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Title	Document #	Date
Power Cycling	JESD22-A122B	Nov 2023
This Test Method establishes a uniform method for performing solid state device package power cycling stress test. Committee(s): JC-14, JC-14.1 Free download. Registration or login required.
Package Warpage Measurement of Surface-Mount Integrated Circuits at Elevated Temperature	JESD22-B112C	Nov 2023
This test method is to measure the deviation from uniform flatness of an integrated circuit package body for the range of thermal conditions experienced during the surface-mount soldering operation. Committee(s): JC-14, JC-14.1 Free download. Registration or login required.
IC LATCH-UP TEST	JESD78F.02	Nov 2023
This standard establishes the procedure for testing, evaluation and classification of devices and microcircuits according to their susceptibility (sensitivity) to damage or degradation by exposure to a defined latch-up stress. This standard has been adopted by the Defense Logistics Agency (DLA) as project 5962-1880. Committee(s): JC-14, JC-14.1 Free download. Registration or login required.
Test Method for Total Ionizing Dose (TID) from X-ray Exposure in Terrestrial Applications	JESD22-B121	Nov 2023
This test method covers X-ray imaging for terrestrial applications on packaged devices. Committee(s): JC-14, JC-14.1 Free download. Registration or login required.
Statistical Process Control Systems	JESD557D	May 2023
This standard specifies the general requirements of a statistical process control (SPC) system. This is a revision of JESD557C. Committee(s): JC-14 Free download. Registration or login required.

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