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This standard describes the serial presence detect (SPD) values for all DDR5 memory modules. In this context, “modules” applies to memory modules like traditional Dual In-line Memory Modules (DIMMs) or solder-down motherboard applications. The SPD data provides critical information about all modules on the memory channel and is intended to be use by the system's BIOS in order to properly initialize and optimize the system memory channels.

Committee(s): JC-45

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This annex, JESD309-S0-RCA, DDR5 Small Outline Dual Inline Memory Module (SODIMM) Raw Card A Annex, defines the design detail of x8, 1 Package Rank DDR5 SODIMM. The common feature of DDR5 SODIMM such as the connector pinout can be found in the JESD309, DDR5 Small Outline Dual Inline Memory Module (SODIMM) Common Standard.

Committee(s): JC-45, JC-45.3

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This annex, JESD309-S0-RCC, DDR5 Small Outline Dual Inline Memory Module (SODIMM) Raw Card C Annex, defines the design detail of x16, 1 Package Ranks DDR5 SODIMM. The common feature of DDR5 SODIMM such as the connector pinout can be found in the JESD309, DDR5 Small Outline Dual Inline Memory Module (SODIMM) Common Standard.

Committee(s): JC-45, JC-45.3

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This annex, JESD309-S4-RCD, DDR5 Small Outline Dual Inline Memory Module with 4-bit ECC (EC4 SODIMM) Raw Card D Annex, defines the design detail of x8, 1 Package Rank DDR5 SODIMM with 4-bit ECC. The common feature of DDR5 SODIMM such as the connector pinout can be found in the JESD309, DDR5 Small Outline Dual Inline Memory Module (SODIMM) Common Standard.

Committee(s): JC-45, JC-45.3

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This standard defines the electrical and mechanical requirements for 288-pin, 1.1 V (VDD), Unbuffered, Double Data Rate, Synchronous DRAM Dual In-Line Memory Modules (DDR5 SDRAM UDIMMs). These DDR5 Unbuffered DIMMs (UDIMMs) are intended for use as main memory when installed in Computers.

Committee(s): JC-45, JC-45.3

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This annex, JESD308-U0-RCB, DDR5 Unbuffered Dual Inline Memory Module (UDIMM) Raw Card B Annex, defines the design detail of x8, 2 Package Ranks DDR5 UDIMM. The common feature of DDR5 UDIMM such as the connector pinout can be found in the JESD308, DDR5 Unbuffered Dual Inline Memory Module (UDIMM) Common Standard.

Committee(s): JC-45, JC-45.3

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This annex JESD308-U4-RCD, DDR5 Unbuffered Dual Inline Memory Module with 4-bit ECC (EC4UDIMM) Raw Card D Annex defines the design detail of x8, 1 Package Rank DDR5 UDIMM with 4-bit ECC. The common feature of DDR5 UDIMM such as the connector pinout can be found in the JESD308, DDR5 Unbuffered Dual Inline Memory Module (UDIMM) Common Standard.

Committee(s): JC-45, JC-45.3

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Definition for all DDRx component documents to reference. This is generic to any DDRx
technology. Item 1842.34

Committee(s): JC-42.3C

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This standard defines standard specifications of dc interface parameters, switching parameters, and test loading for definition of a CU878 PLL clock device for registered DDR2 DIMM applications. The purpose is to provide a standard for a CU878 PLL clock device, for uniformity, multiplicity of sources, elimination of confusion, ease of device specification, and ease of use.

Committee(s): JC-40, JC-40.3

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This standard defines reference distances between terminals of the device and the external package at specific voltages.

Committee(s): JC-22.2

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This standard provides the functional definition, ball-out configuration and package outline, signal definitions and input/output characteristics for a 28-bit 1:2 registered driver with parity suitable for use on DDR2 RDIMMs. The SSTU32865 integrates the functional equivalent of two SSTU32864 devices (as defined in JESD82-7) into a single device, thereby easing layout and board design constraints especially on high density RDIMMs such as dual rank, by four configurations. Moreover, the optional use of a parity function is provided for, permitting detection and reporting of parity errors across its 22 data inputs. JESD82-9 specifies a 160-pin Thin-profile, fine-pitch ball-grid array (TFBGA) package. This is a minor editorial revision as shown in Annex A of the document.

Committee(s): JC-40, JC-40.4

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Terminology update.

This standard defines standard specifications of DC interface parameters, switching parameters, and test loading for definition of the SSTU32864 configurable registered buffer for DDR2 RDIMM applications.

Committee(s): JC-40, JC-40.4

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Terminology update.
This standard defines standard specifications of DC interface parameters, switching parameters, and test loading for definition of the SSTU32S869 and SSTU32D869 registered buffer with parity for driving heavy load on high-density DDR2 RDIMM applications. A typical application would be a 36 SDRAM planar DIMM.

Committee(s): JC-40

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This standard defines standard specifications of dc interface parameters, switching parameters, and test loading for definition of the SSTUA32S865 and SSTUA32D865 registered buffer with parity for 2 rank by 4 or similar high-density DDR2 RDIMM applications. This is a minor editor revision as shown in Annex A of the document.

Committee(s): JC-40

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Terminology update.  
This standard defines standard specifications of DC interface parameters, switching parameters, and test loading for definition of the SSTUA32S869 and SSTUA32D869 registered buffer with parity for driving heavy load on high-density DDR2 RDIMM applications. A typical application would be a 36 SDRAM planar DIMM. The SSTUA32S869 and SSTUA32D869 are identical in functionality to the SSTU32S869 and SSTU32D869 devices respectively but specify tighter timing characteristics and a higher application frequency of up to 410MHz.

Committee(s): JC-40

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Terminology update.
This standard defines standard specifications of dc interface parameters, switching parameters, and test loading for definition of the SSTUB32866 registered buffer with parity test for DDR2 RDIMM applications.

Committee(s): JC-40

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Terminology update.  
This standard defines standard specifications of DC interface parameters, switching parameters, and test loading for definition of the SSTUB32868 registered buffer with parity test for DDR2 RDIMM applications. The purpose is to provide a standard for the SSTUB32868 (see Note) logic device, for uniformity, multiplicity of sources, elimination of confusion, ease of device specification, and ease of use.

Committee(s): JC-40

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Terminology update.
This standard defines standard specifications of DC interface parameters, switching parameters, and test loading for definition of the SSTVN16857 14-bit SSTL_2 registered buffer for PC1600, PC2100, PC2700, and PC3200 DDR DIMM applications.

Committee(s): JC-40, JC-40.3

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Terminology update.   

Definition of the SSTVN16859 2.5-2.6 V 13-Bit to 26-Bit SSTL_2 Registered Buffer for PC1600, PC2100, PC2700, and PC3200 DDR DIMM Applications

Committee(s): JC-40

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This standard continues the voltage specification migration to the next level beyond the 2.5 V specification already established in JESD80. In this standard, the input and output conditions are described for CMOS Logic products in a 1.8 V (Normal Range) application.

Committee(s): JC-40.1

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This standard establishes requirements for the generation of electronic-device package designators for JEDEC.

Committee(s): JC-11, JC-11.2

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This standard includes several new items and has been completely rewritten from the original EIA-370. The first is a new letter symbol C so that a JEDEC type designation may now be 2C1234, to indicate that a chip is being designated that if it were properly mounted on the package registered for the 2N1234, it would display characteristics similar to those of the 2N1234. The second major addition is the method for assigning the first numeric symbol for type designations of optoelectronic devices. ANSI/EIA-370-B-1992.

Committee(s): JC-10

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This reference for technical writers and educators, manufacturers, and buyers and users of discrete solid state devices is now available. It should aid the technical committees of JEDEC in the avoidance of multiple definitions and reduce the proliferation of redundant definitions. The long-term goal is to include definitions from all JEDEC publications and standards. Each of the approximately two thousand entries is referenced to its source publication, and an annex listing the names of the source publications and their releases dates is included. All entries were reviewed for punctuation, grammar, and clarity, as well as accuracy, and reworded if such was considered warranted. The purpose of this dictionary is to promote the uniform use of terms, definitions, abbreviations, and symbols throughout the solid state industry

Committee(s): JC-10

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This comprehensive standard defines all required aspects of 64Mb through 1Gb DDR SDRAMs with X4/X8/X16 data interfaces, including features, functionality, ac and dc parametrics, packages and pin assignments. This scope will subsequently be expanded to formally apply to x32 devices, and higher density devices as well The purpose of this Standard is to define the minimum set of requirements for JEDEC compliant 64Mb through 1Gb, X4/X8/X16 DDR SDRAMs. System designs based on the required aspects of this specification will be supported by all DDR SDRAM vendors providing JEDEC compliant devices.

Committee(s): JC-42.3

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This standard defines methods for calculating the early life failure rate of a product, using accelerated testing, whose failure rate is constant or decreasing over time. For technologies where there is adequate field failure data, alternative methods may be used to establish the early life failure rate. The purpose of this standard is to define a procedure for performing measurement and calculation of early life failure rates. Projections can be used to compare reliability performance with objectives, provide line feedback, support service cost estimates, and set product test and screen strategies to ensure that the ELFR meets customers' requirements.

Committee(s): JC-14, JC-14.3

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This stress test is intended to determine the ability of an EEPROM integrated circuit or an integrated circuit with an EEPROM module (such as a microprocessor) to sustain repeated data changes without failure (program/erase endurance) and to retain data for the expected life of the EEPROM (data retention). This Standard specifies the procedural requirements for performing valid endurance and retention tests based on a qualification specification. Endurance and retention qualification specifications (for cycle counts, durations, temperatures, and sample sizes) are specified in JESD47 or may be developed using knowledge-based methods as in JESD94.

Committee(s): JC-14, JC-14.1

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JESD22-A115 is a reference document; it is not a requirement per JESD47 (Stress Test Driven Qualification of Integrated Circuits). Machine Model (MM) as described in JESD22-A115 should not be used as a requirement for integrated circuit ESD qualification. Only human-body model (HBM) and charged-device model (CDM) are the necessary ESD qualification test methods as specified in JESD47.

Refer to JEP172: Discontinuing Use of the Machine Model for Device ESD Qualification for more information.

Committee(s): JC-14.1

This document is a complete specification for embedded memory devices and removable memory cards using the MMC interface version 4.3. New features developed through the Electrical Joint Task Group include: Sleep mode, Boot mode and Reliable Write.

Committee(s): JC-64, JC-64.2

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JEDEC has taken the basic MMCA specification and adopted it for embedded applications, calling it (e·MMC). In addition to the packaging differences, (e·MMC) devices use a reduced voltage interface. These specifications are detailed in the JEDEC Standard for Embedded MultiMediaCard e•MMC/Card Product Standard, JESD84-Axx. The purpose of the standard is the mechanical definition of the e•MMC.

Patents(): A complete list of Assurance/Disclosure Forms is available to JEDEC members in the Members Area. Non-members can obtain individual Assurance/Disclosure Forms on request from the JEDEC office.

Committee(s): JC-64

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