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Title	Document #	Date
BALL GRID ARRAY PINOUTS STANDARDIZED FOR 32-BIT LOGIC FUNCTIONS:	JESD75	Nov 1999
The purpose of this standard is to provide a pinout standard for dual-die 32-bit logic devices offered in a 96- and 144-ball grid array package for uniformity, multiplicity of sources, elimination of confusion, ease of device specification, and ease use. This standard defines device output for 32-bit wide buffer, driver and transceiver functions. This pinout specifically applies to the conversion of DIP-packaged 16-bit logic devices to LFBGA-packaged dual-die 32-bit logic devices. Committee(s): JC-40 Free download. Registration or login required.
TRANSIENT VOLTAGE SUPPRESSOR STANDARD FOR THYRISTOR SURGE PROTECTIVE DEVICE: Status: ReaffirmedNovember 2006	JESD66	Nov 1999
This standard is applicable to Thyristor Surge Protective Devices. It describes terms and definitions and explains methods for verifying device ratings and measuring device characteristics. The intended users of this standard are those interested in Thyristor Surge Protective Device characterization and rating verification. These devices are used primarily by the telecommunications industry to protect circuits from harmful overvoltages. The Thyristor Surge Protective Device (TSPD) is a semiconductor device that is finding widespread application in the telecommunication industry. The intent of this stand is to provide information on test methods that will reduce the possibility of disagreement and misunderstanding between TSPD vendors and users, and facilitate the determination of device interchangeability. Committee(s): JC-22.5 Free download. Registration or login required.
STANDARD FOR DESCRIPTION OF 2.5 V CMOS LOGIC DEVICES:	JESD80	Nov 1999
The purpose of this standard is to provide a standard for 2.5 V nominal supply-voltage CMOS logic devices, for uniformity, multiplicity of sources, elimination of confusion, ease of device specification, and ease of use. This standard defines dc interface parameters and test loading for CMOS digital logic family based on 2.5 V (nominal) power supply levels at 2.5 V input tolerance. Committee(s): JC-40 Free download. Registration or login required.
SUPERSEDED BY THE TEST METHODS INDICATED BY 'JESD22-' Status: Superseded	JESD22- B	Jan 2000
A complete set of test methods can be obtained from Global Engineering Documents Committee(s): JC-14.1
DESIGN REQUIRMENTS FOR OUTLINES OF SOLID STATE AND RELATED PRODUCTS: DISCONTINUED AS A SEPARATE ITEM. NOW CONTAINED IN JEP95, BOOK 1, SECTION 4. Status: Incorporated	JESD95-1	Jan 2000
Committee(s): JC-11
STANDARD FOR MEASURING FORWARD SWITCHING CHARACTERISTICS OF SEMICONDUCTOR DIODES: Status: ReaffirmedApril 2005	JESD286-B	Feb 2000
This method updates the standard procedure for characterizing the switching of signal or switching diodes when a step function of forward current is applied. The objective is to provide a standard so that accurate comparisons can be made. Formerly known as EIA-286-A (February 1991), ANSI/EIA-286-A-1991. Became JESD286-B after revision, February 2000. Committee(s): JC-22.4 Free download. Registration or login required.
DESCRIPTION OF 1.8 V CMOS LOGIC DEVICES:	JESD76	Apr 2000
This standard continues the voltage specification migration to the next level beyond the 2.5 V specification already established in JESD80. In this standard, the input and output conditions are described for CMOS Logic products in a 1.8 V (Normal Range) application. Committee(s): JC-40.1 Free download. Registration or login required.
TEST BOARDS FOR AREA ARRAY SURFACE MOUNT PACKAGE THERMAL MEASUREMENTS:	JESD51- 9	Jul 2000
This standard covers the design of printed circuit boards (PCBs) used in the thermal characterization of ball grid array (BGA) and land grid array (LGA) packages. It is intended to be used in conjunction with the JESD51 series of standards that cover the test methods and test environments. JESD51-9 was developed to give a figure-of-merit of thermal performance that allows for accurate comparisons of packages from different suppliers. It can be used to give a first order approximation of system performance and, in conjunction with the other JESD51 PCB standards, allows for comparisons of the various package families. Committee(s): JC-15.1 Free download. Registration or login required.
TEST BOARDS FOR THROUGH-HOLE PERIMETER LEADED PACKAGE THERMAL MEASUREMENTS:	JESD51-10	Jul 2000
This standard covers the design of printed circuit boards (PCBs) used in the thermal characterization of Dual-Inline Packages (DIP) and Single-Inline Packages (SIP). It is intended to be used in conjunction with the JESD51 series of standards that cover the test methods and test environments. JESD51-10 was developed to give a figure-of-merit of thermal performance that allows for accurate comparisons of packages from different suppliers. It can be used to give a first order approximation of system performance and, in conjunction with the other JESD51 PCB standards, allows for comparisons of the various package families. Committee(s): JC-15.1 Free download. Registration or login required.
DEFINITION OF CDCV857 PLL CLOCK DRIVER FOR REGISTERED DDR DIMM APPLICATIONS:	JESD82	Jul 2000
This specification is a reference for Registered DDR DIMM designers. JESD82 defines the physical, electrical, interface and timing requirements of a 1:10 PLL clock driver for DDR Registered DIMMs from DDR200 to DDR266 as refined in revision C of JEDEC Standard 21-C (JESD21-C). JESD82 was also written to meet the future performance requirements of Registered DIMMs for DDR300 and DDR333. Committee(s): JC-40 Free download. Registration or login required.
STANDARD FOR DESCRIPTION OF 2.5 V CMOS LOGIC DEVICES WITH 3.6 V CMOS TOLERANT INPUTS AND OUTPUTS:	JESD64-A	Oct 2000
The purpose is to provide a standard for 2.5 V nominal supply voltage logic devices for uniformity, multiplicity of sources, elimination of confusion, ease of device specification, and ease of use. This specification provides for compatibility between devices operating between either the Standard Range of 1.8 V to 2.7 V or the optional Extended Range of 1.65 V to 2.7 V supply voltages, as well as over-voltage tolerance with devices operating at 3.6 V. Committee(s): JC-40 Free download. Registration or login required.
PROCEDURE FOR WAFER-LEVEL-TESTING OF THIN DIELECTRICS: Status: Rescinded	JESD35A	Apr 2001
JESD35A was rescinded by the committee in June 2024 and has been superseded by JESD263. The revised JESD35 is intended for use in the MOS Integrated Circuit manufacturing industry. It describes procedures developed for estimating the overall integrity and reliability of thin gate oxides. Three basic test procedures are described, the Voltage-Ramp (V-Ramp), the Current-Ramp (J-Ramp) and the new Constant Current (Bounded J-Ramp) test. Each test is designed for simplicity, speed and ease of use. The standard has been updated to include breakdown criteria that are more robust in detecting breakdown in thinner gate oxides that may not experience hard thermal breakdown. Committee(s): JC-14.2
STANDARD DESCRIPTION OF 1.2 V CMOS LOGIC DEVICES (NORMAL RANGE OPERATION):	JESD76-2	Jun 2001
This standard defines dc interface, switching parameters and test loading for digital logic devices based on 1.2 V (normal range) power supply levels. The purpose is to provide a standard specification for uniformity, multiplicity of sources, elimination of confusion, ease of device specification, and ease of use. Committee(s): JC-40 Free download. Registration or login required.
STANDARD DESCRIPTION OF 1.2 V CMOS LOGIC DEVICES (WIDE RANGE OPERATION):	JESD76-1	Jun 2001
This standard defines dc interface, switching parameters and test loading for digital logic devices based on 1.2 V (nominal) power supply levels. The purpose is to provide a standard specification for uniformity, multiplicity of sources, elimination of confusion, ease of device specification, and ease of use. Committee(s): JC-40 Free download. Registration or login required.
TEST BOARDS FOR THROUGH-HOLE AREA ARRAY LEADED PACKAGE THERMAL MEASUREMENT:	JESD51-11	Jun 2001
This standard covers the design of printed circuit boards (PCBs) used in the thermal characterization of Pin Grid Array (PGA) packages. It is intended to be used in conjunction with the JESD51 series of standards that cover the test methods and test environments. JESD51-11 was developed to give a figure-of-merit of thermal performance that allows for accurate comparisons of packages from different suppliers. It can be used to give a first order approximation of system performance and, in conjunction with the other JESD51 PCB standards, allows for comparisons of the various package families. Committee(s): JC-15.1 Free download. Registration or login required.
STANDARD FOR DESCRIPTION OF A 3.3 V, 18-BIT, LVTTL I/O REGISTER FOR PC133 REGISTERED DIMM APPLICATIONS:	JESD82-2	Jul 2001
This standard defines the register support devices needed for standard height and low profile registered PC133 SDRAM DIMM modules. The objective of the standard is to clearly define the functionality, pinout and electrical characteristics required for this type of SDRAM module. Committee(s): JC-40 Free download. Registration or login required.
BALL GRID ARRAY PINOUTS STANDARDIZED FOR 16-BIT LOGIC FUNCTIONS:	JESD75-2	Jul 2001
This standard provides a pinout standard for 16-bit wide logic devices offered in a 56-ball areagrid array package to provide for uniformity, multiplicity of sources, elimination of confusion,ease of device specification, and ease of use. Committee(s): JC-40 Free download. Registration or login required.
BALL GRID ARRAY PINOUTS STANDARDIZED FOR 8-BIT LOGIC FUNCTIONS:	JESD75-3	Jul 2001
This standard provides a pinout standard for 8-bit logic devices offered in a 20-ball area gridarray package to provide for uniformity, multiplicity of sources, elimination of confusion, ease of device specification, and ease of use. Committee(s): JC-40 Free download. Registration or login required.
STANDARD DESCRIPTION OF 1.5 V CMOS LOGIC DEVICES:	JESD76-3	Aug 2001
This standard continues the voltage specification migration to the next level beyond the 1.8 V specification already established. The purpose is to provide a standard for 1.5 V nominal supply voltage CMOS logic devices, for uniformity, multiplicity of sources, elimination of confusion, ease of device specification, and ease of use. Committee(s): JC-40, JC-40.1 Free download. Registration or login required.
STANDARD FOR DESCRIPTION OF 3.3 V NFET BUS SWITCH DEVICES WITH INTEGRATED CHARGE PUMPS:	JESD73-2	Aug 2001
This standard covers specifications for a family of 3.3 V NMOS FET bus switch devices with integrated charge pumps. Not included in this document are device specific parameters and performance levels that the vendor must also supply for full device description. The purpose of this standard is to provide a set of uniform data sheet parameters for the description of bus switch devices. This standard includes required parameters, test conditions, test levels, and measurement methods for data sheet descriptions of bus switch devices. Committee(s): JC-40 Free download. Registration or login required.

Standards & Documents Search

BALL GRID ARRAY PINOUTS STANDARDIZED FOR 32-BIT LOGIC FUNCTIONS:

TRANSIENT VOLTAGE SUPPRESSOR STANDARD FOR THYRISTOR SURGE PROTECTIVE DEVICE:

STANDARD FOR DESCRIPTION OF 2.5 V CMOS LOGIC DEVICES:

SUPERSEDED BY THE TEST METHODS INDICATED BY 'JESD22-'

DESIGN REQUIRMENTS FOR OUTLINES OF SOLID STATE AND RELATED PRODUCTS: DISCONTINUED AS A SEPARATE ITEM. NOW CONTAINED IN JEP95, BOOK 1, SECTION 4.

STANDARD FOR MEASURING FORWARD SWITCHING CHARACTERISTICS OF SEMICONDUCTOR DIODES:

DESCRIPTION OF 1.8 V CMOS LOGIC DEVICES:

TEST BOARDS FOR AREA ARRAY SURFACE MOUNT PACKAGE THERMAL MEASUREMENTS:

TEST BOARDS FOR THROUGH-HOLE PERIMETER LEADED PACKAGE THERMAL MEASUREMENTS:

DEFINITION OF CDCV857 PLL CLOCK DRIVER FOR REGISTERED DDR DIMM APPLICATIONS:

STANDARD FOR DESCRIPTION OF 2.5 V CMOS LOGIC DEVICES WITH 3.6 V CMOS TOLERANT INPUTS AND OUTPUTS:

PROCEDURE FOR WAFER-LEVEL-TESTING OF THIN DIELECTRICS:

STANDARD DESCRIPTION OF 1.2 V CMOS LOGIC DEVICES (NORMAL RANGE OPERATION):

STANDARD DESCRIPTION OF 1.2 V CMOS LOGIC DEVICES (WIDE RANGE OPERATION):

TEST BOARDS FOR THROUGH-HOLE AREA ARRAY LEADED PACKAGE THERMAL MEASUREMENT:

STANDARD FOR DESCRIPTION OF A 3.3 V, 18-BIT, LVTTL I/O REGISTER FOR PC133 REGISTERED DIMM APPLICATIONS:

BALL GRID ARRAY PINOUTS STANDARDIZED FOR 16-BIT LOGIC FUNCTIONS:

BALL GRID ARRAY PINOUTS STANDARDIZED FOR 8-BIT LOGIC FUNCTIONS:

STANDARD DESCRIPTION OF 1.5 V CMOS LOGIC DEVICES:

STANDARD FOR DESCRIPTION OF 3.3 V NFET BUS SWITCH DEVICES WITH INTEGRATED CHARGE PUMPS:

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