Standards & Documents Search

Displaying 1 - 5 of 456 documents. Show 5 | 10 | 20 | 40 | 60 results per page.

Title	Document #	Date
Zoned Storage for UFS	JESD220-5	Nov 2023
The purpose of this standard is to describe Zoned Storage for UFS, which enables higher bandwidth, lower latency and to reduce write amplification. Patents(): Huawei 201911209032.1; 116166570,A Memory Technologies LLC 101952808 104657284 2248023 3493067 602009056490.0 602009064847.0 HK1210296 5663720 6602823 10-1281326 10-1468824 2248023 3493067 2248023 3493067 8307180 8601228 9063850 9367486 10540094 11550476 Committee(s): JC-64, JC-64.1 Free download. Registration or login required.
ZENER AND VOLTAGE REGULATOR DIODE RATING VERIFICATION AND CHARACTERIZATION TESTING	JESD211.01	Nov 2012
This standard is applicable to diodes that are used as voltage regulators and voltage references. It describes terms and definitions and explains methods for verifying device ratings and measuring device characteristics. Committee(s): JC-22, JC-22.2 Free download. Registration or login required.
XFM Device, Version 2.0	JESD233A	Dec 2023
This standard specifies the mechanical and electrical characteristics of the XFM removable memory Device. Patents(): A complete list of Assurance/Disclosure Forms is available to JEDEC members in the Members Area. Non-members can obtain individual Assurance/Disclosure Forms on request from the JEDEC office. Committee(s): JC-64, JC-64.1 Free download. Registration or login required.
WIRE BOND SHEAR TEST	JESD22-B116B	May 2017
This fully revised test provides a means for determining the strength of gold and copper ball bonds to a die or package bonding surface, and may be performed on pre-encapsulation or post-encapsulation parts. Pictures have been added to enhance the fail mode diagrams. The wire bond shear test is destructive. The test method can also be used to shear aluminum and copper wedge bonds to a die or package bonding surface. It is appropriate for use in process development, process control and/or quality assurance. Committee(s): JC-14, JC-14.1 Free download. Registration or login required.
Wire Bond Pull Test Methods	JESD22-B120.01	Sep 2024
This test method provides a means for determining the strength and failure mode of a wire bonded to, and the corresponding interconnects on, a die or package bonding surface and may be performed on pre-encapsulation or post-encapsulation devices. Committee(s): JC-14, JC-14.1 Free download. Registration or login required.

Pages

JEDEC Education Series: Memory, Mobile & Modules