along with materials and substances that may be present in the supplied product or sub-products. This Guideline specifically focuses on the “generated ECAD model” subsection of the Part Model. For more information visit the main JEP30 webpage. A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-11, JC-11.2 Free download. Registration or login required.
Part Model Guidelines for Electronic-Device Packages – XML Requirements	JEP30F	Feb 2025
This standard establishes the requirements for exchanging part data between part manufacturers and their customers for electrical and electronic products. This standard applies to all forms of electronic parts. It covers several sub-sections such as electrical, physical, thermal, assembly process classification data along with materials and substances that may be present in the supplied product or sub-products. This Guideline specifically focuses on the parental structure, under which several sub-section listed above, can be contained and linked together within the Part Model parent structure. For more information visit the main JEP30 webpage. A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-11, JC-11.2 Free download. Registration or login required.
Part Model Package Guidelines for Electronic-Device Packages – XML Requirements	JEP30-P100G	Feb 2025
This standard establishes the requirements for exchanging part data between part manufacturers and their customers for electrical and electronic products. This standard applies to all forms of electronic parts. It forms part of the Part Model XML Schema, which covers the parental structure for the electrical, physical, thermal, assembly process classification data along with materials and substances that may be present in the supplied product or sub-products. This Guideline specifically focuses on the "Package" subsection of the Part Model. For more information visit the main JEP30 webpage. A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-11, JC-11.2 Free download. Registration or login required.
Part Model Thermal Guidelines for Electronic-Device Packages – XML Requirements	JEP30-T100B.01	Feb 2025
This standard establishes the requirements for exchanging part data between part manufacturers and their customers for electrical and electronic products. This standard applies to all forms of electronic parts. It forms part of the Part Model XML Schema, which covers the parental structure for the electrical, physical, thermal, assembly process classification data along with materials and substances that may be present in the supplied product or sub-products. This Guideline specifically focuses on the "Thermal" subsection of the Part Model. For more information visit the main JEP30 webpage. A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-11, JC-11.2, JC-15 Free download. Registration or login required.
PART MODEL SCHEMAS	JEP30-10v8-0-0	Feb 2025
This download includes all files under the parent schema JEP30-10v8-0-0 (Committees: JC-11, JC-11.2) including: JEP30-A101v2-0-4 (Assembly Process), Committees: JC-11, JC-11.2, JC-14 JEP30-E101v5-0-0 (Electrical), Committees: JC-11, JC-11.2, JC-16 JEP30-P101v8-0-0 (Package), Committees: JC-11, JC-11.2 JEP30-S101v1-1-1 (Supply Chain), Committees: JC-11, JC-11.2, JC-14 JEP30-T101v2-0-4 (Thermal) Committees: JC-11, JC-11.2, JC-15 JEP30-K101v1-0-0 (Design Rule Kits) JEP30-M101v1-0-0 (ECAD Models Guidelines) JEP30-D10v5-0-0 (Types Dictionary) Committees: JC-11, JC-11.2 This will enable the user to validate the schemas. For more information visit the main JEP30 webpage. A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-11, JC-11.2, JC-14, JC-15, JC-16 Free download. Registration or login required.
STANDARD MANUFACTURER'S IDENTIFICATION CODE	JEP106BL	Feb 2025
The manufacturers identification code is defined by one or more 8 bit fields, each consisting of 7 data bits plus 1 odd parity bit. The manufacturers identification code is assigned, maintained and updated by the JEDEC Office. The intent of this identification code is that it may be used whenever a digital field is required, e.g., hardware, software, documentation, etc. To make a request for an ID Code please go to https://www.jedec.org/standards-documents/id-codes-order-form A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-42, JC-42.3 Free download. Registration or login required.

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