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Title	Document #	Date
ZENER AND VOLTAGE REGULATOR DIODE RATING VERIFICATION AND CHARACTERIZATION TESTING	JESD211.01	Nov 2012
This standard is applicable to diodes that are used as voltage regulators and voltage references. It describes terms and definitions and explains methods for verifying device ratings and measuring device characteristics. Committee(s): JC-22, JC-22.2 Free download. Registration or login required.
XFM DEVICE, Version 1.0	JESD233	Aug 2021
This standard specifies the mechanical and electrical characteristics of the XFM Device. Such characteristics include, among others, package dimensions, pin layout, signal assignment, power supply voltages, currents, and electrical characteristics of the PCIe interface. Committee(s): JC-64 Free download. Registration or login required.
WIRE BOND SHEAR TEST	JESD22-B116B	May 2017
This fully revised test provides a means for determining the strength of gold and copper ball bonds to a die or package bonding surface, and may be performed on pre-encapsulation or post-encapsulation parts. Pictures have been added to enhance the fail mode diagrams. The wire bond shear test is destructive. The test method can also be used to shear aluminum and copper wedge bonds to a die or package bonding surface. It is appropriate for use in process development, process control and/or quality assurance. Committee(s): JC-14, JC-14.1 Free download. Registration or login required.
Wire Bond Pull Test Methods	JESD22-B120	Nov 2022
This test method provides a means for determining the strength and failure mode of a wire bonded to, and the corresponding interconnects on, a die or package bonding surface and may be performed on pre-encapsulation or post-encapsulation devices. Committee(s): JC-14, JC-14.1 Free download. Registration or login required.
WIDE I/O SINGLE DATA RATE (WIDE I/O SDR)	JESD229	Dec 2011
This standard defines the Wide I/O specification, including features, functionality, AC and DC characteristics, packages, and micropillar signal assignments. This standard covers the following technologies: Wide I/O. The purpose of this standard is to define the minimum set of requirements for JEDEC compliant, 1 Gb through 32 Gb SDRAM (monolithic density) devices with 4, 128b wide channels using direct chip-to-chip attach methods between 1 to 4 memory devices and a controller device. Committee(s): JC-42, JC-42.6 Free download. Registration or login required.

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