Global Standards for the Microelectronics Industry
Standards & Documents Search
Title | Document # |
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DDR4 REGISTERING CLOCK DRIVER (DDR4RCD02) |
JESD82-31A.01 | Jan 2023 |
Terminology update. This document defines standard specifications of DC interface parameters, switching parameters, and test loading for definition of the DDR4 Registering Clock Driver (RCD) with parity for driving address and control nets on DDR4 RDIMM and LRDIMM applications. Patents(): A complete list of Assurance/Disclosure Forms is available to JEDEC members in the Members Area. Non-members can obtain individual Assurance/Disclosure Forms on request from the JEDEC office. Committee(s): JC-40.4 Free download. Registration or login required. |
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DEFINITION OF the SSTUB32866 1.8 V CONFIGURABLE REGISTERED BUFFER WITH PARITY FOR DDR2 RDIMM APPLICATIONS |
JESD82-25.01 | Jan 2023 |
Terminology update.This standard defines standard specifications of dc interface parameters, switching parameters, and test loading for definition of the SSTUB32866 registered buffer with parity test for DDR2 RDIMM applications. Committee(s): JC-40 Free download. Registration or login required. |
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LRDIMM DDR3 MEMORY BUFFER (MB) |
JESD82-30.01 | Jan 2023 |
Terminology update. The Load Reduced DIMM (LRDIMM) Memory Buffer (MB) supports DDR3 SDRAM main memory. The Memory Buffer allows buffering of memory traffic to support large memory capacities. Unlike DDR3 Register Buffer (SSTE32882), which only buffers Command, Address, Control and Clock, the LRDIMM Memory Buffer also buffers the Data (DQ) interface between the Memory Controller and the DRAM components. Free download. Registration or login required. |
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DEFINITION OF THE SSTUB32868 REGISTERED BUFFER WITH PARITY FOR 2R x 4 DDR2 RDIMM APPLICATIONS |
JESD82-26.01 | Jan 2023 |
Terminology update. This standard defines standard specifications of DC interface parameters, switching parameters, and test loading for definition of the SSTUB32868 registered buffer with parity test for DDR2 RDIMM applications. The purpose is to provide a standard for the SSTUB32868 (see Note) logic device, for uniformity, multiplicity of sources, elimination of confusion, ease of device specification, and ease of use. Committee(s): JC-40 Free download. Registration or login required. |
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GRAPHICS DOUBLE DATA RATE (GDDR5) SGRAM STANDARDRelease Number: C.01 - Terminology update |
JESD212C.01 | Jan 2023 |
Terminology update. This document defines the Graphics Double Data Rate 5 (GDDR5) Synchronous Graphics Random Access Memory (SGRAM), including features, functionality, package, and pin assignments. The purpose of this Standard is to define the minimum set of requirements for JEDEC standard compatible 512 Mb through 8 Gb x32 GDDR5 SGRAM devices. System designs based on the required aspects of this standard will be supported by all GDDR5 SGRAM vendors providing JEDEC standard compatible devices. Some aspects of the GDDR5 standard such as AC timings and capacitance values were not standardized. Some features are optional and therefore may vary among vendors. In all cases, vendor data sheets should be consulted for specifics. Item 1733.70B Patents(): A complete list of Assurance/Disclosure Forms is available to JEDEC members in the Members Area. Non-members can obtain individual Assurance/Disclosure Forms on request from the JEDEC office. Committee(s): JC-42.3C Free download. Registration or login required. |
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DEFINITION OF the SSTUA32S869 AND SSTUA32D869 REGISTERED BUFFER WITH PARITY FOR DDR2 RDIMM APPLICATIONS |
JESD82-23.01 | Jan 2023 |
Terminology update. This standard defines standard specifications of DC interface parameters, switching parameters, and test loading for definition of the SSTUA32S869 and SSTUA32D869 registered buffer with parity for driving heavy load on high-density DDR2 RDIMM applications. A typical application would be a 36 SDRAM planar DIMM. The SSTUA32S869 and SSTUA32D869 are identical in functionality to the SSTU32S869 and SSTU32D869 devices respectively but specify tighter timing characteristics and a higher application frequency of up to 410MHz. Committee(s): JC-40 Free download. Registration or login required. |
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FBDIMM: ADVANCED MEMORY BUFFER (AMB) |
JESDJESD82-20A.01 | Jan 2023 |
This document is a core specification for a Fully Buffered DIMM (FBD) memory system. This document, along with the other core specifications, must be treated as a whole. Information critical to a Advanced Memory Buffer design appears in the other specifications, with specific cross-references provided. Patents(): There are known patent issues that are common to all FBDIMM related specifications. See document for link to FBDIMM Patents. Committee(s): JC-40 Free download. Registration or login required. |
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DDR5 Serial Presence Detect (SPD) ContentsTerminology update Release Number: Version 1.1 |
JESD400-5A.01 | Jan 2023 |
This standard describes the serial presence detect (SPD) values for all DDR5 memory modules. In this context, “modules” applies to memory modules like traditional Dual In-line Memory Modules (DIMMs) or solder-down motherboard applications. The SPD data provides critical information about all modules on the memory channel and is intended to be used by the system's BIOS in order to properly initialize and optimize the system memory channels. Committee(s): JC-45 Free download. Registration or login required. |
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HIGH BANDWIDTH MEMORY (HBM3) DRAM |
JESD238A | Jan 2023 |
The HBM3 DRAM is tightly coupled to the host compute die with a distributed interface. The interface is divided into independent channels. Each channel is completely independent of one another. Channels are not necessarily synchronous to each other. The HBM3 DRAM uses a wide-interface architecture to achieve high-speed, low power operation. Each channel interface maintains a 64 bit data bus operating at double data rate (DDR). Patents(): A complete list of Assurance/Disclosure Forms is available to JEDEC members in the Members Area. Non-members can obtain individual Assurance/Disclosure Forms on request from the JEDEC office. Free download. Registration or login required. |
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THERMAL SHOCK |
JESD22-A106B.02 | Jan 2023 |
This test is conducted to determine the robustness of a device to sudden exposure to extreme changes in temperature and to the effect of alternate exposures to these extremes. Free download. Registration or login required. |
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IC LATCH-UP TEST |
JESD78F.01 | Dec 2022 |
This standard covers the I-test and Vsupply overvoltage latch-up testing of integrated circuits. The purpose of this standard is to establish a method for determining IC latch-up characteristics and to define latch-up detection criteria. Latch-up characteristics are extremely important in determining product reliability and minimizing No Trouble Found (NTF) and Electrical Overstress (EOS) failures due to latch-up. This test method is applicable to NMOS, CMOS, bipolar, and all variations and combinations of these technologies. This standard has been adopted by the Defense Logistics Agency (DLA) as project 5962-1880. Free download. Registration or login required. |
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STRESS-TEST-DRIVEN QUALIFICATION OF INTEGRATED CIRCUITS |
JESD47L | Dec 2022 |
This standard describes a baseline set of acceptance tests for use in qualifying electronic components as new products, a product family, or as products in a process which is being changed. Available for purchase: $87.38 Add to Cart Paying JEDEC Members may login for free access. |
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Secure Serial Flash Bus TransactionsRelease Number: Version 1.0 |
JESD254 | Dec 2022 |
This standard describes SPI bus transactions intended to support Secure Flash operation on a serial memory device. The on-chip SFDP database described in JESD216 has been revised to include details about the secure transactions. This ballot does not describe the SFDP revisions or the secure packet structure. Patents(): Infineon- US 10868679B1 and Micron- US 9009394B2 Free download. Registration or login required. |
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GUIDELINES FOR COMBINING CIE 127-2007 TOTAL FLUX MEASUREMENTS WITH THERMAL MEASUREMENTS OF LEDS WITH EXPOSED COOLING SURFACE |
JESD51-52A | Nov 2022 |
This document is intended to be used in conjunction with the JESD51-50 series of standards, especially with JESD51-51 (Implementation of the Electrical Test Method for the Measurement of Real Thermal Resistance and Impedance of Light-emitting Diodes with Exposed Cooling Surface) document. This present document focuses on the measurement of the total radiant flux of LEDs in combination with the measurement of LEDs's thermal characteristics: guidelines on the implementation of the recommendations of the CIE 127-2007 document are provided. Committee(s): JC-15 Free download. Registration or login required. |
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TEMPERATURE, BIAS, AND OPERATING LIFE |
JESD22-A108G | Nov 2022 |
This test is used to determine the effects of bias conditions and temperature on solid state devices over time. It simulates the devices’ operating condition in an accelerated way, and is primarily for device qualification and reliability monitoring. A form of high temperature bias life using a short duration, popularly known as burn-in, may be used to screen for infant mortality related failures. The detailed use and application of burn-in is outside the scope of this document. Free download. Registration or login required. |
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Wire Bond Pull Test Methods |
JESD22-B120 | Nov 2022 |
This test method provides a means for determining the strength and failure mode of a wire bonded to, and the corresponding interconnects on, a die or package bonding surface and may be performed on pre-encapsulation or post-encapsulation devices. Free download. Registration or login required. |
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Automotive Solid State Drive (SSD) Device StandardRelease Number: 1.0 |
JESD312 | Nov 2022 |
This standard defines the specifications of interface parameters, signaling protocols, environmental requirements, packaging, and other features for a solid state drive (SSD) targeted primarily at automotive applications. Free download. Registration or login required. |
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OVERVIEW OF METHODOLOGIES FOR THE THERMAL MEASUREMENT OF SINGLE- AND MULTI-CHIP, SINGLE- AND MULTI-PN-JUNCTION LIGHT-EMITTING DIODES (LEDS) |
JESD51-50A | Nov 2022 |
This document provides an overview of the methodology necessary for making meaningful thermal measurements on high-power light-emitting diodes (LEDs) built on single or multiple chips with one or more pn-junctions per chip. The actual methodology components are contained in separate detailed documents. Committee(s): JC-15 Free download. Registration or login required. |
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TEST METHODS TO CHARACTERIZE VOIDING IN PRE-SMT BALL GRID ARRAY PACKAGES |
JESD217A.01 | Nov 2022 |
This publication provides an overview of solder void types, outlines current metrologies and test methods used for pre-SMPT solder void characterization and potential limitations, and prescribes sampling strategy for data collection, and tolerance guidelines for corrective measures. Committee(s): JC-14.1 Free download. Registration or login required. |
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IMPLEMENTATION OF THE ELECTRICAL TEST METHOD FOR THE MEASUREMENT OF REAL THERMAL RESISTANCE AND IMPEDANCE OF LIGHT-EMITTING DIODES WITH EXPOSED COOLING SURFACE |
JESD51-51A | Nov 2022 |
The purpose of this document is to specify, how LEDs thermal metrics and other thermally-related data are best identified by physical measurements using well established testing procedures defined for thermal testing of packaged semiconductor devices (published and maintained by JEDEC) and defined for characterization of light sources (published and maintained by CIE – the International Commission on Illumination). Committee(s): JC-15 Free download. Registration or login required. |