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Displaying 1 - 14 of 14 documents. Show 5 | 10 results per page.

Title	Document #	Date
GENERAL REQUIREMENTS FOR DISTRIBUTORS OF MILITARY SEMICONDUCTOR DEVICES: Status: Rescinded	JEP109-C	Mar 1995
Superseded by JESD31-A, June 2001. Committee(s): JC-13 Free download. Registration or login required.
GUIDE FOR THE PRODUCTION AND ACQUISITION OF RADIATION-HARDNESS ASSURED MULTICHIP MODULES AND HYBRID MICROCIRCUITS:	JEP133C	Jan 2010
A revised and expanded publication for suppliers and users of radiation hardness assured (RHA) multichip modules (MCMs) and hybrid microcircuits, is now available. The document provides guidance as to how to achieve, maintain and ensure required levels of radiation-hardness given the fact that the constituent dice can have different levels of hardness assurance. It also describes how to deal with the various radiation hardness situations that an MCM/Hybrid developer, procuring activity or user will encounter. The guide is intended to supplement three relevant performance specifications: MIL-PRF-38534, MIL-PRF-38535 and MIL-PRF-19500. Committee(s): JC-13.5, JC-13.4 Free download. Registration or login required.
GUIDELINE FOR INTERNAL GAS ANALYSIS FOR MICROELECTRONIC PACKAGES Status: Reaffirmed November 2020	JEP144A	Nov 2011
This guideline is applicable to hermetically sealed microelectronic components (including discrete semiconductors, monolithic and hybrid microcircuits). Specific cases with unique packaging, materials, or environmental constraints may not find all of the following information and procedures applicable. Committee(s): JC-13 Free download. Registration or login required.
GUIDELINE FOR OBTAINING AND ACCEPTING MATERIAL FOR USE IN HYBRID/MCM PRODUCTS: Status: ReaffirmedSeptember 2009	JEP142	May 2002
This document provides guidance regarding design considerations, material assessment techniques, and recommendations for material acceptance prior to use in Hybrid/MCM Products. As part of the risk assessment process, both technical requirements and cost should be carefully considered with regard to testing/evaluating the elements of a hybrid microcircuit or Multi-chip Module (MCM) prior to material release for assembly. The intent of this document is to highlight various options that are available to the Hybrid / MCM manufacturer and provide associated guidance, not to impose a specific set of tests. Committee(s): JC-13, JC-13.5 Free download. Registration or login required.
GUIDELINES FOR NONDESTRUCTIVE PULL TESTING OF WIRE BONDS ON HYBRID DEVICES Status: Rescinded	JEP96	Jan 1977
Committee(s): JC-13.5
GUIDELINES FOR PARTICLE IMPACT NOISE DETECTION (PIND) TESTING, OPERATOR TRAINING, AND CERTIFICATION Status: ReaffirmedJanuary 2013	JEP114.01	Oct 2007
This publication was developed to help the user of this test methodology avoid common interference ∆s to successful application. The guide contains sections on typical specification requirements, sources of particles, PIND test systems, calibration, maintenance, test interference's, operator training, particle recovery and failure analysis. Application of the information contained in the guide will improve the quality and affectivity for any PIND testing operation. Committee(s): JC-13, JC-13.5 Free download. Registration or login required.
JEDEC GUIDELINE FOR THE CHARACTERIZATION OF HYBRID POLYMERIC MATERIALS - SUPERSEDED BY JESD72, June 2001 Status: Rescinded	JEP105	Apr 1983
Committee(s): JC-13.5 Free download. Registration or login required.
JEDEC REQUIREMENTS FOR CLASS B MICROCIRCUITS Status: Rescinded, May 2006	JEP101-C	Nov 1995
Committee(s): JC-13.2 Free download. Registration or login required.
PROCESS CHARACTERIZATION GUIDELINE	JEP132A	Aug 2018
This guideline provides a methodology to characterize a new or existing process and is applicable to any manufacturing or service process. It describes when to use specific tools such as failure mode effects analysis (FEMA), design or experiments (DOE), measurement system evaluation (MSE), capability analysis (CpK), statistical process control (SPC), and problem solving tools. It also provides a brief description of each tool. Committee(s): JC-13 Free download. Registration or login required.
REQUIREMENTS FOR MICROELECTRONIC SCREENING AND TEST OPTIMIZATION:	JEP121B	Dec 2020
The purpose of this document provides the basis for the optimization of 100% screening/stress operations and sample inspection test activities. This document is designed to assist the manufacturer in optimizing the test flow while maintaining and/or improving assurance of providing high quality and reliable product in an efficient manner. This will allow for optimization of testing that is not adding value, hence, reducing cycle time and costs. Committee(s): JC-13, JC-13.2 Free download. Registration or login required.
SELECTION OF BURN-IN/LIFE TEST CONDITIONS AND CRITICAL PARAMETERS FOR QML MICROCIRCUITS	JEP163	Sep 2015
This publication is intended as a guideline to develop and establish conditions for burn-in and life test of MIL-PRF-38535 QML integrated circuits. These guidelines are intended to provide manufacturers with a consistent means of defining burn-in and life test stress and electrical test requirements acceptable to user organizations and for the development of Standard Military Drawings. Committee(s): JC-13.2 Free download. Registration or login required.
TEST METHOD FOR QUALIFICATION AND ACCEPTANCE OF CIRCUIT SUPPORT FILMS FOR USE IN MICROELECTRONIC APPLICATIONS - SUPERSEDED BY JESD72, June 2001 Status: Rescinded	JEP112	Jun 1987
Committee(s): JC-13 Free download. Registration or login required.
TEST METHOD FOR QUALIFICATION AND ACCEPTANCE OF PARTICLE GETTERS FOR USE IN HYBRID MICROELECTRONIC APPLICATIONS - SUPERSEDED BY JESD72, June 2001 Status: Rescinded	JEP107	Apr 1985
Committee(s): JC-13.5 Free download. Registration or login required.
TEST PROCEDURES FOR CUSTOM MONOLITHIC MICROCIRCUITS - SUPERSEDED BY MIL-PRF-38535C. Status: RescindedJun-96	JEP111	Jan 1986
Committee(s): JC-13, JC-13.2

Standards & Documents Search

GENERAL REQUIREMENTS FOR DISTRIBUTORS OF MILITARY SEMICONDUCTOR DEVICES:

GUIDE FOR THE PRODUCTION AND ACQUISITION OF RADIATION-HARDNESS ASSURED MULTICHIP MODULES AND HYBRID MICROCIRCUITS:

GUIDELINE FOR INTERNAL GAS ANALYSIS FOR MICROELECTRONIC PACKAGES

GUIDELINE FOR OBTAINING AND ACCEPTING MATERIAL FOR USE IN HYBRID/MCM PRODUCTS:

GUIDELINES FOR NONDESTRUCTIVE PULL TESTING OF WIRE BONDS ON HYBRID DEVICES

GUIDELINES FOR PARTICLE IMPACT NOISE DETECTION (PIND) TESTING, OPERATOR TRAINING, AND CERTIFICATION

JEDEC GUIDELINE FOR THE CHARACTERIZATION OF HYBRID POLYMERIC MATERIALS - SUPERSEDED BY JESD72, June 2001

JEDEC REQUIREMENTS FOR CLASS B MICROCIRCUITS

PROCESS CHARACTERIZATION GUIDELINE

REQUIREMENTS FOR MICROELECTRONIC SCREENING AND TEST OPTIMIZATION:

SELECTION OF BURN-IN/LIFE TEST CONDITIONS AND CRITICAL PARAMETERS FOR QML MICROCIRCUITS

TEST METHOD FOR QUALIFICATION AND ACCEPTANCE OF CIRCUIT SUPPORT FILMS FOR USE IN MICROELECTRONIC APPLICATIONS - SUPERSEDED BY JESD72, June 2001

TEST METHOD FOR QUALIFICATION AND ACCEPTANCE OF PARTICLE GETTERS FOR USE IN HYBRID MICROELECTRONIC APPLICATIONS - SUPERSEDED BY JESD72, June 2001

TEST PROCEDURES FOR CUSTOM MONOLITHIC MICROCIRCUITS - SUPERSEDED BY MIL-PRF-38535C.

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