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Title	Document #	Date
BEADED THERMOCOUPLE TEMPERATURE MEASUREMENT OF SEMICONDUCTOR PACKAGES Status: ReaffirmedJune 2006, September 2011, January 2015	JEP140	Jun 2002
The beaded thermocouple temperature measurement guideline provides a procedure to accurately and consistently measure the temperature of semiconductor packages during exposure to thermal excursions. The guideline applications can include, but not limited to, temperature profile measurement in reliability test chambers and solder reflow operations that are associated with component assembly to printed wiring boards. Committee(s): JC-14, JC-14.1 Free download. Registration or login required.

Title

Document #

Date

BEADED THERMOCOUPLE TEMPERATURE MEASUREMENT OF SEMICONDUCTOR PACKAGES

Status: ReaffirmedJune 2006, September 2011, January 2015

JEP140

Jun 2002

The beaded thermocouple temperature measurement guideline provides a procedure to accurately and consistently measure the temperature of semiconductor packages during exposure to thermal excursions. The guideline applications can include, but not limited to, temperature profile measurement in reliability test chambers and solder reflow operations that are associated with component assembly to printed wiring boards.

Committee(s): JC-14, JC-14.1

Free download. Registration or login required.

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BEADED THERMOCOUPLE TEMPERATURE MEASUREMENT OF SEMICONDUCTOR PACKAGES

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