Global Standards for the Microelectronics Industry
Standards & Documents Search
Displaying 1 - 6 of 6 documents. Show 5 results per page.
Title![]() |
Document # | Date |
---|---|---|
PART MODEL THERMAL GUIDELINES FOR ELECTRONIC-DEVICE PACKAGES – XML REQUIREMENTS |
JEP30-T100 | Mar 2018 |
JEP30-T100 has been superseded and is provided here for reference only. For more information, visit the JEP30 webpage.This standard establishes the requirements for exchanging part data between part manufacturers and their customers for electrical and electronic products. This standard applies to all forms of electronic parts. It forms part of the Part Model XML Schema, which covers the parental structure for the electrical, physical, thermal, assembly process classification data along with materials and substances that may be present in the supplied product or sub-products. This Guideline specifically focuses on the "Thermal" subsection of the Part Model. Committee(s): JC-11.2 Free download. Registration or login required. |
||
PART MODEL SCHEMAS |
JEP30-10v2-0-0 | Mar 2023 |
This download includes all files under the parent schema JEP30-10v2-0-0 (Committees: JC-11, JC-11.2) including:
This will enable the user to validate the schemas. For more information visit the main JEP30 webpage. Committee(s): JC-11, JC-11.2, JC-14, JC-15, JC-16 Free download. Registration or login required. |
||
PART MODEL PACKAGE SCHEMA |
JEP30-P101X | Mar 2018 |
JEP30-P101X has been superseded and is provided here for reference only. For more information, visit the JEP30 webpage. In conjunction with JEP30-P100, for user support thiis file is the entire “Part Model Package Schema” (JEP30-10 Part Model Schema, JEP30-P101 Part Model Package Schema, and JEP30-D10 Part Model Schema Types Dictionary). Committee(s): JC-11 Free download. Registration or login required. |
||
PART MODEL PACKAGE GUIDELINES FOR ELECTRONIC-DEVICE PACKAGES – XML REQUIREMENTS |
JEP30-P100.01 | May 2018 |
JEP30-P100.01 has been superseded and is provided here for reference only. For more information, visit the JEP30 webpage.This standard establishes the requirements for exchanging part data between part manufacturers and their customers for electrical and electronic products. This standard applies to all forms of electronic parts. It forms part of the Part Model XML Schema, which covers the parental structure for the electrical, physical, thermal, assembly process classification data along with materials and substances that may be present in the supplied product or sub-products. This Guideline specifically focuses on the "Package" subsection of the Part Model. Committee(s): JC-11.2 Free download. Registration or login required. |
||
PART MODEL ELECTRICAL GUIDELINES FOR ELECTRONIC-DEVICE PACKAGES – XML REQUIREMENTS |
JEP30-E100 | Apr 2018 |
JEP30-E100 has been superseded and is provided here for reference only. For more information, visit the JEP30 webpage.This standard establishes the requirements for exchanging part data between part manufacturers and their customers for electrical and electronic products. This standard applies to all forms of electronic parts. It forms part of the Part Model XML Schema, which covers the parental structure for the electrical, physical, Electrical, assembly process classification data along with materials and substances that may be present in the supplied product or subproducts. This Guideline specifically focuses on the “Electrical” sub-section of the Part Model. Committee(s): JC-11.2 Free download. Registration or login required. |
||
PART MODEL ASSEMBLY PROCESS CLASSIFICATION GUIDELINES FOR ELECTRONIC-DEVICE PACKAGES – XML REQUIREMENTS |
JEP30-A100 | Feb 2018 |
JEP30-A100 has been superseded and is provided here for reference only. For more information, visit the JEP30 webpage.This standard establishes the requirements for exchanging part data between part manufacturers and their customers for electrical and electronic products. This standard applies to all forms of electronic parts. It forms part of the Part Model XML Schema, which covers the parental structure for the electrical, physical, thermal, assembly process classification data along with materials and substances that may be present in the supplied product or subproducts. This Guideline specifically focuses on the “Assembly Process Classification” subsection of the Part Model. Committee(s): JC-11.2 Free download. Registration or login required. |