Global Standards for the Microelectronics Industry
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Displaying 1 - 4 of 4 documents.
Title | Document # |
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BALL GRID ARRAY PINOUTS STANDARDIZED FOR 16-BIT LOGIC FUNCTIONS: |
JESD75-2 | Jul 2001 |
This standard provides a pinout standard for 16-bit wide logic devices offered in a 56-ball areagrid array package to provide for uniformity, multiplicity of sources, elimination of confusion,ease of device specification, and ease of use. Committee(s): JC-40 Free download. Registration or login required. |
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BALL GRID ARRAY PINOUTS STANDARDIZED FOR 8-BIT LOGIC FUNCTIONS: |
JESD75-3 | Jul 2001 |
This standard provides a pinout standard for 8-bit logic devices offered in a 20-ball area gridarray package to provide for uniformity, multiplicity of sources, elimination of confusion, ease of device specification, and ease of use. Committee(s): JC-40 Free download. Registration or login required. |
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BALL GRID ARRAY PINOUTS STANDARDIZED FOR 16, 18, AND 20-BIT LOGIC FUNCTIONS USING A 54 BALL PACKAGE: |
JESD75-1 | Oct 2001 |
This standard establishes a 54 Ball Grid Array pinout for 16, 18 and 20-bit standard logic devices that are currently being produced in 48 and 56 Pin SSOP and TSSOP packages. The 54 Ball Grid Array Package is organized as a 6 x 9 array with balls on a .8mm x .8mm grid pitch. Committee(s): JC-40 Free download. Registration or login required. |
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BALL GRID ARRAY PINOUT FOR 1-, 2-, AND 3-BIT LOGIC FUNCTIONS: |
JESD75-4 | Mar 2004 |
This standard defines device pinout for 1-, 2- and 3-bit wide logic functions. This pinout specifically applies to the conversion of Dual-Inline-Packaged (DIP) 1-, 2- and 3-bit logic devices to DSBGA-packaged 1-, 2- and 3-bit logic devices. Committee(s): JC-40 Free download. Registration or login required. |