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Title	Document #	Date
DDR4 NVDIMM-N Design Standard	JESD248A.01	Apr 2023
Terminology update. This standard defines the electrical and mechanical requirements for 288-pin, 1.2 Volt (VDD), Double Data Rate, Synchronous SDRAM Non-Volatile Dual In-Line Memory Modules with NAND Flash backup (DDR4 NVDIMM-N). A DDR4 NVDIMM-N is a Hybrid Memory Module with a DDR4 DIMM interface consisting of DRAM that is made non-volatile through the use of NAND Flash. Committee(s): JC-45.6 Available for purchase: $123.36 Add to Cart To help cover the costs of producing standards, JEDEC is now charging for non-member access to selected standards and design files. Most of the content on this site remains free to download with registration. Paying JEDEC member companies enjoy free access to all content. Learn more and apply today. Paying JEDEC Members may login for free access.
STANDARD TEST STRUCTURE FOR RELIABILITY ASSESSMENT OF AlCu METALLIZATIONS WITH BARRIER MATERIALS Status: Reaffirmed 04/17/2023	JESD87	Apr 2023
This document describes design of test structures needed to assess the reliability of aluminum-copper, refractory metal barrier interconnect systems. This includes any metal interconnect system where a refractory metal barrier or other barrier material prevents the flow of aluminum and/or copper metal ions from moving between interconnect layers. This document is not intended to show design of test structures to assess aluminum or aluminum-copper alloy systems, without barriers to Al and Cu ion movement, nor for Cu only metal systems. Some total interconnect systems might not include barrier materials on all metal layers. The structures in this standard are designed for cases where a barrier material separates two Al or Al alloy metal layers. The purpose of this document is to describe the design of test structures needed to assess electromigration (EM) and stress-induced-void (SIV) reliability of AlCu barrier metal systems. Committee(s): JC-14.2, JC-14.21 Free download. Registration or login required.
STANDARD METHOD FOR CALCULATING THE ELECTROMIGRATION MODEL PARAMETERS FOR CURRENT DENSITY AND TEMPERATURE: Status: Reaffirmed 4/17/23	JESD63	Apr 2023
This method provides procedures to calculate sample estimates and their confidence intervals for the electromigration model parameters of current density and temperature. The model parameter for current density is the exponent (n) to which the current density is raised in Black's equation. The parameter for temperature is the activation energy for the electromigration failure process. Committee(s): JC-14.2 Free download. Registration or login required.
Temperature Cycling	JESD22-A104F.01	Apr 2023
This standard applies to single-, dual- and triple-chamber temperature cycling in an air or other gaseous medium and covers component and solder interconnection testing. Committee(s): JC-14.1 Free download. Registration or login required.
Definition of the SSTUB32869 Registered Buffer with Parity for DDR2 RDIMM Applications	JESD82-27.01	Mar 2023
Terminology update. This standard defines standard specifications of DC interface parameters, switching parameters, and test loading for definition of the SSTUB32869 registered buffer with parity for driving heavy load on high density DDR2 RDIMM applications. A typical application would be a 36 SDRAM planar DIMM. Committee(s): JC-40 Free download. Registration or login required.
RADIO FRONT END - BASEBAND DIGITAL PARALLEL (RBDP) INTERFACE	JESD207.01	Mar 2023
Terminology update. This document establishes an interface standard for the data path and control plane interface functions for an RFIC component and/or a BBIC component. Committee(s): JC-61 Free download. Registration or login required.
Fully Buffered DIMM Design for Test, Design for Validation (DFx)	JESD82-28A.01	Mar 2023
Terminology update. This FBDIMM DFx standard covers Design for Test, Design for Manufacturing, and Design for Validation (“DFx”) requirements and implementation guidelines for Fully Buffered DIMM technology. Patents(): There are known patent issues that are common to all FBDIMM related specifications. See document for link to FBDIMM Patents. Committee(s): JC-40, JC-40.5 Free download. Registration or login required.
RADIO FRONT END - BASEBAND (RF-BB) INTERFACE	JESD96A.01	Mar 2023
Terminology update. This standard establishes the requirements for an interface between Radio Front End (RF) and Baseband (BB) integrated circuits (IC). Committee(s): JC-61 Free download. Registration or login required.
COMPACT THERMAL MODEL OVERVIEW	JESD15-1.01	Mar 2023
Terminology update. This document should be used in conjunction with the parent document, and is intended to function as an overview to support the effective use of Compact Thermal Model (CTM) methodologies as specified in the companion methods documents. Committee(s): JC-15, JC-15.1 Free download. Registration or login required.
GRAPHICS DOUBLE DATA RATE (GDDR5X) SGRAM STANDARD	JESD232A.01	Mar 2023
Terminology update. This standard defines the Graphics Double Data This standard defines the GDDR5X SGRAM memory standard, including features, device operation, electrical characteristics, timings, signal pin assignments, and package Committee(s): JC-42.3, JC-42.3C Free download. Registration or login required.
SILICON RECTIFIER DIODES:	JESD282B.02	Mar 2023
Terminology update. This legacy document is a comprehensive users’ guide for silicon rectifier diode applications. Committee(s): JC-22.2 Free download. Registration or login required.
DEFINITION OF THE SSTVN16859 2.5-2.6 V 13-BIT TO 26-BIT SSTL_2 REGISTERED BUFFER FOR PC1600, PC2100, PC2700 AND PC3200 DDR DIMM APPLICATIONS	JESD82-13A.01	Mar 2023
Terminology update. Definition of the SSTVN16859 2.5-2.6 V 13-Bit to 26-Bit SSTL_2 Registered Buffer for PC1600, PC2100, PC2700, and PC3200 DDR DIMM Applications Committee(s): JC-40 Free download. Registration or login required.
DDR5 Registering Clock Driver Definition (DDR5RCD03) Release Number: 1.00	JESD82-513	Feb 2023
This standard defines standard specifications of DC interface parameters, switching parameters, and test loading for definition of the DDR5 Registering Clock Driver (RCD) with parity for driving address and control nets on DDR5 RDIMM and LRDIMM applications. The DDR5RCD03 Device ID is DID = 0x0053. Committee(s): JC-40, JC-40.5 Free download. Registration or login required.
DDR5 Registering Clock Driver Definition (DDR5RCD02) Release Number: Rev. 1.00	JESD82-512	Feb 2023
This standard defines specifications of DC interface parameters, switching parameters, and test loading for definition of the DDR5 Registering Clock Driver (RCD) with parity for driving address and control nets on DDR5 RDIMM and LRDIMM applications. The DDR5RCD02 Device ID is DID = 0x0052. Committee(s): JC-40, JC-40.4 Free download. Registration or login required.
DEFINITION OF THE SSTUA32S868 AND SSTUA32D868 REGISTERED BUFFER WITH PARITY FOR 2R X 4 DDR2 RDIMM APPLICATIONS	JESD82-17.01	Feb 2023
(Terminology update.) This standard defines standard specifications of DC interface parameters, switching parameters, and test loading for definition of the SSTUA32S868 and SSTUA32D868 registered buffer with parity test for DDR2 RDIMM applications. Committee(s): JC-40, JC-40.3 Free download. Registration or login required.
DEFINITION OF THE SSTU32S869 AND SSTU32D869 REGISTERED BUFFER WITH PARITY FOR DDR2 RDIMM APPLICATIONS	JESD82-12A.01	Feb 2023
Terminology update. This standard defines standard specifications of DC interface parameters, switching parameters, and test loading for definition of the SSTU32S869 and SSTU32D869 registered buffer with parity for driving heavy load on high-density DDR2 RDIMM applications. A typical application would be a 36 SDRAM planar DIMM. Committee(s): JC-40 Free download. Registration or login required.
FBDIMM: ARCHITECTURE AND PROTOCOL	JESD206.01	Feb 2023
Terminology update. This standard includes four chapters of the FBD Channel Specification (cover) Channel Overview (Chapter 2), Initialization (Chapter 3), Channel Protocol (Chapter 4), and Reliability, Availability, and Serviceability (RAS) (Chapter 5). Patents(): There are known patent issues that are common to all FBDIMM related specifications. See document for link to FBDIMM Patents. Committee(s): JC-40 Free download. Registration or login required.
DEFINITION OF THE SSTU32864 1.8 V CONFIGURABLE REGISTERED BUFFER FOR DDR2 RDIMM APPLICATIONS:	JESD82-7A.01	Feb 2023
Terminology update. This standard defines standard specifications of DC interface parameters, switching parameters, and test loading for definition of the SSTU32864 configurable registered buffer for DDR2 RDIMM applications. Committee(s): JC-40, JC-40.4 Free download. Registration or login required.
INSTRUMENTATION CHIP DATA SHEET FOR FBDIMM DIAGNOSTIC SENSELINES	JESD82-22.01	Feb 2023
Terminology update. This device is a one-chip spectrum analyzer that operates in the frequency range from 1 to 2 GHz.It requires no external components except some filtering of the voltage supply (one inductor, one bypass capacitor). The frequency of the VCO is adjusted by an internal DAC. No PLL loop is used to lock the VCO to a reference frequency. A counter is used to determine the VCO frequency. Committee(s): JC-40, JC-40.4 Free download. Registration or login required.
DEFINITION OF THE SSTV32852 2.5 V 24-BIT TO 48-BIT SSTL_2 REGISTERED BUFFER FOR 1U STACKED DDR DIMM APPLICATIONS:	JESD82-6A.01	Jan 2023
Terminology update. This standard defines standard specifications of DC interface parameters, switching parameters, and test loading for definition of the 32852 24-bit to 48-bit SSTL_2 registered buffer for stacked DDR DIMM applications. Committee(s): JC-40 Free download. Registration or login required.

Standards & Documents Search

DDR4 NVDIMM-N Design Standard

STANDARD TEST STRUCTURE FOR RELIABILITY ASSESSMENT OF AlCu METALLIZATIONS WITH BARRIER MATERIALS

STANDARD METHOD FOR CALCULATING THE ELECTROMIGRATION MODEL PARAMETERS FOR CURRENT DENSITY AND TEMPERATURE:

Temperature Cycling

Definition of the SSTUB32869 Registered Buffer with Parity for DDR2 RDIMM Applications

RADIO FRONT END - BASEBAND DIGITAL PARALLEL (RBDP) INTERFACE

Fully Buffered DIMM Design for Test, Design for Validation (DFx)

RADIO FRONT END - BASEBAND (RF-BB) INTERFACE

COMPACT THERMAL MODEL OVERVIEW

GRAPHICS DOUBLE DATA RATE (GDDR5X) SGRAM STANDARD

SILICON RECTIFIER DIODES:

DEFINITION OF THE SSTVN16859 2.5-2.6 V 13-BIT TO 26-BIT SSTL_2 REGISTERED BUFFER FOR PC1600, PC2100, PC2700 AND PC3200 DDR DIMM APPLICATIONS

DDR5 Registering Clock Driver Definition (DDR5RCD03)

DDR5 Registering Clock Driver Definition (DDR5RCD02)

DEFINITION OF THE SSTUA32S868 AND SSTUA32D868 REGISTERED BUFFER WITH PARITY FOR 2R X 4 DDR2 RDIMM APPLICATIONS

DEFINITION OF THE SSTU32S869 AND SSTU32D869 REGISTERED BUFFER WITH PARITY FOR DDR2 RDIMM APPLICATIONS

FBDIMM: ARCHITECTURE AND PROTOCOL

DEFINITION OF THE SSTU32864 1.8 V CONFIGURABLE REGISTERED BUFFER FOR DDR2 RDIMM APPLICATIONS:

INSTRUMENTATION CHIP DATA SHEET FOR FBDIMM DIAGNOSTIC SENSELINES

DEFINITION OF THE SSTV32852 2.5 V 24-BIT TO 48-BIT SSTL_2 REGISTERED BUFFER FOR 1U STACKED DDR DIMM APPLICATIONS:

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