Global Standards for the Microelectronics Industry
Standards & Documents Search
Title |
Document # | Date |
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Board Level Drop Test Method of Components for Handheld Electronic Products |
JESD22-B111A.01 | Jun 2024 |
This Test Method standardizes the test board and test methodology to provide a reproducible assessment of the drop test performance of surface mounted components. Free download. Registration or login required. |
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COMPONENT PROBLEM ANALYSIS AND CORRECTIVE ACTION REQUIREMENTS - SUPERSEDED BY EIA-671, November 1996.Status: Superseded |
JESD43 | Nov 1996 |
Committee(s): JC-14.4 Free download. Registration or login required. |
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CONSTANT-TEMPERATURE AGING METHOD TO CHARACTERIZE COPPER INTERCONNECT METALLIZATIONS FOR STRESS-INDUCED VOIDING |
JESD214.01 | Aug 2017 |
This document describes a constant temperature (isothermal) aging method for testing copper (Cu) metallization test structures on microelectronics wafers for susceptibility to stress-induced voiding (SIV). This method is to be conducted primarily at the wafer level of production during technology development, and the results are to be used for lifetime prediction and failure analysis. Under some conditions, the method may be applied to package-level testing. This method is not intended to check production lots for shipment, because of the long test time. Committee(s): JC-14.2 Free download. Registration or login required. |
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COPLANARITY TEST FOR SURFACE-MOUNT SEMICONDUCTOR DEVICESStatus: Reaffirmed February 2023 |
JESD22-B108B | Sep 2010 |
The purpose of this test is to measure the deviation of the terminals (leads or solder balls) from coplanarity at room temperature for surface-mount semiconductor devices. This test method is applicable for inspection and device characterization. If package warpage or coplanarity is to be characterized at reflow soldering temperatures, then JESD22-B112 should be used. Free download. Registration or login required. |
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Customer Notification for Environmental Compliance Declaration Deviations |
JESD262 | Nov 2022 |
This standard is invoked when a supplier becomes aware that a product’s environmental compliance declaration they provided or made available to their customers had an error that might cause a customer to draw an incorrect conclusion about the compliance of the product to legal requirements. Committee(s): JC-14.4 Free download. Registration or login required. |
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