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BEADED THERMOCOUPLE TEMPERATURE MEASUREMENT OF SEMICONDUCTOR PACKAGESStatus: ReaffirmedJune 2006, September 2011, January 2015
The beaded thermocouple temperature measurement guideline provides a procedure to accurately and consistently measure the temperature of semiconductor packages during exposure to thermal excursions. The guideline applications can include, but not limited to, temperature profile measurement in reliability test chambers and solder reflow operations that are associated with component assembly to printed wiring boards.
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