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Title	Document #	Date
MEASUREMENT METHOD FOR THERMAL RESISTANCE OF BRIDGE RECTIFIER ASSEMBLIES: RESCINDED, June 2002. Replaced by JESD282-B. Status: RescindedJune 2002	JESD45	Dec 1994
Committee(s): JC-22.2 Free download. Registration or login required.
REVERSE RECOVERY CHARACTERISTICS OF SILICON DIODES: RESCINDED June 2002. Status: Rescinded	JESD41	May 1995
Committee(s): JC-22.1 Free download. Registration or login required.
ADDENDUM No. 6 to JESD8 - HIGH SPEED TRANSCEIVER LOGIC (HSTL)- A 1.5 V OUTPUT BUFFER SUPPLY VOLTAGE BASED INTERFACE STANDARD FOR DIGITAL INTEGRATED CIRCUITS:	JESD8-6	Aug 1995
This standard is a 1.5 volt high performance CMOS-based interface document suitable for high I/O count CMOS and BiCMOS devices operating at frequencies in excess of 200 Mhz. Committee(s): JC-16 Free download. Registration or login required.
ADDENDUM No. 1 to JESD35, GENERAL GUIDELINES FOR DESIGNING TEST STRUCTURES FOR THE WAFER-LEVEL TESTING OF THIN DIELECTRICS Status: Rescinded	JESD35-1	Sep 1995
JESD35-1 was rescinded by the committee in June 2024 and has been superseded by JESD263. This addendum expands the usefulness of the Standard 35 (JESD35) by detailing the various sources of measurement error that could effect the test results obtained by the ramped tests described in JESD35. Each source of error is described and its implications on test structure design is noted. This addendum can be used as a guide when designing test structures for the qualification and characterization of thin oxide reliability, specifically, by implementing accelerated voltage or current ramp tests. Committee(s): JC-14.2
MOISTURE-INDUCED STRESS SENSITIVITY FOR PLASTIC SURFACE MOUNT DEVICES - SUPERSEDED BY J-STD-020A, April 1999. Status: Rescinded, May 2000	JESD22-A112-A	Nov 1995
J-STD-020 is now on revision F. Committee(s): JC-14, JC-14.1 Free download. Registration or login required.
STANDARD FOR DESCRIPTION OF LOW VOLTAGE TTL-COMPATIBLE CMOS LOGIC DEVICES:	JESD52	Nov 1995
This standard describes dc interface specifications and test environment for these devices that operate with 2.7 V to 3.6 V power supplies. The goal is to provide a consistent set of dc specifications for reference by logic suppliers and users alike. Committee(s): JC-40 Free download. Registration or login required.
STANDARD FOR FAILURE ANALYSIS REPORT FORMAT: Status: Rescinded January 2025	JESD38	Dec 1995
This standard is to promote unification of content and format of semiconductor device failure-analysis reports so that reports from diverse laboratories may be easily read, compared, and understood by customers. Additional objectives are to ensure that reports can be easily ready by users, satisfactorily reproduced on copying machines, adequately transmitted by telefax, and conveniently stored in standard filing cabinets. Committee(s): JC-14.4 Free download. Registration or login required.
METHODOLOGY FOR THE THERMAL MEASUREMENT OF COMPONENT PACKAGES (SINGLE SEMICONDUCTOR DEVICE)	JESD51	Dec 1995
This standard and its subsequent addendum's, provides a standard for thermal measurement that, if followed fully, will provide correct and meaningful data that will allow for determination of junction temperature for specific conditions. The data can be used for package design evaluation, device characterization and reliability predictions. Committee(s): JC-15, JC-15.1 Free download. Registration or login required.
INTEGRATED CIRCUIT THERMAL MEASUREMENT METHOD - ELECTRICAL TEST METHOD (SINGLE SEMICONDUCTOR DEVICE):	JESD51- 1	Dec 1995
The purpose of this test method is to define a standard Electrical Test Method (ETM) that can be used to determine the thermal characteristics of single integrated circuit devices housed in some form of electrical package. This method will provide a basis for comparison of different devices housed in the same electronic package or similar devices housed in different electronic packages. Committee(s): JC-15.1 Free download. Registration or login required.
MANAGEMENT OF COMPONENT OBSOLESCENCE BY GOVERNMENT CONTRACTORS: RESCINDED, October 2002 Status: RescindedOctober 2002	JESD53	Jan 1996
Committee(s): JC-13, JC-13.2 Free download. Registration or login required.

Standards & Documents Search

MEASUREMENT METHOD FOR THERMAL RESISTANCE OF BRIDGE RECTIFIER ASSEMBLIES: RESCINDED, June 2002. Replaced by JESD282-B.

REVERSE RECOVERY CHARACTERISTICS OF SILICON DIODES: RESCINDED June 2002.

ADDENDUM No. 6 to JESD8 - HIGH SPEED TRANSCEIVER LOGIC (HSTL)- A 1.5 V OUTPUT BUFFER SUPPLY VOLTAGE BASED INTERFACE STANDARD FOR DIGITAL INTEGRATED CIRCUITS:

ADDENDUM No. 1 to JESD35, GENERAL GUIDELINES FOR DESIGNING TEST STRUCTURES FOR THE WAFER-LEVEL TESTING OF THIN DIELECTRICS

MOISTURE-INDUCED STRESS SENSITIVITY FOR PLASTIC SURFACE MOUNT DEVICES - SUPERSEDED BY J-STD-020A, April 1999.

STANDARD FOR DESCRIPTION OF LOW VOLTAGE TTL-COMPATIBLE CMOS LOGIC DEVICES:

STANDARD FOR FAILURE ANALYSIS REPORT FORMAT:

METHODOLOGY FOR THE THERMAL MEASUREMENT OF COMPONENT PACKAGES (SINGLE SEMICONDUCTOR DEVICE)

INTEGRATED CIRCUIT THERMAL MEASUREMENT METHOD - ELECTRICAL TEST METHOD (SINGLE SEMICONDUCTOR DEVICE):

MANAGEMENT OF COMPONENT OBSOLESCENCE BY GOVERNMENT CONTRACTORS: RESCINDED, October 2002

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