Global Standards for the Microelectronics Industry
Standards & Documents Search
Title |
Document # | Date |
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USER GUIDELINES FOR IR THERMAL IMAGING DETERMINATION OF DIE TEMPERATURE: |
JEP138 | Sep 1999 |
The purpose of these user guidelines is to provide background and an example for the use of an infrared (IR) microscope to determine die temperature of electronic devices for calculations such as thermal resistance. Committee(s): JC-25 Free download. Registration or login required. |
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UNDERSTANDING ELECTRICAL OVERSTRESS - EOS |
JEP174 | Sep 2016 |
This purpose of this white paper will be to introduce a new perspective about EOS to the electronics industry. As failures exhibiting EOS damage are commonly experienced in the industry, and these severe overstress events are a factor in the damage of many products, the intent of the white paper is to clarify what EOS really is and how it can be mitigated once it is properly comprehended. Committee(s): JC-14.3 Free download. Registration or login required. |
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THERMAL TEST CHIP GUIDELINE (WIRE BOND TYPE CHIP)- SUPERSEDED BY JESD51-4, September 1997.Status: ElevatedSeptember 1997 |
JEP129 | Feb 1997 |
Committee(s): JC-15.1 Free download. Registration or login required. |
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THERMAL RESISTANCE FOR TEST METHODS FOR SIGNAL DIODES - SUPERSEDED BY EIA-531, July 1986. See JESD531, April 2002.Status: Rescinded |
JEP90 | Sep 1983 |
Committee(s): JC-22.4 Free download. Registration or login required. |
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THERMAL RESISTANCE AND THERMAL IMPEDANCE TEST METHODS FOR STUD AND BASE-MOUNTED RECTIFIER DIODES AND THYRISTORSStatus: Rescinded |
JEP88 | Jan 1974 |
Committee(s): JC-22.1 |
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TEST PROCEDURES FOR VERIFICATION OF MAXIMUM RATINGS OF POWER TRANSISTORS:Status: ReaffirmedSeptember 1981, April 1999 |
JEP65 | Dec 1967 |
This publication describes tests which are intended to represent the verification of maximum ratings for data sheets; they are not tests for performance or quality level. This material is to be used in conjunction with formats developed for device registration and defining data. Committee(s): JC-25 Free download. Registration or login required. |
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TEST PROCEDURES FOR CUSTOM MONOLITHIC MICROCIRCUITS - SUPERSEDED BY MIL-PRF-38535C.Status: RescindedJun-96 |
JEP111 | Jan 1986 |
Test Procedure for the Measurement of Terrestrial Cosmic Ray Induced Destructive Effects in Power Semiconductor Devices |
JEP151A | Jan 2022 |
This test method defines the requirements and procedures for terrestrial destructive* single-event effects (SEE) for example, single-event breakdown (SEB), single-event latch-up (SEL) and single-event gate rupture (SEGR) testing . It is valid when using an accelerator, generating a nucleon beam of either; 1) Mono-energetic protons or mono-energetic neutrons of at least 150 MeV energy, or 2) Neutrons from a spallation spectrum with maximum energy of at least 150 MeV. This test method does not apply to testing that uses beams with particles heavier than protons. *This test method addresses a separate risk than does JESD89 tests for non-destructive SEE due to cosmic radiation effects on terrestrial applications.
Committee(s): JC-14.1 Free download. Registration or login required. |
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TEST METHOD FOR QUALIFICATION AND ACCEPTANCE OF PARTICLE GETTERS FOR USE IN HYBRID MICROELECTRONIC APPLICATIONS - SUPERSEDED BY JESD72, June 2001Status: Rescinded |
JEP107 | Apr 1985 |
Committee(s): JC-13.5 Free download. Registration or login required. |
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TEST METHOD FOR QUALIFICATION AND ACCEPTANCE OF CIRCUIT SUPPORT FILMS FOR USE IN MICROELECTRONIC APPLICATIONS - SUPERSEDED BY JESD72, June 2001Status: Rescinded |
JEP112 | Jun 1987 |
Committee(s): JC-13 Free download. Registration or login required. |
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