Global Standards for the Microelectronics Industry
Standards & Documents Search
Title | Document # |
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MEASUREMENT OF TRANSISTOR NOISE FIGURE AT MF, HF, AND VHFStatus: ReaffirmedApril 1999, March 2009 |
JESD311A | Nov 1981 |
This standard describes a test method for measurement of transistor noise figure and effective input noise temperature at MF, HF, and VHF. This standard also adds the necessary information to make 'effective input noise temperature measurements'. This method is a revision of EIA-311 and incorporates material previously found in EIA-283, Test Method for Transistor Noise Figure Measurements at Medium Frequencies, Rescinded November 1981. Formerly known as RS-311 and/or EIA-311-A.
Committee(s): JC-25 Free download. Registration or login required. |
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DESIGNATION SYSTEM FOR SEMICONDUCTOR DEVICES:Status: Reaffirmed November 1995, November 1999, May 2003 |
JESD370B | Feb 1982 |
This standard includes several new items and has been completely rewritten from the original EIA-370. The first is a new letter symbol C so that a JEDEC type designation may now be 2C1234, to indicate that a chip is being designated that if it were properly mounted on the package registered for the 2N1234, it would display characteristics similar to those of the 2N1234. The second major addition is the method for assigning the first numeric symbol for type designations of optoelectronic devices. ANSI/EIA-370-B-1992. Committee(s): JC-10 Free download. Registration or login required. |
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MEASUREMENT OF TEMPERATURE COEFFICIENT OF VOLTAGE REGULATOR DIODES:Status: ReaffirmedApril 1999, April 2002 |
JESD5 | Feb 1982 |
This standard is designed to define voltage-temperature characteristic measurement techniques and a method of calculation. Although many methods could be defined, this method provides a desired uniformity and lends itself to production testing. Formerly JEDEC Suggested Standard No. 5A Committee(s): JC-22.4 Free download. Registration or login required. |
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LEADLESS CHIP CARRIER PINOUTS STANDARDIZED FOR LINEARS: |
JESD1 | Apr 1982 |
This standard shows how to convert existing DIP pinouts for op-amps, comparators, and D/A converters, to chip carrier packages. Committee(s): JC-41 Free download. Registration or login required. |
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TEST METHODS AND CHARACTER DESIGNATION FOR LIQUID CRYSTAL DEVICES: |
JESD23 | May 1982 |
This standard specifies a collection of procedures for testing and character designation of liquid crystal devices. Free download. Registration or login required. |
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ADDENDUM No. 7 to JESD24 - COMMUTATING DIODE SAFE OPERATING AREA TEST PROCEDURE FOR MEASURING dv/dt DURING REVERSE RECOVERY OF POWER TRANSISTORS:Status: ReaffirmedOctober 2002 |
JESD24- 7 | Aug 1982 |
Defines methods for verifying the diode recovery stress capability of power transistors. Committee(s): JC-25 Free download. Registration or login required. |
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DIGITAL BIPOLAR LOGIC PINOUTS FOR CHIP CARRIERS: |
JESD2 | Dec 1982 |
This standard provides a chip carrier format for digital devices by defining pin functions and locations for 20, 38, 44, 52, and 68-terminal devices. Committee(s): JC-40.1 Free download. Registration or login required. |
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DEFINITION OF EXTERNAL CLEARANCE AND CREEPAGE DISTANCES OF DISCRETE SEMICONDUCTOR PACKAGES FOR THYRISTORS AND RECTIFIER DIODES:Status: ReaffirmedJanuary 1991, April 1999, April 2002, November 2011 |
JESD4 | Nov 1983 |
This standard defines reference distances between terminals of the device and the external package at specific voltages. Committee(s): JC-22.2 Free download. Registration or login required. |
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LIST OF PREFERRED VALUES FOR USE ON VARIOUS TYPES OF SMALL SIGNAL AND REGULATOR DIODESStatus: ReaffirmedApril 1999, April 2002 |
JESD482-A | Aug 1984 |
This standard specifies preferred values to be used on signal and regulator diodes. It will facilitate the standardization for nominal values used on small signal regulator diodes previously established in JEDEC Suggested Standard No. 2. Formerly known as EIA-482-A Committee(s): JC-22.4 Free download. Registration or login required. |
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CHIP CARRIER PINOUTS STANDARDIZED FOR CMOS 4000, HC AND HCT SERIES OF LOGIC CIRCUITS: |
JESD11 | Dec 1984 |
This standard indicates the procedures used to convert existing DIP and flat packages for digital parts (SSI & MSI) to chip carrier packages. Committee(s): JC-40.2 Free download. Registration or login required. |