Global Standards for the Microelectronics Industry
Standards & Documents Search
Title | Document # | Date |
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CERAMIC PACKAGE SPECIFICATION FOR MICROELECTRONIC PACKAGES - SUPERSEDED BY JESD9B, May 2011.Status: Rescinded, May 2011 |
JESD27 | Aug 1993 |
The intent of this standard is to be a guide in the manufacture and procurement of ceramic packages, especially for the hybrid industry. Manufacturers or ceramic packages and procuring activities for these packages will now be able to use this document as the means for agreement in the imposition of minimum requirements in qualification, screening, and quality conformance. Free download. Registration or login required. |
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GENERAL SPECIFICATION FOR PLASTIC ENCAPSULATED MICROCIRCUITS FOR USE IN RUGGED APPLICATIONS - RESCINDED, July 2001Status: Rescinded |
JESD26-A | Apr 1990 |
Committee(s): JC-13.2 Free download. Registration or login required. |
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GENERAL STANDARD FOR STATISTICAL PROCESS CONTROL (SPC) - SUPERSEDED by EIA-557-AStatus: Rescinded |
JESD19 | Jul 1988 |
Committee(s): JC-13 Free download. Registration or login required. |
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STANDARD TEST PROCEDURE FOR NOISE MARGIN MEASUREMENTS FOR SEMICONDUCTOR LOGIC GATING MICROCIRCUITSStatus: Rescinded, October 2008 |
JESD390A | Feb 1981 |
Reaffirmed September 2003 Free download. Registration or login required. |
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