Global Standards for the Microelectronics Industry
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Title | Document # |
Date![]() |
---|---|---|
High Bandwidth Memory (HBM4) DRAM |
JESD270-4 | Apr 2025 |
The HBM4 DRAM is tightly coupled to the host compute die with a distributed interface. The interface is divided into independent channels. Each channel is completely independent of one another. Channels are not necessarily synchronous to each other. The HBM4 DRAM uses a wide-interface architecture to achieve high-speed, low power operation. Each channel interface maintains a 64 bit data bus operating at double data rate (DDR). The JESD271-4 HBM4 Bump Matrix Spreadsheet will be available in early May. A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Free download. Registration or login required. |
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