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The HBM3 DRAM is tightly coupled to the host compute die with a distributed interface. The interface is divided into independent channels. Each channel is completely independent of one another. Channels are not necessarily synchronous to each other. The HBM3 DRAM uses a wide-interface architecture to achieve high-speed, low power operation. Each channel interface maintains a 64 bit data bus operating at double data rate (DDR).

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Committee(s): JC-42, JC-42.2

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This reference for technical writers and educators, manufacturers, and buyers and users of discrete solid state devices is now available. It should aid the technical committees of JEDEC in the avoidance of multiple definitions and reduce the proliferation of redundant definitions. The long-term goal is to include definitions from all JEDEC publications and standards. Each of the approximately two thousand entries is referenced to its source publication, and an annex listing the names of the source publications and their releases dates is included. All entries were reviewed for punctuation, grammar, and clarity, as well as accuracy, and reworded if such was considered warranted. The purpose of this dictionary is to promote the uniform use of terms, definitions, abbreviations, and symbols throughout the solid state industry

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Committee(s): JC-10

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This annex, JESD309-S0-RCC, DDR5 Small Outline Dual Inline Memory Module (SODIMM) Raw Card C Annex, defines the design detail of x16, 1 Package Ranks DDR5 SODIMM. The common feature of DDR5 SODIMM such as the connector pinout can be found in the JESD309, DDR5 Small Outline Dual Inline Memory Module (SODIMM) Common Standard.

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Committee(s): JC-45, JC-45.3

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This annex, JESD309-S0-RCB, DDR5 Small Outline Dual Inline Memory Module with 0-bit ECC (EC0 SODIMM) Raw Card B Annex", defines the design detail of x8, 2 Package Ranks DDR5 NECC SODIMM. The common feature of DDR5 SODIMM such as the connector pinout can be found in the JESD309, DDR5 Small Outline Dual Inline Memory Module (SODIMM) Common Standard.

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Committee(s): JC-45, JC-45.3

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This annex JESD308-U0-RCC, “DDR5 Unbuffered Dual Inline Memory Module (UDIMM) Raw Card C Annex” defines the design detail of x16, 1 Package Ranks DDR5 UDIMM. The common feature of DDR5 UDIMM such as the connector pinout can be found in the JESD308, DDR5 Unbuffered Dual Inline Memory Module (UDIMM) Common Standard. Item 2265.08A

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Committee(s): JC-45, JC-45.3

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This annex JESD308-U4-RCE, DDR5 Unbuffered Dual Inline Memory Module (UDIMM) with 4-bit ECC (EC4 SODIMM) Raw Card E Annex" defines the design detail of x8, 2 Package Ranks DDR5 ECC UDIMM. The common feature of DDR5 UDIMM such as the connector pinout can be found in the JESD308, DDR5 Unbuffered Dual Inline Memory Module (UDIMM) Common Standard.

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Committee(s): JC-45, JC-45.3

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This annex JESD308-U0-RCA, DDR5 Unbuffered Dual Inline Memory Module (UDIMM) Raw Card A Annex defines the design detail of x8, 1 Package Rank DDR5 UDIMM. The common feature of DDR5 UDIMM such as the connector pinout can be found in the JESD308, DDR5 Unbuffered Dual Inline Memory Module (UDIMM) Common Standard.

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Committee(s): JC-45, JC-45.3

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This standard defines the electrical and mechanical requirements for 288-position, 1.1 Volt (VDD and VDDQ), DDR5 Registered (RDIMM), Double Data Rate (DDR), Synchronous DRAM Dual In-Line Memory Modules (DIMM). These Registered DDR5 SDRAM DIMMs are intended for use in server, workstation, and database environments.

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Committee(s): JC-45, JC-45.1

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This standard defines the electrical and mechanical requirements for 288-pin, 1.1 V (VDD), Clocked, Unbuffered, Double Data Rate, Synchronous DRAM Dual In-Line Memory Modules (DDR5 SDRAM CUDIMMs). These DDR5 Clocked Unbuffered DIMMs (CUDIMMs) are intended for use as main memory when installed in Computers.

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Committee(s): JC-45, JC-45.3

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