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A revised and significantly expanded reference for technical writers and educators, manufacturers, buyers and users of discrete semiconductor and optoelectronic devices, is now available. This document includes extensive information on: letter symbol conventions; diodes and rectifiers (including signal, rectifier, microwave, tunnel and backward, voltage-regulator, voltage-reference, current regulator, and varactor diodes); transistors (including FETs, JFETs, and IGBTs); photosensitive devices, photoemitters, and optocouplers; thyristors and PUTs; and transient voltage suppressors. Terms and symbols, with their definitions, are arranged alphabetically by product type. Where applicable, graphical symbols are also included. The purpose of this standard is to promote the uniform use of symbols, abbreviations, terms, and definitions throughout the semiconductor industry.

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Committee(s): JC-10

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This test is used to determine the effects of bias conditions and temperature on solid state devices over time. It simulates the devices’ operating condition in an accelerated way, and is primarily for device qualification and reliability monitoring. A form of high temperature bias life using a short duration, popularly known as burn-in, may be used to screen for infant mortality related failures. The detailed use and application of burn-in is outside the scope of this document.

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Committee(s): JC-14, JC-14.1

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This standard will be useful to anyone engaged in handling semiconductor devices and integrated circuits that are subject to permanent damage due to electrostatic potentials. The standard establishes a symbol and label that will gain the attention of those persons who might inflict electrostatic damage to the device. The label which is placed on the lowest practical level of packaging contains the words 'ATTENTION - OBSERVE PRECAUTIONS FOR HANDLING ELECTROSTATIC SENSITIVE DEVICES'. The symbol contained in this label, which may be used on the device itself, shows a hand in a triangle with a bar through it. Formerly known as EIA-471.

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Committee(s): JC-14, JC-14.3

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This standard defines the input, output specifications and ac test conditions for devices that are designed to operate in the SSTL_18 logic switching range, nominally 0 V to 1.8 V. The standard may be applied to ICs operating with separate VDD and VDDQ supply voltages. The VDD value is not specified in this standard; however VDD and VDDQ will have the same voltage level in many cases.

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Committee(s): JC-16

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This standard establishes a defined method and conditions for performing a temperature-humidity life test with bias applied. The test is used to evaluate the reliability of nonhermetic packaged solid state devices in humid environments. It employs high temperature and humidity conditions to accelerate the penetration of moisture through external protective material or along interfaces between the external protective coating and conductors or other features that pass through it. This revision enhances the ability to perform this test on a device which cannot be biased to achieve very low power dissipation.

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Committee(s): JC-14, JC-14.1

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This document describes design of test structures needed to assess the reliability of aluminum-copper, refractory metal barrier interconnect systems. This includes any metal interconnect system where a refractory metal barrier or other barrier material prevents the flow of aluminum and/or copper metal ions from moving between interconnect layers. This document is not intended to show design of test structures to assess aluminum or aluminum-copper alloy systems, without barriers to Al and Cu ion movement, nor for Cu only metal systems. Some total interconnect systems might not include barrier materials on all metal layers. The structures in this standard are designed for cases where a barrier material separates two Al or Al alloy metal layers. The purpose of this document is to describe the design of test structures needed to assess electromigration (EM) and stress-induced-void (SIV) reliability of AlCu barrier metal systems.

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Committee(s): JC-14.2, JC-14.21

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This document is intended to be used by Original Component Manufacturers who deliver electronic components and Original Equipment Manufacturers who are the platform system integrators. It is intended to be applied prior to delivery by the OCMs and may be used by OEM system engineers and procuring activities as well as U.S Government Department of Defense system engineers, procuring activities and repair centers. This Standard establishes the instrumentation, techniques, criteria, and methods to be utilized to quantify the amount of Lead (Pb) in Tin-Lead (Sn/Pb) alloys and electroplated finishes containing at least 3 weight percent (wt%) Lead (Pb) using X-Ray Fluorescence (XRF) equipment.  Reaffirmed June 2023

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Committee(s): JC-13

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STAPL is a vendor- and platform-independent language for programming and testing devices via the IEEE standard 1149.1 interface, commonly known as JTAG. STAPL enables programming of designs into programmable logic devices (PLDs) offered by a variety of PLD vendors. STAPL is also suitable for testing 1149.1-compliant devices.

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Committee(s): JC-42.1

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This newly revised test method provides a procedure for measuring the temperature coefficient of resistance, TCR(T), of thin-film metallizations used in microelectronic circuits and devices. Procedures are also provided to use the TCR(T) to determine the temperature of a metallization line under Joule-heating conditions and to determine the ambient temperature where the metallization line is used as a temperature sensor. Originally, the method was intended only for aluminum-based metallizations and for other metallizations that satisfy the linear dependence and stability stipulations of the method. The method has been revised to make it explicitly applicable to copper-based metallizations, as well, and at temperatures beyond where the resistivity of copper is no longer linearly dependent on temperature (beyond approximately 200 °C). Using the TCR(T) measured for copper in the linear-dependent region, a factor is used to correct the calculated temperature at these higher temperatures.

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Committee(s): JC-14.2

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This standard details techniques for estimating the values of a two parameter lognormal distribution from complete lifetime data (all samples in an experiment have failed) or singly right-censored lifetime data (the experiment have failed) or singly right-censored lifetime data gathered from rapid stress test; however, not all types of failure data can be analyzed with these techniques.

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Committee(s): JC-14.2

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This standard specifies the standard for the measurement of small-signal transistor scattering parameters. Formerly known as RS-435 and/or EIA-435

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Committee(s): JC-25

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This method updates the standard procedure for characterizing the switching of signal or switching diodes when a step function of forward current is applied. The objective is to provide a standard so that accurate comparisons can be made. Formerly known as EIA-286-A (February 1991), ANSI/EIA-286-A-1991. Became JESD286-B after revision, February 2000.

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Committee(s): JC-22.4

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The purpose is to provide a standard of BiCMOS Logic series specifications for uniformity, multiplicity of sources, elimination of confusion, and ease of device specification and design by users.

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Committee(s): JC-40

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The purpose of this standard is to provide for uniformity, multiplicity of sources, elimination of confusion, and ease of device specification and design by users. The standard covers specifications for description of '54/74FCTXXXX' series fast CMOS TTL compatible devices.

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Committee(s): JC-40.2

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This standard defines the register support devices needed for standard height and low profile registered PC133 SDRAM DIMM modules. The objective of the standard is to clearly define the functionality, pinout and electrical characteristics required for this type of SDRAM module.

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Committee(s): JC-40

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This standard describes electrical parameters for this class of CMOS devices.

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Committee(s): JC-40.2

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The purpose is to provide a standard of BiCMOS Logic series specifications to provide for uniformity, multiplicity of sources, elimination of confusion, and ease of device specification and design by users.

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Committee(s): JC-40

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This standard provides a set of uniform data sheet parameters for the description of a single 10-bit, 2.5 V FET transmission-gate bus switch device for DDR memory module and motherboard applications. This bus switch device has a low ON resistance allowing inputs to be connected directly to outputs, with near zero propagation delay.

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Committee(s): JC-40, JC-40.2

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This standard covers specifications for a family of 3.3 V NMOS FET bus switch devices with integrated charge pumps. Not included in this document are device specific parameters and performance levels that the vendor must also supply for full device description. The purpose of this standard is to provide a set of uniform data sheet parameters for the description of bus switch devices. This standard includes required parameters, test conditions, test levels, and measurement methods for data sheet descriptions of bus switch devices.

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Committee(s): JC-40

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The purpose is to provide a standard for 2.5 V nominal supply voltage logic devices for uniformity, multiplicity of sources, elimination of confusion, ease of device specification, and ease of use. This specification provides for compatibility between devices operating between either the Standard Range of 1.8 V to 2.7 V or the optional Extended Range of 1.65 V to 2.7 V supply voltages, as well as over-voltage tolerance with devices operating at 3.6 V.

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Committee(s): JC-40

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This standard defines standard specifications of dc interface parameters, switching parameters, and test loading for definition of the CUA877 and CU2A877 PLL clock devices for registered DDR2 DIMM applications.The purpose is to provide a standard for the CUA877 and CU2A877 PLL clock devices, for uniformity, multiplicity of sources, elimination of confusion, ease of device specification, and ease of use.

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Committee(s): JC-40

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This standard defines standard specifications of dc interface parameters, switching parameters, and test loading for definition of a CUA845 PLL clock device for registered DDR2 DIMM applications.The purpose is to provide a standard for a CUA845 PLL clock device, for uniformity, multiplicity of sources, elimination of confusion, ease of device specification, and ease of use.

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Committee(s): JC-40

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This document provides a standard for describing an ISP device chain, opening up the possibility for third-party companies to provide value-added ISP software. The purpose of the Chain Description File is to describe the configuration of a programming chain made up of devices that can be connected in some serial fashion. No assumptions are made about how data is used by the device, nor about the nature or configuration of the control signals that affect programming. It will support devices configured using electrically-erasable(EE), Flash, SRAM, or any other reconfigurable cell. For devices programmed via an IEEE programmable devices in the same chain.

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Committee(s): JC-42.1

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This standard continues the voltage specification migration to the next level beyond the 1.8 V specification already established. The purpose is to provide a standard for 1.5 V nominal supply voltage CMOS logic devices, for uniformity, multiplicity of sources, elimination of confusion, ease of device specification, and ease of use.

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Committee(s): JC-40, JC-40.1

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This standard defines dc interface, switching parameters and test loading for digital logic devices based on 1.2 V (normal range) power supply levels. The purpose is to provide a standard specification for uniformity, multiplicity of sources, elimination of confusion, ease of device specification, and ease of use.

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Committee(s): JC-40

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The JESD255 document defines CRC modes supported with 8-bit aligned and 16-bit aligned data transactions. It is limited to logical bus transactions and does not cover the electrical properties of the IO bus.

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Committee(s): JC-42, JC-42.4

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This standard applies to the identification and control of Maverick Product that can occur during fabrication, assembly, packaging, or test of any electronic component. It can be implemented for an entire product line or to segregate product that has a higher probability of adversely impacting quality or reliability.

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Committee(s): JC-14, JC-14.3

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This standard defines device pinout for 1-, 2- and 3-bit wide logic functions. This pinout specifically applies to the conversion of Dual-Inline-Packaged (DIP) 1-, 2- and 3-bit logic devices to SON/QFN packaged 1-, 2- and 3-bit logic devices.

The purpose of this document is to provide a pinout standard for 1-, 2- and 3-bit logic devices offered in 5-, 6- or 8-land SON/QFN packages for uniformity, multiplicity of sources, elimination of confusion, ease of device specification, and ease of use.

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Committee(s): JC-40, JC-40.1

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Terminology Update, see Annex. This standard defines JEDEC requirements for solid state drives. For each defined class of solid state drive, the standard defines the conditions of use and the corresponding endurance verification requirements. Although endurance is to be rated based upon the standard conditions of use for the class, the standard also sets out requirements for possible additional use conditions as agreed to between manufacturer and purchaser.  Revision A includes further information on SSD Capacity. Items 303.19, 303.20, 303.21, 303.22, 303.23, 303.26, 303.27, 303.28, and 303.32

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Committee(s): JC-64.8

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