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Displaying 1 - 10 of 14 documents. Show 5 | 10 results per page.

Title Document # Datesort descending

GUIDELINES FOR NONDESTRUCTIVE PULL TESTING OF WIRE BONDS ON HYBRID DEVICES

Status: Rescinded 		JEP96 Jan 1977

Committee(s): JC-13.5

JEDEC GUIDELINE FOR THE CHARACTERIZATION OF HYBRID POLYMERIC MATERIALS - SUPERSEDED BY JESD72, June 2001

Status: Rescinded 		JEP105 Apr 1983

Committee(s): JC-13.5

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TEST METHOD FOR QUALIFICATION AND ACCEPTANCE OF PARTICLE GETTERS FOR USE IN HYBRID MICROELECTRONIC APPLICATIONS - SUPERSEDED BY JESD72, June 2001

Status: Rescinded 		JEP107 Apr 1985

Committee(s): JC-13.5

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TEST PROCEDURES FOR CUSTOM MONOLITHIC MICROCIRCUITS - SUPERSEDED BY MIL-PRF-38535C.

Status: RescindedJun-96 		JEP111 Jan 1986

Committee(s): JC-13, JC-13.2

TEST METHOD FOR QUALIFICATION AND ACCEPTANCE OF CIRCUIT SUPPORT FILMS FOR USE IN MICROELECTRONIC APPLICATIONS - SUPERSEDED BY JESD72, June 2001

Status: Rescinded 		JEP112 Jun 1987

Committee(s): JC-13

Free download. Registration or required.

GENERAL REQUIREMENTS FOR DISTRIBUTORS OF MILITARY SEMICONDUCTOR DEVICES:

Status: Rescinded 		JEP109-C Mar 1995

Superseded by JESD31-A, June 2001.

Committee(s): JC-13

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JEDEC REQUIREMENTS FOR CLASS B MICROCIRCUITS

Status: Rescinded, May 2006 		JEP101-C Nov 1995

Committee(s): JC-13.2

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GUIDELINE FOR OBTAINING AND ACCEPTING MATERIAL FOR USE IN HYBRID/MCM PRODUCTS:

Status: ReaffirmedSeptember 2009 		JEP142 May 2002

This document provides guidance regarding design considerations, material assessment techniques, and recommendations for material acceptance prior to use in Hybrid/MCM Products. As part of the risk assessment process, both technical requirements and cost should be carefully considered with regard to testing/evaluating the elements of a hybrid microcircuit or Multi-chip Module (MCM) prior to material release for assembly. The intent of this document is to highlight various options that are available to the Hybrid / MCM manufacturer and provide associated guidance, not to impose a specific set of tests.

Committee(s): JC-13, JC-13.5

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REQUIREMENTS FOR MICROELECTRONIC SCREENING AND TEST OPTIMIZATION:

 JEP121A Oct 2006

The purpose of this document provides the basis for the optimization of 100% screening/stress operations and sample inspection test activities. This document is designed to assist the manufacturer in optimizing the test flow while maintaining and/or improving assurance of providing high quality and reliable product in an efficient manner. This will allow for optimization of testing that is not adding value, hence, reducing cycle time and costs.

Committee(s): JC-13, JC-13.2

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GUIDELINES FOR PARTICLE IMPACT NOISE DETECTION (PIND) TESTING, OPERATOR TRAINING, AND CERTIFICATION

Status: ReaffirmedJanuary 2013 		JEP114.01 Oct 2007

This publication was developed to help the user of this test methodology avoid common interference ∆s to successful application. The guide contains sections on typical specification requirements, sources of particles, PIND test systems, calibration, maintenance, test interference's, operator training, particle recovery and failure analysis. Application of the information contained in the guide will improve the quality and affectivity for any PIND testing operation.

Committee(s): JC-13, JC-13.5

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