Global Standards for the Microelectronics Industry
Standards & Documents Search
Title | Document # |
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LRDIMM DDR3 MEMORY BUFFER (MB) |
JESD82-30.01 | Jan 2023 |
Terminology update. The Load Reduced DIMM (LRDIMM) Memory Buffer (MB) supports DDR3 SDRAM main memory. The Memory Buffer allows buffering of memory traffic to support large memory capacities. Unlike DDR3 Register Buffer (SSTE32882), which only buffers Command, Address, Control and Clock, the LRDIMM Memory Buffer also buffers the Data (DQ) interface between the Memory Controller and the DRAM components. Free download. Registration or login required. |
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DEFINITION OF the SSTUB32866 1.8 V CONFIGURABLE REGISTERED BUFFER WITH PARITY FOR DDR2 RDIMM APPLICATIONS |
JESD82-25.01 | Jan 2023 |
Terminology update. Committee(s): JC-40 Free download. Registration or login required. |
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DDR4 REGISTERING CLOCK DRIVER (DDR4RCD02) |
JESD82-31A.01 | Jan 2023 |
Terminology update. This document defines standard specifications of DC interface parameters, switching parameters, and test loading for definition of the DDR4 Registering Clock Driver (RCD) with parity for driving address and control nets on DDR4 RDIMM and LRDIMM applications. Patents(): A complete list of Assurance/Disclosure Forms is available to JEDEC members in the Members Area. Non-members can obtain individual Assurance/Disclosure Forms on request from the JEDEC office. Committee(s): JC-40.4 Free download. Registration or login required. |
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DEFINITION OF THE SSTUB32868 REGISTERED BUFFER WITH PARITY FOR 2R x 4 DDR2 RDIMM APPLICATIONS |
JESD82-26.01 | Jan 2023 |
Terminology update. Committee(s): JC-40 Free download. Registration or login required. |
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DEFINITION OF the SSTUA32S869 AND SSTUA32D869 REGISTERED BUFFER WITH PARITY FOR DDR2 RDIMM APPLICATIONS |
JESD82-23.01 | Jan 2023 |
Terminology update. Committee(s): JC-40 Free download. Registration or login required. |
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GRAPHICS DOUBLE DATA RATE (GDDR5) SGRAM STANDARDRelease Number: C.01 - Terminology update |
JESD212C.01 | Jan 2023 |
Terminology update. Patents(): A complete list of Assurance/Disclosure Forms is available to JEDEC members in the Members Area. Non-members can obtain individual Assurance/Disclosure Forms on request from the JEDEC office. Committee(s): JC-42.3C Free download. Registration or login required. |
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FBDIMM: ADVANCED MEMORY BUFFER (AMB) |
JESD82-20A.01 | Jan 2023 |
This document is a core specification for a Fully Buffered DIMM (FBD) memory system. This document, along with the other core specifications, must be treated as a whole. Information critical to a Advanced Memory Buffer design appears in the other specifications, with specific cross-references provided. Patents(): There are known patent issues that are common to all FBDIMM related specifications. See document for link to FBDIMM Patents. Committee(s): JC-40 Free download. Registration or login required. |
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HIGH BANDWIDTH MEMORY (HBM3) DRAM |
JESD238A | Jan 2023 |
The HBM3 DRAM is tightly coupled to the host compute die with a distributed interface. The interface is divided into independent channels. Each channel is completely independent of one another. Channels are not necessarily synchronous to each other. The HBM3 DRAM uses a wide-interface architecture to achieve high-speed, low power operation. Each channel interface maintains a 64 bit data bus operating at double data rate (DDR). Patents(): A complete list of Assurance/Disclosure Forms is available to JEDEC members in the Members Area. Non-members can obtain individual Assurance/Disclosure Forms on request from the JEDEC office. Free download. Registration or login required. |
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THERMAL SHOCK |
JESD22-A106B.02 | Jan 2023 |
This test is conducted to determine the robustness of a device to sudden exposure to extreme changes in temperature and to the effect of alternate exposures to these extremes. Free download. Registration or login required. |
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STRESS-TEST-DRIVEN QUALIFICATION OF INTEGRATED CIRCUITS |
JESD47L | Dec 2022 |
This standard describes a baseline set of acceptance tests for use in qualifying electronic components as new products, a product family, or as products in a process which is being changed. Available for purchase: $87.38 Add to Cart Paying JEDEC Members may login for free access. |
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Secure Serial Flash Bus TransactionsRelease Number: Version 1.0 |
JESD254 | Dec 2022 |
This standard describes SPI bus transactions intended to support Secure Flash operation on a serial memory device. The on-chip SFDP database described in JESD216 has been revised to include details about the secure transactions. This ballot does not describe the SFDP revisions or the secure packet structure. Patents(): Infineon- US 10868679B1 and Micron- US 9009394B2 Free download. Registration or login required. |
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GUIDELINES FOR COMBINING CIE 127-2007 TOTAL FLUX MEASUREMENTS WITH THERMAL MEASUREMENTS OF LEDS WITH EXPOSED COOLING SURFACE |
JESD51-52A | Nov 2022 |
This document is intended to be used in conjunction with the JESD51-50 series of standards, especially with JESD51-51 (Implementation of the Electrical Test Method for the Measurement of Real Thermal Resistance and Impedance of Light-emitting Diodes with Exposed Cooling Surface) document. This present document focuses on the measurement of the total radiant flux of LEDs in combination with the measurement of LEDs's thermal characteristics: guidelines on the implementation of the recommendations of the CIE 127-2007 document are provided. Committee(s): JC-15 Free download. Registration or login required. |
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TEMPERATURE, BIAS, AND OPERATING LIFE |
JESD22-A108G | Nov 2022 |
This test is used to determine the effects of bias conditions and temperature on solid state devices over time. It simulates the devices’ operating condition in an accelerated way, and is primarily for device qualification and reliability monitoring. A form of high temperature bias life using a short duration, popularly known as burn-in, may be used to screen for infant mortality related failures. The detailed use and application of burn-in is outside the scope of this document. Free download. Registration or login required. |
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TEST METHODS TO CHARACTERIZE VOIDING IN PRE-SMT BALL GRID ARRAY PACKAGES |
JESD217A.01 | Nov 2022 |
This publication provides an overview of solder void types, outlines current metrologies and test methods used for pre-SMPT solder void characterization and potential limitations, and prescribes sampling strategy for data collection, and tolerance guidelines for corrective measures. Committee(s): JC-14.1 Free download. Registration or login required. |
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Customer Notification for Environmental Compliance Declaration Deviations |
JESD262 | Nov 2022 |
This standard is invoked when a supplier becomes aware that a product’s environmental compliance declaration they provided or made available to their customers had an error that might cause a customer to draw an incorrect conclusion about the compliance of the product to legal requirements. Committee(s): JC-14.4 Free download. Registration or login required. |
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OVERVIEW OF METHODOLOGIES FOR THE THERMAL MEASUREMENT OF SINGLE- AND MULTI-CHIP, SINGLE- AND MULTI-PN-JUNCTION LIGHT-EMITTING DIODES (LEDS) |
JESD51-50A | Nov 2022 |
This document provides an overview of the methodology necessary for making meaningful thermal measurements on high-power light-emitting diodes (LEDs) built on single or multiple chips with one or more pn-junctions per chip. The actual methodology components are contained in separate detailed documents. Committee(s): JC-15 Free download. Registration or login required. |
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IMPLEMENTATION OF THE ELECTRICAL TEST METHOD FOR THE MEASUREMENT OF REAL THERMAL RESISTANCE AND IMPEDANCE OF LIGHT-EMITTING DIODES WITH EXPOSED COOLING SURFACE |
JESD51-51A | Nov 2022 |
The purpose of this document is to specify, how LEDs thermal metrics and other thermally-related data are best identified by physical measurements using well established testing procedures defined for thermal testing of packaged semiconductor devices (published and maintained by JEDEC) and defined for characterization of light sources (published and maintained by CIE – the International Commission on Illumination). Committee(s): JC-15 Free download. Registration or login required. |
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Serial NOR Security Hardware Abstraction Layer |
JESD261 | Nov 2022 |
This standard provides a comprehensive definition of the NOR cryptographic security hardware abstraction layer (HAL). It also provides design guidelines and reference software to reduce design-in overhead and facilitate the second sourcing of secure memory devices. It does not attempt to standardize any other interaction to the NOR device that is not related to cryptographic security functionality within the device. Committee(s): JC-42.4 Free download. Registration or login required. |
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TERMS, DEFINITIONS AND UNITS GLOSSARY FOR LED THERMAL TESTING |
JESD51-53A | Oct 2022 |
This document provides a unified collection of the commonly used terms and definitions in the area of LED thermal measurements. The terms and definitions provided herein extend beyond those used in the JESD51 family of documents, especially in JESD51-13, in order to include other often used terms and definitions in the area of light output measurements of LEDs. Definitions, symbols and notations regarding light output measurements used here are consistent with those defined in JESD77C.01 and with those defined by CIE (International Commission on Illumination), especially in the International Lighting Vocabulary, CIE S 017/E:2011 ILV and in the CIE 127-2007 document as well as in some other relevant standards of other standardization bodies from the solid-state lighting industry, e.g., ANSI/IESNA RP 16-05. Committee(s): JC-15 Free download. Registration or login required. |
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PMIC5100 POWER MANAGEMENT IC STANDARD, Rev 1.03 |
JESD301-2 | Oct 2022 |
This standard defines the specification of interface parameters, signaling protocols, and features for PMIC devices used for memory module applications. The designation PMIC5100 refers to the device specified by this document. The purpose is to provide a standard for the PMIC5100 device for uniformity, multiplicity of sources, elimination of confusion, ease of device specification, and ease of use. Item 336.01C Committee(s): JC-40.1 Free download. Registration or login required. |
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TEST METHOD FOR ESTABLISHING X-RAY TOTAL DOSE LIMIT FOR DRAM DEVICES |
JESD22-B130 | Sep 2022 |
This test method is offered as a standardized procedure to determine the total dose limit of DRAMs by measuring its refresh time tRef degradation after the device is irradiated with an X-Ray dose. This test method is applicable to any packaged device that contains a DRAM die or any embedded DRAM structure. Some indirect test methods such as wafer level characterization of total dose induced changes in leakage of access transistors are not described in this standard but are permissible as long as a good correlation is established. Committee(s): JC-14.1 Free download. Registration or login required. |
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POD15 - 1.5 V PSEUDO OPEN DRAIN I/O |
JESD8-20A.01 | Aug 2022 |
Terminology Update. This standard defines the dc and ac single-ended (data) and differential (clock) operating conditions, I/O impedance, and the termination and calibration scheme for 1.5 V Pseudo Open Drain I/Os. The 1.5 V Pseudo Open Drain interface, also known as POD15, is primarily used to communicate with GDDR4 and GDDR5 SGRAM devices. Item 135.01 Committee(s): JC-16 Free download. Registration or login required. |
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Universal Flash Storage (UFS) File Based Optimizations (FBO) Extension, Version 1.0Status: Superseded |
JESD231 | Aug 2022 |
JESD231 was superseded by the renumbered JESD220-4 Version 1.01. Committee(s): JC-64.1 |
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DDR5 SODIMM Raw Card Annex B. Version 1.0 |
JESD309-S0-RCB | Aug 2022 |
This annex JESD309-S0-RCB, DDR5 Small Outline Dual Inline Memory Module with 0-bit ECC (EC0 SODIMM) Raw Card B Annex" defines the design detail of x8, 2 Package Ranks DDR5 NECC SODIMM. The common feature of DDR5 SODIMM such as the connector pinout can be found in the JESD309, DDR5 Small Outline Dual Inline Memory Module (SODIMM) Common Standard. Committee(s): JC-45.3 Free download. Registration or login required. |
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UNIVERSAL FLASH STORAGE, Version 4.0Status: Superseded December 2024 by JESD220G |
JESD220F | Aug 2022 |
NOTE: This document has been superseded by JESD220G published in December 2024, but remains available for reference purposes.
Committee(s): JC-64.1 Available for purchase: $369.00 Add to Cart Paying JEDEC Members may login for free access. |
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Universal Flash Storage Host Controller Interface (UFSHCI), Version 4.0Status: Superseded December 2024 by JESD223F |
JESD223E | Aug 2022 |
NOTE: This document has been superseded by JESD223F published in December 2024, but remains available for reference purposes. Committee(s): JC-64.1 Available for purchase: $163.00 Add to Cart Paying JEDEC Members may login for free access. |
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DDR5 UDIMM Raw Card Annex BRelease Number: Version 1.0 |
JESD308-U0-RCB | Jul 2022 |
This annex JESD308-U0-RCB, DDR5 Unbuffered Dual Inline Memory Module (UDIMM) Raw Card B Annex defines the design detail of x8, 2 Package Ranks DDR5 UDIMM. The common feature of DDR5 UDIMM such as the connector pinout can be found in the JESD308, DDR5 Unbuffered Dual Inline Memory Module (UDIMM) Common Standard. Item 2265.11A Committee(s): JC-45.3 Free download. Registration or login required. |
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DDR5 UDIMM Raw Card Annex ERelease Number: Version 1.0 |
JESD308-U4-RCE | Jul 2022 |
This annex JESD308-U4-RCE, DDR5 Unbuffered Dual Inline Memory Module (UDIMM) with 4-bit ECC (EC4 SODIMM) Raw Card E Annex" defines the design detail of x8, 2 Package Ranks DDR5 ECC UDIMM. The common feature of DDR5 UDIMM such as the connector pinout can be found in the JESD308, DDR5 Unbuffered Dual Inline Memory Module (UDIMM) Common Standard. Item 2265.12A Committee(s): JC-45.3 Free download. Registration or login required. |
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DDR5 UDIMM Raw Card Annex ARelease Number: Version 1.0 |
JESD308-U0-RCA | Jul 2022 |
This annex JESD308-U0-RCA, DDR5 Unbuffered Dual Inline Memory Module (UDIMM) Raw Card A Annex defines the design detail of x8, 1 Package Rank DDR5 UDIMM. The common feature of DDR5 UDIMM such as the connector pinout can be found in the JESD308, DDR5 Unbuffered Dual Inline Memory Module (UDIMM) Common Standard. Item 2265.13A Committee(s): JC-45.3 Free download. Registration or login required. |
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DDR5 UDIMM Raw Card Annex ARelease Number: Version 1.0 |
JESD308-U0-RCA | Jul 2022 |
This annex JESD308-U0-RCA, DDR5 Unbuffered Dual Inline Memory Module (UDIMM) Raw Card A Annex defines the design detail of x8, 1 Package Rank DDR5 UDIMM. The common feature of DDR5 UDIMM such as the connector pinout can be found in the JESD308, DDR5 Unbuffered Dual Inline Memory Module (UDIMM) Common Standard. Item 2265.13A Committee(s): JC-45.3 Free download. Registration or login required. |
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DDR5 UDIMM Raw Card Annex DRelease Number: Version 1.0 |
JESD308-U4-RCD | Jul 2022 |
This annex JESD308-U4-RCD, DDR5 Unbuffered Dual Inline Memory Module with 4-bit ECC (EC4 UDIMM) Raw Card D Annex defines the design detail of x8, 1 Package Rank DDR5 UDIMM with 4-bit ECC. The common feature of DDR5 UDIMM such as the connector pinout can be found in the JESD308, DDR5 Unbuffered Dual Inline Memory Module (UDIMM) Common Standard. Item 2265.14A Free download. Registration or login required. |
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DDR5 UDIMM Raw Card Annex CRelease Number: Version 1.0 |
JESD308-U0-RCC | Jul 2022 |
This annex JESD308-U0-RCC, “DDR5 Unbuffered Dual Inline Memory Module (UDIMM) Raw Card C Annex” defines the design detail of x16, 1 Package Ranks DDR5 UDIMM. The common feature of DDR5 UDIMM such as the connector pinout can be found in the JESD308, DDR5 Unbuffered Dual Inline Memory Module (UDIMM) Common Standard. Item 2265.08A Committee(s): JC-45.3 Free download. Registration or login required. |
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POD135 - 1.35 V PSEUDO OPEN DRAIN I/O |
JESD8-21C.01 | Jun 2022 |
Editorial, Terminology Update. This standard defines the dc and ac single-ended (data) and differential (clock) operating conditions, I/O impedance's, and the termination and calibration scheme for 1.35 V Pseudo Open Drain I/Os. The 1.35 V Pseudo Open Drain interface, also known as POD135, is primarily used to communicate with GDDR5 or GDDR5M SGRAM devices. Item 146.01B Committee(s): JC-16 Free download. Registration or login required. |
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POD125 - 1.25 V PSEUDO OPEN DRAIN I/O |
JESD8-30A.01 | Jun 2022 |
Editorial Terminology Update. This standard defines the DC and AC single-ended (data) and differential (clock) operating conditions, I/O impedances, and the termination and calibration scheme for 1.25 V Pseudo Open Drain I/Os. The 1.25 V Pseudo Open Drain interface, also known as POD125, is primarily used to communicate with GDDR6 SGRAM devices. Committee(s): JC-16 Free download. Registration or login required. |
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DDR5 SODIMM Raw Card Annex E |
JESD309-S4-RCE | Jun 2022 |
This annex JESD309-S4-RCE, DDR5 Small Outline Dual Inline Memory Module with 4-bit ECC (EC4SODIMM) Raw Card E Annex" defines the design detail of x8, 2 Package Ranks DDR5 ECC SODIMM. The common feature of DDR5 SODIMM such as the connector pinout can be found in the JESD309, DDR5 Small Outline Dual Inline Memory Module (SODIMM) Common Standard. Free download. Registration or login required. |
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DDR5 SODIMM Raw Card Annex A Version 1 |
JESD309-S0-RCA | Jun 2022 |
This annex JESD309-S0-RCA, DDR5 Small Outline Dual Inline Memory Module (SODIMM) Raw Card A Annex defines the design detail of x8, 1 Package Rank DDR5 SODIMM. The common feature of DDR5 SODIMM such as the connector pinout can be found in the JESD309, DDR5 Small Outline Dual Inline Memory Module (SODIMM) Common Standard. Free download. Registration or login required. |
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DDR5 SODIMM Raw Card Annex C Version 1 |
JESD309-S0-RCC | Jun 2022 |
This annex JESD309-S0-RCC, DDR5 Small Outline Dual Inline Memory Module (SODIMM) Raw Card Free download. Registration or login required. |
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DDR5 SODIMM Raw Card Annex D Version 1.0 |
JESD309-S4-RCD | Jun 2022 |
This annex JESD309-S4-RCD, DDR5 Small Outline Dual Inline Memory Module with 4-bit ECC (EC4 SODIMM) Raw Card D Annex defines the design detail of x8, 1 Package Rank DDR5 SODIMM with 4-bit ECC. The common feature of DDR5 SODIMM such as the connector pinout can be found in the JESD309, DDR5 Small Outline Dual Inline Memory Module (SODIMM) Common Standard. Committee(s): JC-45.3 Free download. Registration or login required. |
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SOLID-STATE DRIVE (SSD) ENDURANCE WORKLOADS |
JESD219A.01 | Jun 2022 |
Terminology update, see Annex. This standard defines workloads for the endurance rating and endurance verification of SSD application classes. These workloads shall be used in conjunction with the Solid State Drive (SSD) Requirements and Endurance Test Method standard, JESD218. Also see JESD219A_MT and JESD219A_TT for the supporting trace files. Free download. Registration or login required. |
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DDR5 Small Outline Dual Inline Memory Module (SODIMM) Common Standard |
JESD309 | May 2022 |
This standard defines the electrical and mechanical requirements for 262-pin, 1.1 V (VDD), Small Outline, Double Data Rate, Synchronous DRAM Dual In-Line Memory Modules (DDR5 SDRAM SODIMMs). These DDR5 SODIMMs are intended for use as main memory when installed in Computers, laptops and other systems. Item 2262.06B Free download. Registration or login required. |