Global Standards for the Microelectronics Industry
Standards & Documents Search
| Title | Document # | Date |
|---|---|---|
GUIDELINES FOR PREPARING CUSTOMER-SUPPLIED BACKGROUND INFORMATION RELATING TO A SEMICONDUCTOR-DEVICE FAILURE ANALYSIS:Status: Reaffirmed January 2025 |
JEP134 | Sep 1998 |
The purpose of this Guideline is to provide a vehicle for acquiring and transmitting the necessary information in a concise, organized, and consistent format. Included in the Guideline is a sample form that facilitates transferring the maximum amount of background data to the failure analyst in a readily interpretable format. Immediate availability of this key information assists that analyst in completing a timely and accurate failure analysis. Committee(s): JC-14.4 Free download. Registration or login required. |
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SIGNATURE ANALYSIS:Status: Reaffirmed January 2025 |
JEP136 | Jul 1999 |
Signature Analysis is a method to reduce the number of comprehensive physical failure analyses by the application of statistical inference techniques. The purpose of this document is to promote a common definition of Signature Analysis by inference, using the same statistical techniques, and to recognize that it is formal means of doing failure analysis.
Committee(s): JC-14.4 Free download. Registration or login required. |
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COMMON FLASH INTERFACE (CFI) IDENTIFICATION CODES: |
JEP137B | May 2004 |
This publication is a companion document to the Common Flash Interface (CFI) standard, JESD68, which outlines the device and host system software interrogation handshake. JEP137 documents ID Code assignments for: 1)) the Algorithm-specific Command Set and Control Interfaces and 2) the Device Interfaces. It is published as needed when additions are made to either of these lists of codes. To make a request for an ID Code please contact the JEDEC Office at (703)907-7558. Committee(s): JC-42.4 Free download. Registration or login required. |
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USER GUIDELINES FOR IR THERMAL IMAGING DETERMINATION OF DIE TEMPERATURE: |
JEP138 | Sep 1999 |
The purpose of these user guidelines is to provide background and an example for the use of an infrared (IR) microscope to determine die temperature of electronic devices for calculations such as thermal resistance. Committee(s): JC-25 Free download. Registration or login required. |
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TEST PROCEDURES FOR VERIFICATION OF MAXIMUM RATINGS OF POWER TRANSISTORS:Status: ReaffirmedSeptember 1981, April 1999 |
JEP65 | Dec 1967 |
This publication describes tests which are intended to represent the verification of maximum ratings for data sheets; they are not tests for performance or quality level. This material is to be used in conjunction with formats developed for device registration and defining data. Committee(s): JC-25 Free download. Registration or login required. |
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